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SOLID-STATE IMAGING DEVICE
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Publication number 20240153981
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Publication date May 9, 2024
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Sony Semiconductor Solutions Corporation
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Hidetoshi OISHI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240153898
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Publication date May 9, 2024
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Samsung Electronics Co., Ltd.
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Minseung JI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR MEMORY DEVICE
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Publication number 20240155829
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Publication date May 9, 2024
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Samsung Electronics Co., Ltd.
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Changsik KIM
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE BONDING METHOD
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Publication number 20240145416
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Wonyoung CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20240136334
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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Jinnam KIM
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H01 - BASIC ELECTRIC ELEMENTS
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LOW-STRESS PASSIVATION LAYER
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Publication number 20240136291
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Publication date Apr 25, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsiang-Ku SHEN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240136311
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Publication date Apr 25, 2024
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Samsung Electronics Co., Ltd.
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GWANGJAE JEON
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE STRUCTURE
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Publication number 20240136312
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Publication date Apr 25, 2024
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UNITED MICROELECTRONICS CORP.
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Purakh Raj Verma
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H01 - BASIC ELECTRIC ELEMENTS