the bodies being arranged on opposite sides of a substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16141the bodies being arranged on opposite sides of a substrate

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Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,721,882
- Issue date Aug 8, 2023
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,594,524
- Issue date Feb 28, 2023
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of through silicon vias on double sided interco...
- Patent number 11,251,156
- Issue date Feb 15, 2022
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided radio-frequency package with overmold structure
- Patent number 11,127,690
- Issue date Sep 21, 2021
- Skyworks Solutions, Inc.
- Howard E. Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of light-emitting diode package structure
- Patent number 10,886,264
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 10,847,869
- Issue date Nov 24, 2020
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode package structure and manufacturing method the...
- Patent number 10,700,049
- Issue date Jun 30, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided radio-frequency package with overmold structure
- Patent number 10,607,944
- Issue date Mar 31, 2020
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,757
- Issue date Mar 24, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,269,765
- Issue date Apr 23, 2019
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with modified current distribution
- Patent number 10,037,983
- Issue date Jul 31, 2018
- Micron Technology, Inc.
- Shizhong Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module adapted to be inserted into connector of exter...
- Patent number 10,008,488
- Issue date Jun 26, 2018
- Samsung Electronics Co., Inc.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate with buried substrate having linear conductors
- Patent number 9,960,120
- Issue date May 1, 2018
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,887,176
- Issue date Feb 6, 2018
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 8,692,386
- Issue date Apr 8, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230420344
- Publication date Dec 28, 2023
- NOVATEK MICROELECTRONICS CORP.
- Hsueh-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
- Publication number 20220130803
- Publication date Apr 28, 2022
- Intel Corporation
- Brennen K. MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE
- Publication number 20200266181
- Publication date Aug 20, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200212007
- Publication date Jul 2, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...
- Publication number 20200091116
- Publication date Mar 19, 2020
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20200075564
- Publication date Mar 5, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20190206838
- Publication date Jul 4, 2019
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
- Publication number 20180358685
- Publication date Dec 13, 2018
- MEDIATEK INC.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...
- Publication number 20180323174
- Publication date Nov 8, 2018
- Intel Corporation
- Brennen K. MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20180114774
- Publication date Apr 26, 2018
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY DEVICE WITH DUAL-SIDED OVERMOLD STRUCTURE
- Publication number 20180096950
- Publication date Apr 5, 2018
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE AND SEMICONDUCTOR MODULE
- Publication number 20170309606
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Yongkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MODIFIED CURRENT DISTRIBUTION
- Publication number 20170133359
- Publication date May 11, 2017
- Micron Technology, Inc.
- Shizhong Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20170125377
- Publication date May 4, 2017
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20120193782
- Publication date Aug 2, 2012
- Fujitsu Limited
- Toshiya Akamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the bodies being arranged on opposite sides of a substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to dual-sided radio-frequency package w...

Semiconductor package having discrete antenna device

Fabrication and use of through silicon vias on double sided interco...

Fabrication and use of through silicon vias on double sided interco...

Dual-sided radio-frequency package with overmold structure

Manufacturing method of light-emitting diode package structure

Semiconductor package having discrete antenna device

Light-emitting diode package structure and manufacturing method the...

Dual-sided radio-frequency package with overmold structure

Semiconductor method for forming semiconductor structure having bum...

Semiconductor package

Semiconductor structure having bump on tilting upper corner surface

Semiconductor package

Semiconductor device with modified current distribution

Semiconductor module adapted to be inserted into connector of exter...

Wiring substrate with buried substrate having linear conductors

Semiconductor package

Semiconductor device, method of manufacturing semiconductor device,...

Patents Applicationslast 30 patents

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

SEMICONDUCTOR APPARATUS

FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...

MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Semiconductor Package

3-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACT...

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

Semiconductor Package

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE

FABRICATION AND USE OF THROUGH SILICON VIAS ON DOUBLE SIDED INTERCO...

Semiconductor Package

RADIO-FREQUENCY DEVICE WITH DUAL-SIDED OVERMOLD STRUCTURE

MODULE SUBSTRATE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE WITH MODIFIED CURRENT DISTRIBUTION

Semiconductor Package

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...