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H01L2224/08145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08145the bodies being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory devices having cell over periphery structure, memory package...
- Patent number 12,224,277
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Yonghyuk Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Image display device manufacturing method and image display device
- Patent number 12,224,273
- Issue date Feb 11, 2025
- Nichia Corporation
- Hajime Akimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
- Patent number 12,224,274
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 12,224,262
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
United states 3D memory semiconductor devices and structures with m...
- Patent number 12,225,727
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,218,086
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yongbum Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of forming thereof
- Patent number 12,218,089
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with conductive feature and method of forming same
- Patent number 12,211,809
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for fabricating semiconduct...
- Patent number 12,211,812
- Issue date Jan 28, 2025
- Kioxia Corporation
- Yuanting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,211,830
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Chanho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent write to programmable resistance memory cells in cross-p...
- Patent number 12,205,638
- Issue date Jan 21, 2025
- SANDISK TECHNOLOGIES LLC
- Nathan Franklin
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,205,937
- Issue date Jan 21, 2025
- LG Electronics Inc.
- Taehoon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Memory device and method for determining start point and end point...
- Patent number 12,205,656
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Dobin Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit including backside conductive vias
- Patent number 12,205,997
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a structure for higher integration
- Patent number 12,199,123
- Issue date Jan 14, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiya Hagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer system, memory device formed on a wafer on wafer stack in...
- Patent number 12,189,954
- Issue date Jan 7, 2025
- WHALECHIP CO., LTD.
- Kun-Hua Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including separation patterns and an electroni...
- Patent number 12,193,232
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- JoongShik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
- Publication number 20250054888
- Publication date Feb 13, 2025
- Huawei Technologies Co., Ltd
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE-DIMENSIONAL MEMORY STACKING
- Publication number 20250054911
- Publication date Feb 13, 2025
- Meta Platforms Technologies, LLC
- Huichu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated transceiver array
- Publication number 20250054930
- Publication date Feb 13, 2025
- Apple Inc.
- Shingo Mandai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
- Publication number 20250054830
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Riki KAJIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
- Publication number 20250054844
- Publication date Feb 13, 2025
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054889
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jinhee HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM MEMORY DEVICE WITH XTACKING ARCHITECTURE
- Publication number 20250054890
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Lei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES
- Publication number 20250056793
- Publication date Feb 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhaoyun TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-UNIFORM MEMORY ACCESS ON THREE-DIMENSIO...
- Publication number 20250056815
- Publication date Feb 13, 2025
- Meta Platforms Technologies, LLC
- Lita Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...
- Publication number 20250054871
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250044510
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
- Publication number 20250048630
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...
- Publication number 20250046711
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250046740
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jubin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Front-to-Front Stacked Chips
- Publication number 20250046756
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VO...
- Publication number 20250048637
- Publication date Feb 6, 2025
- Western Digital Technologies, Inc.
- Hiroki Yabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCK...
- Publication number 20250048641
- Publication date Feb 6, 2025
- Western Digital Technologies, Inc.
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250048654
- Publication date Feb 6, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250046739
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CON...
- Publication number 20250046678
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING DEVICE
- Publication number 20250048938
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Hayato GOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250040153
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUN-MOOK CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250038073
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Han SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNING METHOD, SEMICONDUCTOR DEVICE, AND MASK SET
- Publication number 20250038140
- Publication date Jan 30, 2025
- KIOXIA Corporation
- Atsushi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250040176
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Youngtaek Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE DYNAMIC RANDOM ACCESS MEMORY
- Publication number 20250038162
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20250038064
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory devices having cell over periphery structure, memory package...

Image display device manufacturing method and image display device

Micro light-emitting diode display panel and manufacturing method t...

Stacked semiconductor device assembly in computer system

Substrate bonding apparatus and method of manufacturing semiconduct...

United states 3D memory semiconductor devices and structures with m...

Semiconductor package and method of manufacturing same

Bonding to alignment marks with dummy alignment marks

Semiconductor device with composite conductive features and method...

Packaged semiconductor device and method of forming thereof

Package structure for heat dissipation

Structure with conductive feature and method of forming same

Semiconductor device with redistribution structure

Semiconductor storage device and method for fabricating semiconduct...

Integrated circuit device

Semiconductor structure and manufacturing method thereof

TSV as pad

Semiconductor device assemblies including monolithic silicon struct...

Concurrent write to programmable resistance memory cells in cross-p...

Integrated circuit test method and structure thereof

Oversized via as through-substrate-via (TSV) stop layer

Display device

Memory device and method for determining start point and end point...

Integrated circuit including backside conductive vias

Method of direct-bonded optoelectronic devices

Methods of forming microelectronic device assemblies and packages

Semiconductor device including a structure for higher integration

Computer system, memory device formed on a wafer on wafer stack in...

Semiconductor device including separation patterns and an electroni...

Manufacturing method of three-dimensional stacking structure

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...

SYSTEMS AND METHODS FOR THREE-DIMENSIONAL MEMORY STACKING

Integrated transceiver array

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...

LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...

SEMICONDUCTOR PACKAGE

DRAM MEMORY DEVICE WITH XTACKING ARCHITECTURE

MANAGING THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES

SYSTEMS AND METHODS FOR NON-UNIFORM MEMORY ACCESS ON THREE-DIMENSIO...

SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF

LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...

SEMICONDUCTOR CHIP STRUCTURE

Interconnect Structure for Front-to-Front Stacked Chips

APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VO...

MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCK...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

Heat Dissipating Structure and Methods of Forming The Same

SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CON...

COMPUTING DEVICE

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

DESIGNING METHOD, SEMICONDUCTOR DEVICE, AND MASK SET

SEMICONDUCTOR DEVICE

NON-VOLATILE DYNAMIC RANDOM ACCESS MEMORY

CHIP-ON-FILM PACKAGE