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H01L2224/40249

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40249the bond pad protruding from the surface of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 10,600,712
- Issue date Mar 24, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yuji Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and a method of manufacturing the same
- Patent number 9,961,798
- Issue date May 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with step portion having shear surfaces
- Patent number 9,355,941
- Issue date May 31, 2016
- Renesas Electronics Corporation
- Hideko Andou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and resin-sealed semiconductor device
- Patent number 9,252,086
- Issue date Feb 2, 2016
- Fuji Electric Co., Ltd.
- Atsushi Maruyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor module
- Patent number 9,245,832
- Issue date Jan 26, 2016
- Fuji Electric Co., Ltd.
- Akane Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for top-side cooled semiconductor package with stacked inter...
- Patent number 9,218,987
- Issue date Dec 22, 2015
- ALPHA AND OMEGA SEMICONDUCTER INCORPORATED
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,177,833
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Takuya Nakajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, inverter device provided with semiconductor d...
- Patent number 9,117,688
- Issue date Aug 25, 2015
- Mitsubishi Electric Corporation
- Takuya Oga
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device with step portion having shear surfaces
- Patent number 9,111,922
- Issue date Aug 18, 2015
- Renesas Electronics Corporation
- Hideko Andou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-layer lead frame package and method of fabrication
- Patent number 8,815,649
- Issue date Aug 26, 2014
- Alpha & Omega Semiconductor Corporation
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation method
- Patent number 8,722,468
- Issue date May 13, 2014
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package comprising a laminate and method of making...
- Patent number 8,692,361
- Issue date Apr 8, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulation and method thereof
- Patent number 8,519,525
- Issue date Aug 27, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 8,513,059
- Issue date Aug 20, 2013
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer lead frame package and method of fabrication
- Patent number 8,513,784
- Issue date Aug 20, 2013
- Alpha and Omega Semiconductor Incorporated
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making solder-top enhanced semiconductor device of low p...
- Patent number 8,497,160
- Issue date Jul 30, 2013
- Alpha & Omega Semiconductor, Inc.
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,492,202
- Issue date Jul 23, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-side cooled semiconductor package with stacked interconnection...
- Patent number 8,354,740
- Issue date Jan 15, 2013
- Alpha & Omega Semiconductor, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,314,484
- Issue date Nov 20, 2012
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-top enhanced semiconductor device for low parasitic impedanc...
- Patent number 8,264,084
- Issue date Sep 11, 2012
- Alpha & Omega Semiconductor, Inc.
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self locking and aligning clip structure for semiconductor die package
- Patent number 8,067,273
- Issue date Nov 29, 2011
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package having a bridge plate connection
- Patent number 8,053,874
- Issue date Nov 8, 2011
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 8,008,759
- Issue date Aug 30, 2011
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including exposed connections
- Patent number 7,972,906
- Issue date Jul 5, 2011
- Fairchild Semiconductor Corporation
- Erwin Victor R. Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self locking and aligning clip structure for semiconductor die package
- Patent number 7,902,657
- Issue date Mar 8, 2011
- Fairchild Semiconductor Corporation
- Jocel P. Gomez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pre-molded clip structure
- Patent number 7,838,340
- Issue date Nov 23, 2010
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device
- Patent number 7,834,433
- Issue date Nov 16, 2010
- Shanghai Kaihong Technology Co., Ltd.
- Tan Xiaochun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded clip structure
- Patent number 7,768,105
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140301039
- Publication date Oct 9, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Top-side Cooled Semiconductor Package with Stacked Inter...
- Publication number 20140154843
- Publication date Jun 5, 2014
- Alpha and Omega Semiconductor Incorprated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140103510
- Publication date Apr 17, 2014
- RENESAS ELECTRONICS CORPORATION
- Hideko ANDOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Clip Contact
- Publication number 20140084433
- Publication date Mar 27, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package Comprising a Laminate and Method of Making...
- Publication number 20140027892
- Publication date Jan 30, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, INVERTER DEVICE PROVIDED WITH SEMICONDUCTOR D...
- Publication number 20130320818
- Publication date Dec 5, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ENCAPSULATION METHOD
- Publication number 20130309816
- Publication date Nov 21, 2013
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION
- Publication number 20130302946
- Publication date Nov 14, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130228907
- Publication date Sep 5, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuya NAKAJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20130181334
- Publication date Jul 18, 2013
- FUJI ELECTRIC CO., LTD
- Atsushi MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Top-side Cooled Semiconductor Package with Stacked Interconnection...
- Publication number 20130099364
- Publication date Apr 25, 2013
- Alpha and Omega Semiconductor Incorprated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130071971
- Publication date Mar 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Solder-top Enhanced Semiconductor Device of Low P...
- Publication number 20120289001
- Publication date Nov 15, 2012
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ENCAPSULATION AND METHOD THEREOF
- Publication number 20120025360
- Publication date Feb 2, 2012
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20110272794
- Publication date Nov 10, 2011
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
- Publication number 20110244633
- Publication date Oct 6, 2011
- Ruben P. Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION
- Publication number 20110227205
- Publication date Sep 22, 2011
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE
- Publication number 20110076807
- Publication date Mar 31, 2011
- Jocel P. Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20100258924
- Publication date Oct 14, 2010
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED CLIP STRUCTURE
- Publication number 20100258923
- Publication date Oct 14, 2010
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100187678
- Publication date Jul 29, 2010
- Renesas Technology Corp.
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
- Publication number 20100164078
- Publication date Jul 1, 2010
- Ruben Madrid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Top-side Cooled Semiconductor Package with Stacked Interconnection...
- Publication number 20100133670
- Publication date Jun 3, 2010
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EXPOSED CONNECTIONS
- Publication number 20090224383
- Publication date Sep 10, 2009
- Erwin Victor Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having a bridge plate connection
- Publication number 20090218673
- Publication date Sep 3, 2009
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Packages Having Solder-free Connections, Systems...
- Publication number 20090179315
- Publication date Jul 16, 2009
- Armand Vincent Jereza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder-top Enhanced Semiconductor Device and Method for Low Parasit...
- Publication number 20090108456
- Publication date Apr 30, 2009
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS

the bond pad protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Package and a method of manufacturing the same

Semiconductor device

Semiconductor device with step portion having shear surfaces

Connector and resin-sealed semiconductor device

Semiconductor module

Method for top-side cooled semiconductor package with stacked inter...

Semiconductor device and method of manufacturing the same

Semiconductor device, inverter device provided with semiconductor d...

Semiconductor device with step portion having shear surfaces

Electric device package and method of making an electric device pac...

Multi-layer lead frame package and method of fabrication

Semiconductor encapsulation method

Electric device package comprising a laminate and method of making...

Semiconductor encapsulation and method thereof

Pre-molded clip structure

Multi-layer lead frame package and method of fabrication

Method for making solder-top enhanced semiconductor device of low p...

Semiconductor device and method of manufacturing the same

Top-side cooled semiconductor package with stacked interconnection...

Semiconductor device and method of manufacturing the same

Solder-top enhanced semiconductor device for low parasitic impedanc...

Self locking and aligning clip structure for semiconductor die package

Semiconductor package having a bridge plate connection

Pre-molded clip structure

Semiconductor die package including exposed connections

Self locking and aligning clip structure for semiconductor die package

Pre-molded clip structure

Semiconductor power device

Pre-molded clip structure

Patents Applicationslast 30 patents

PACKAGE AND A METHOD OF MANUFACTURING THE SAME

Method for Top-side Cooled Semiconductor Package with Stacked Inter...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device Having a Clip Contact

Electric Device Package Comprising a Laminate and Method of Making...

Electric Device Package and Method of Making an Electric Device Pac...

SEMICONDUCTOR DEVICE, INVERTER DEVICE PROVIDED WITH SEMICONDUCTOR D...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ENCAPSULATION METHOD

MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE

Top-side Cooled Semiconductor Package with Stacked Interconnection...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

Method for Making Solder-top Enhanced Semiconductor Device of Low P...

SEMICONDUCTOR ENCAPSULATION AND METHOD THEREOF

PRE-MOLDED CLIP STRUCTURE

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION

SELF LOCKING AND ALIGNING CLIP STRUCTURE FOR SEMICONDUCTOR DIE PACKAGE

PRE-MOLDED CLIP STRUCTURE

PRE-MOLDED CLIP STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Top-side Cooled Semiconductor Package with Stacked Interconnection...

SEMICONDUCTOR DIE PACKAGE INCLUDING EXPOSED CONNECTIONS

Semiconductor package having a bridge plate connection

Semiconductor Die Packages Having Solder-free Connections, Systems...

Solder-top Enhanced Semiconductor Device and Method for Low Parasit...