the bodies being stacked

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H01L2224/24145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/24145the bodies being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,100,666
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with conductive patterns in a redistribution layer
- Patent number 12,100,682
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dipole alignment apparatus for use in manufacturing of display devi...
- Patent number 12,068,279
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a plurality of semiconductor chips
- Patent number 12,057,441
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 12,021,054
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer light detecting device and electronic apparatus
- Patent number 11,948,833
- Issue date Apr 2, 2024
- Sony Group Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,942,454
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component module, and electronic...
- Patent number 11,876,029
- Issue date Jan 16, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,837,587
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for manufacturing the same
- Patent number 11,837,595
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 11,817,361
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 11,798,916
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 11,791,299
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,756,942
- Issue date Sep 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,749,657
- Issue date Sep 5, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hybrid battery separators for lithium ion secondary batt...
- Patent number 11,626,349
- Issue date Apr 11, 2023
- Celgard, LLC
- Lie Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 11,600,575
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 11,587,901
- Issue date Feb 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory device and method for embedding memory device in a...
- Patent number 11,562,993
- Issue date Jan 24, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,527,509
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,495,573
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer and method for forming th...
- Patent number 11,469,215
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379577
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371814
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240258465
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Minjae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203947
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20240178057
- Publication date May 30, 2024
- SONY GROUP CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240162406
- Publication date May 16, 2024
- AUO Corporation
- Chieh-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
- Publication number 20240113046
- Publication date Apr 4, 2024
- Intel Corporation
- Jason Scott Steill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
- Publication number 20240088084
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Ameen D. Akel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
- Publication number 20240063147
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
- Publication number 20240021559
- Publication date Jan 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
- Publication number 20240006366
- Publication date Jan 4, 2024
- Intel Corporation
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20240006377
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20230378139
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer (RDL) Layouts for Integrated Circuits
- Publication number 20230378116
- Publication date Nov 23, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20230360992
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
- Publication number 20230307598
- Publication date Sep 28, 2023
- LG ELECTRONICS INC.
- Sungyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE WITH IMPROVED ALIGNMENT USING CARRI...
- Publication number 20230275063
- Publication date Aug 31, 2023
- Samsung Electronic Co., Ltd.
- Byounghak HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE
- Publication number 20230207477
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154906
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230122457
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Eui Kang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20230066130
- Publication date Mar 2, 2023
- LG Display Co., Ltd.
- MinJae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS
- Publication number 20230068300
- Publication date Mar 2, 2023
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230058776
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220406763
- Publication date Dec 22, 2022
- SAMSUNG DISPLAY CO., LTD.
- Eun A YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220392922
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Se Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-tier IC package including processor and high bandwidth memory

Method for forming chip package structure

Package structure with conductive patterns in a redistribution layer

Package structure and manufacturing method thereof

Dipole alignment apparatus for use in manufacturing of display devi...

Semiconductor package including a plurality of semiconductor chips

Methods of forming stacked integrated circuits using selective ther...

Redistribution layer (RDL) layouts for integrated circuits

Multilayer light detecting device and electronic apparatus

Package and manufacturing method thereof

Method for packaging an integrated circuit (IC) package with embedd...

Method of manufacturing electronic component module, and electronic...

Package structure and manufacturing method thereof

Semiconductor device structure and method for manufacturing the same

Passivation structure with planar top surfaces

3DIC interconnect apparatus and method

Redistribution layer (RDL) layouts for integrated circuits

Package comprising integrated devices coupled through a metallizati...

Fan-out packaging structure and method

Chip package structure with molding layer

Fan-out packaging structure and method

Semiconductor device package

Integrated circuit (IC) package with embedded heat spreader in a re...

Multilayer hybrid battery separators for lithium ion secondary batt...

Method for forming chip package structure

Semiconductor device with redistribution structure and method for f...

Embedded memory device and method for embedding memory device in a...

Semiconductor package

Package structure and manufacturing method thereof

Chip package structure with molding layer and method for forming th...

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE

DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...

FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE

MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

3DIC Interconnect Apparatus and Method

Redistribution Layer (RDL) Layouts for Integrated Circuits

Passivation Structure with Planar Top Surfaces

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

3D-STACKED SEMICONDUCTOR DEVICE WITH IMPROVED ALIGNMENT USING CARRI...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

METHOD FOR FORMING CHIP PACKAGE STRUCTURE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

PACKAGING ARCHITECTURE FOR DISAGGREGATED INTEGRATED VOLTAGE REGULATORS

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

PIXEL AND DISPLAY DEVICE INCLUDING THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME