the bond pad being disposed in a recess of the surface of the item

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CPC
H01L2224/48158

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48158the bond pad being disposed in a recess of the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Sensor package structure
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- Jui-Hung Hsu
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Information Patent Grant
IC package with heat spreader
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Information Patent Grant
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Information Patent Grant
Semiconductor device and method of forming interposer with opening...
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- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
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Information Patent Grant
Semiconductor package including semiconductor chips
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- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
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- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
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- Issue date Feb 25, 2020
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
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- Issue date Jan 23, 2018
- STATS ChipPAC Pte. Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
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- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra thin multi-die fac...
- Patent number 9,735,113
- Issue date Aug 15, 2017
- STATS ChipPAC Pte. Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,263,332
- Issue date Feb 16, 2016
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 9,048,306
- Issue date Jun 2, 2015
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,896,133
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming pad layout for flipchip...
- Patent number 8,853,001
- Issue date Oct 7, 2014
- STATS ChipPAC, Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,492,197
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
- Patent number 8,143,097
- Issue date Mar 27, 2012
- STATS ChipPAC, Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC PACKAGE WITH HEAT SPREADER
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- Publication date Oct 3, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS
- Publication number 20230387045
- Publication date Nov 30, 2023
- Teknologian Tutkimuskeskus VTT Oy
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- H01 - BASIC ELECTRIC ELEMENTS
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IC PACKAGE WITH HEAT SPREADER
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
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HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
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PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
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Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
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Information Patent Application
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...
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- Publication date Oct 26, 2017
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20170005048
- Publication date Jan 5, 2017
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
- Publication number 20130299974
- Publication date Nov 14, 2013
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Method of Forming Interposer with Opening...
- Publication number 20130299982
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- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20130234324
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Semiconductor Device and Method of Forming Pad Layout for Flipchip...
- Publication number 20120241984
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Information Patent Application
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Information Patent Application
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Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
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Semiconductor Device and Method of Forming Interposer with Opening...
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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
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- H01 - BASIC ELECTRIC ELEMENTS

the bond pad being disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method of producing printed circuit board

Sensor package structure

IC package with heat spreader

Semiconductor package including semiconductor chips

Semiconductor device and method of forming interposer with opening...

Semiconductor package including semiconductor chips

Semiconductor integrated circuit device

Semiconductor device and method of forming ultra thin multi-die fac...

Semiconductor device and method of forming interposer with opening...

Semiconductor device and method of forming pad layout for flipchip...

Semiconductor device and method of forming ultra thin multi-die fac...

Semiconductor device and method of forming open cavity in TSV inter...

Semiconductor device and method of forming open cavity in TSV inter...

Semiconductor device and method of forming vertically offset conduc...

Semiconductor device and method of forming pad layout for flipchip...

Semiconductor device and method of forming vertically offset conduc...

Semiconductor device and method of forming open cavity in TSV inter...

Patents Applicationslast 30 patents

IC PACKAGE WITH HEAT SPREADER

WAFER-LEVEL PACKAGE FOR MILLIMETRE WAVE AND THZ SIGNALS

IC PACKAGE WITH HEAT SPREADER

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

HYBRID EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Interposer with Opening...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Semiconductor Device and Method of Forming Ultra Thin Multi-Die Fac...

Semiconductor Device and Method of Forming Pad Layout for Flipchip...

Semiconductor Device and Method of Forming Open Cavity in TSV Inter...

Semiconductor Device and Method of Forming Interposer with Opening...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...