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H01L2224/08145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08145the bodies being stacked

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device manufacturing method
- Patent number 12,261,161
- Issue date Mar 25, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,261,149
- Issue date Mar 25, 2025
- Powerchip Semiconductor Manufacturing Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mirror image of geometrical patterns in stacked integrated circuit...
- Patent number 12,255,178
- Issue date Mar 18, 2025
- Mellanox Technologies, Ltd.
- Ido Bourstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,250,830
- Issue date Mar 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,249,531
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device including an optical path structure aligned to an o...
- Patent number 12,248,178
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,237,283
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor die
- Patent number 12,237,355
- Issue date Feb 25, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Danqing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,237,303
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution str...
- Patent number 12,237,318
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent multi-bit self-referenced read of programmable resistanc...
- Patent number 12,237,010
- Issue date Feb 25, 2025
- SanDisk Technologies, Inc.
- Nathan Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising dummy feature interposed between...
- Patent number 12,237,284
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device for increasing reliability of data detect...
- Patent number 12,230,330
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Myeongwoo Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device
- Patent number 12,230,331
- Issue date Feb 18, 2025
- Kioxia Corporation
- Hiroshi Maejima
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices having cell over periphery structure, memory package...
- Patent number 12,224,277
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Yonghyuk Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Image display device manufacturing method and image display device
- Patent number 12,224,273
- Issue date Feb 11, 2025
- Nichia Corporation
- Hajime Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
- Patent number 12,224,274
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20250096047
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YEONGSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096152
- Publication date Mar 20, 2025
- SK HYNIX INC.
- Rho Gyu KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250098141
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Mutsumi OKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20250098172
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Hak Seon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250096218
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY
- Publication number 20250095753
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- George Kakuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES FOR DIES
- Publication number 20250096191
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE
- Publication number 20250096208
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jeongoh HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...
- Publication number 20250098179
- Publication date Mar 20, 2025
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250098180
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Ki Nam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS
- Publication number 20250098182
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087651
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20250087634
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH DTCS ON OTHER DEVICE DIES AND METHODS OF FORMING THE...
- Publication number 20250087639
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE SUPPORTING VEHICLE STATUS MODE, OPERATING METHOD OF M...
- Publication number 20250086106
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Byungsue JUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20250089253
- Publication date Mar 13, 2025
- KIOXIA Corporation
- Ryusuke KON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20250089257
- Publication date Mar 13, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICES
- Publication number 20250085472
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...
- Publication number 20250087632
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ENERGY AND SMALL FORM FACTOR PACKAGE
- Publication number 20250087640
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Mustafa BADAROGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250087531
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250087555
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087593
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Juil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250087600
- Publication date Mar 13, 2025
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250087605
- Publication date Mar 13, 2025
- STMicroelectronics International N.V.
- Antoine Le Ravallec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087607
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- HYEONMIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...
- Publication number 20250079357
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079362
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Young Kun Jee
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing substrate layered body and layered body

Optoelectronic device manufacturing method

Manufacturing method of semiconductor structure

Semiconductor device with composite conductive features and method...

Structure and method for isolation of bit-line drivers for a three-...

Mirror image of geometrical patterns in stacked integrated circuit...

Methods for forming three-dimensional memory devices

Semiconductor structure and manufacturing method thereof

3D semiconductor memory devices and structures

Integrated structure with bifunctional routing and assembly compris...

Method for forming semiconductor structure

Packaged device including an optical path structure aligned to an o...

Devices, systems, and methods for stacked die packages

Offset pads over TSV

Integrated circuit semiconductor device

Semiconductor structure and method for manufacturing the same

Semiconductor device and semiconductor die

Vertically mounted die groups

Display substrate, tiled display panel and display device

Method for fabricating semiconductor device with redistribution str...

Concurrent multi-bit self-referenced read of programmable resistanc...

Semiconductor package

Semiconductor structure comprising dummy feature interposed between...

Semiconductor device and method of manufacturing the same

Nonvolatile memory device for increasing reliability of data detect...

Memory device

Memory devices having cell over periphery structure, memory package...

Image display device manufacturing method and image display device

Micro light-emitting diode display panel and manufacturing method t...

Stacked semiconductor device assembly in computer system

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY

DIRECT BONDING METHODS AND STRUCTURES FOR DIES

SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE

MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

3D MEMORY DEVICES AND STRUCTURES WITH MEMORY ARRAYS AND METAL LAYERS

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THE SAME

PACKAGES WITH DTCS ON OTHER DEVICE DIES AND METHODS OF FORMING THE...

MEMORY DEVICE SUPPORTING VEHICLE STATUS MODE, OPERATING METHOD OF M...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

OPTICAL DEVICES

VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...

LOW ENERGY AND SMALL FORM FACTOR PACKAGE

SEMICONDUCTOR CHIP STRUCTURE

DIE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME