the bond pad being disposed in a recess of the surface of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48158the bond pad being disposed in a recess of the surface of the item

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,027,545
- Issue date Jul 2, 2024
- Tong Hsing Electronic Industries, Ltd.
- Jui-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with heat spreader
- Patent number 12,009,280
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,791,303
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 10,573,600
- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 9,875,911
- Issue date Jan 23, 2018
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 9,780,057
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 9,735,113
- Issue date Aug 15, 2017
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,263,332
- Issue date Feb 16, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,048,306
- Issue date Jun 2, 2015
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,896,133
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 8,853,001
- Issue date Oct 7, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,492,197
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 8,143,097
- Issue date Mar 27, 2012
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC PACKAGE WITH HEAT SPREADER
- Publication number 20240332119
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS
- Publication number 20230387045
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Pekka Pursula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH HEAT SPREADER
- Publication number 20230187306
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230052065
- Publication date Feb 16, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
- Publication number 20220225502
- Publication date Jul 14, 2022
- DENSO CORPORATION
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20220130793
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20170309572
- Publication date Oct 26, 2017
- STATS ChipPAC Pte Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20170005048
- Publication date Jan 5, 2017
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20130299974
- Publication date Nov 14, 2013
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer with Opening...
- Publication number 20130299982
- Publication date Nov 14, 2013
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20130234324
- Publication date Sep 12, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20120241984
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20120168916
- Publication date Jul 5, 2012
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20120043672
- Publication date Feb 23, 2012
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
- Publication number 20110285007
- Publication date Nov 24, 2011
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20110074047
- Publication date Mar 31, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20110068444
- Publication date Mar 24, 2011
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer with Opening...
- Publication number 20110068459
- Publication date Mar 24, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20100225001
- Publication date Sep 9, 2010
- Shinko Electric Industries Co., Ltd.
- Toru HIZUME
- H01 - BASIC ELECTRIC ELEMENTS

the bond pad being disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method of producing printed circuit board

Sensor package structure

IC package with heat spreader

Semiconductor package including semiconductor chips

Semiconductor device and method of forming interposer with opening...

Semiconductor package including semiconductor chips

Semiconductor integrated circuit device

Semiconductor device and method of forming ultra thin multi-die fac...

Semiconductor device and method of forming interposer with opening...

Semiconductor device and method of forming pad layout for flipchip...

Semiconductor device and method of forming ultra thin multi-die fac...

Semiconductor device and method of forming open cavity in TSV inter...

Semiconductor device and method of forming open cavity in TSV inter...

Semiconductor device and method of forming vertically offset conduc...

Semiconductor device and method of forming pad layout for flipchip...

Semiconductor device and method of forming vertically offset conduc...

Semiconductor device and method of forming open cavity in TSV inter...

Patents Applicationslast 30 patents

IC PACKAGE WITH HEAT SPREADER

WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS

IC PACKAGE WITH HEAT SPREADER

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Interposer with Opening...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Interposer with Opening...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...