the bond pad being disposed in a recess of the surface of the item

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H01L2224/48248

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48248the bond pad being disposed in a recess of the surface of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D flex-foil package
- Patent number 11,764,122
- Issue date Sep 19, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die carrier package and method of forming same
- Patent number 11,502,009
- Issue date Nov 15, 2022
- Medtronic, Inc.
- Mark R. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die carrier package and method of forming same
- Patent number 10,950,511
- Issue date Mar 16, 2021
- Medtronic, Inc.
- Mark R. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal core printed circuit board and electronic package structure
- Patent number 9,386,686
- Issue date Jul 5, 2016
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame including an insulating resin layer entirely covering le...
- Patent number 8,928,130
- Issue date Jan 6, 2015
- Shinko Electric Industries Co., Ltd.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnection a...
- Patent number 8,502,387
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421048
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Koki TANIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240313043
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240030135
- Publication date Jan 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D FLEX-FOIL PACKAGE
- Publication number 20200279787
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust and Reliable Power Semiconductor Package
- Publication number 20160104688
- Publication date Apr 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD...
- Publication number 20130256854
- Publication date Oct 3, 2013
- Shinko Electric Industries Co., LTD.
- Toshio Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE
- Publication number 20120268896
- Publication date Oct 25, 2012
- Chi-Feng HUANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LEAD FRAME WITH COINED INNER LEADS
- Publication number 20120248589
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinquan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...
- Publication number 20120146235
- Publication date Jun 14, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for semiconductor device with ground lead connection having...
- Publication number 20030146500
- Publication date Aug 7, 2003
- STMicroelectronics S.r.l.
- Battista Vitali
- H01 - BASIC ELECTRIC ELEMENTS

the bond pad being disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package with thermal pad

3D flex-foil package

Die carrier package and method of forming same

Die carrier package and method of forming same

Metal core printed circuit board and electronic package structure

Lead frame including an insulating resin layer entirely covering le...

Integrated circuit packaging system with vertical interconnection a...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

3D FLEX-FOIL PACKAGE

Robust and Reliable Power Semiconductor Package

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD...

METAL CORE PRINTED CIRCUIT BOARD AND ELECTRONIC PACKAGE STRUCTURE

LEAD FRAME WITH COINED INNER LEADS

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...

Package for semiconductor device with ground lead connection having...