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the bond pad protruding from the surface of the item

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Industry

  • CPC
  • H01L2224/40179
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/40179the bond pad protruding from the surface of the item
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 9,401,319
    • Issue date Jul 26, 2016
    • Mitsubishi Electric Corporation
    • Takuya Oga
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230298975
    • Publication date Sep 21, 2023
    • Kabushiki Kaisha Toshiba
    • Satoru Ikeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20130307130
    • Publication date Nov 21, 2013
    • MITSUBISHI ELECTRIC CORPORATION
    • Takuya Oga
    • H01 - BASIC ELECTRIC ELEMENTS