the bodies being stacked

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CPC
H01L2224/40145

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40145the bodies being stacked

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided chip stack assembly
- Patent number 11,211,373
- Issue date Dec 28, 2021
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,177,197
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,088,106
- Issue date Aug 10, 2021
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit formed from a stack of two series-connected chips
- Patent number 10,672,746
- Issue date Jun 2, 2020
- Exagan
- Domenico Lo Verde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating multi-output power converters having vertically stacked...
- Patent number 9,653,388
- Issue date May 16, 2017
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching element with a series-connected junction FET (JFET) and M...
- Patent number 9,502,388
- Issue date Nov 22, 2016
- Renesas Electronics Corporation
- Takamitsu Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating multi-output power converters having vertically stacked...
- Patent number 9,373,571
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching element with a series-connected junction FET (JFET) and M...
- Patent number 9,263,435
- Issue date Feb 16, 2016
- Renesas Electronics Corporation
- Takamitsu Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stacked multi-chip packaging structure
- Patent number 9,230,949
- Issue date Jan 5, 2016
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical system and substrate sealing method
- Patent number 9,201,245
- Issue date Dec 1, 2015
- Samsung Display Co., Ltd.
- Jung-Min Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
III-nitride rectifier package
- Patent number 9,142,503
- Issue date Sep 22, 2015
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage cascoded III-nitride rectifier package
- Patent number 8,790,965
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage cascoded III-nitride rectifier package utilizing clips...
- Patent number 8,546,849
- Issue date Oct 1, 2013
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked leadframe implementation for DC/DC convertor power module i...
- Patent number 8,450,149
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20220115308
- Publication date Apr 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20210327846
- Publication date Oct 21, 2021
- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20210090980
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG CLIP
- Publication number 20210005569
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Michael Kirby Chua Quijano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20200118963
- Publication date Apr 16, 2020
- TDK Corporation
- Yohei HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FORMED FROM A STACK OF TWO SERIES-CONNECTED CHIPS
- Publication number 20190378823
- Publication date Dec 12, 2019
- Exagan
- Domenico Lo Verde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20160064313
- Publication date Mar 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Rectifier Package
- Publication number 20140327014
- Publication date Nov 6, 2014
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Multi-Output Power Converters Having Vertically Stacked...
- Publication number 20140306332
- Publication date Oct 16, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140231829
- Publication date Aug 21, 2014
- Takamitsu KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SYSTEM AND SUBSTRATE SEALING METHOD
- Publication number 20140177077
- Publication date Jun 26, 2014
- Jung-Min LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package
- Publication number 20140030854
- Publication date Jan 30, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips...
- Publication number 20120280247
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
- Publication number 20120119343
- Publication date May 17, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS

the bodies being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with solder standoff

Stack of electrical components and method of producing the same

Double-sided chip stack assembly

Semiconductor package with solder standoff

Stack of electrical components and method of producing the same

Integrated circuit formed from a stack of two series-connected chips

Integrating multi-output power converters having vertically stacked...

Switching element with a series-connected junction FET (JFET) and M...

Integrating multi-output power converters having vertically stacked...

Switching element with a series-connected junction FET (JFET) and M...

Method of making stacked multi-chip packaging structure

Optical system and substrate sealing method

III-nitride rectifier package

High voltage cascoded III-nitride rectifier package

High voltage cascoded III-nitride rectifier package utilizing clips...

Stacked leadframe implementation for DC/DC convertor power module i...

Patents Applicationslast 30 patents

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

GANG CLIP

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

INTEGRATED CIRCUIT FORMED FROM A STACK OF TWO SERIES-CONNECTED CHIPS

Integrating Multi-Output Power Converters Having Vertically Stacked...

III-Nitride Rectifier Package

Integrating Multi-Output Power Converters Having Vertically Stacked...

SEMICONDUCTOR DEVICE

OPTICAL SYSTEM AND SUBSTRATE SEALING METHOD

High Voltage Cascoded III-Nitride Rectifier Package

High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips...

STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...