the bonding area connecting directly to at least two bonding areas

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CPC
H01L2224/08123

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08123the bonding area connecting directly to at least two bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor element, and semiconductor el...
- Patent number 12,132,142
- Issue date Oct 29, 2024
- Kyocera Corporation
- Katsuaki Masaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 11,908,739
- Issue date Feb 20, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode device with driving mechanism
- Patent number 11,309,298
- Issue date Apr 19, 2022
- MY-Semi Inc.
- Cheng-Han Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,985,081
- Issue date Apr 20, 2021
- Sony Corporation
- Yukihiro Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 10,840,135
- Issue date Nov 17, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of electronic chips
- Patent number 10,818,639
- Issue date Oct 27, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Didier Lattard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,770,490
- Issue date Sep 8, 2020
- Sony Corporation
- Yukihiro Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with common electrode
- Patent number 10,748,884
- Issue date Aug 18, 2020
- INNOLUX CORPORATION
- Hong-Pin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 10,734,345
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat metal features for microelectronics applications
- Patent number 10,446,441
- Issue date Oct 15, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 10,236,238
- Issue date Mar 19, 2019
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,090,375
- Issue date Oct 2, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 9,929,118
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,799,587
- Issue date Oct 24, 2017
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for low temperature flip chip bonding
- Patent number 9,536,848
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES Inc.
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging through pre-formed metal pins
- Patent number 9,418,953
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly
- Patent number 8,508,952
- Issue date Aug 13, 2013
- Gemalto SA
- Beatrice Bonvalot
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process to allow electrical and mechanical connection of an electri...
- Patent number 8,429,813
- Issue date Apr 30, 2013
- Gemalto SA
- Beatrice Bonvalot
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...
- Publication number 20240153901
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240112991
- Publication date Apr 4, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105526
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047443
- Publication date Feb 8, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411239
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230049315
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20220399380
- Publication date Dec 15, 2022
- KYOCERA CORPORATION
- Hiroaki ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220246498
- Publication date Aug 4, 2022
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DEVICE WITH DRIVING MECHANISM
- Publication number 20210066270
- Publication date Mar 4, 2021
- MY-SEMI INC.
- CHENG-HAN HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200365632
- Publication date Nov 19, 2020
- SONY CORPORATION
- Yukihiro ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190304960
- Publication date Oct 3, 2019
- InnoLux Corporation
- Hong-Pin KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180233435
- Publication date Aug 16, 2018
- SONY CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging through Pre-Formed Metal Pins
- Publication number 20180204816
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096915
- Publication date Apr 5, 2018
- SONY CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20170179055
- Publication date Jun 22, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20170170132
- Publication date Jun 15, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING
- Publication number 20170040274
- Publication date Feb 9, 2017
- GLOBALFOUNDRIES INC.
- Luke ENGLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING
- Publication number 20160111386
- Publication date Apr 21, 2016
- GLOBALFOUNDRIES INC.
- Luke ENGLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging through Pre-Formed Metal Pins
- Publication number 20150200171
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140145338
- Publication date May 29, 2014
- SONY CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to Allow Electrical and Mechanical Connection of an Electri...
- Publication number 20100157555
- Publication date Jun 24, 2010
- Beatrice BONVALOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to allow electrical and mechanical connection of an electri...
- Publication number 20050034303
- Publication date Feb 17, 2005
- Schlumberger Systemes
- Beatrice Bonvalot
- H01 - BASIC ELECTRIC ELEMENTS

the bonding area connecting directly to at least two bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor element, and semiconductor el...

Semiconductor device

Flat metal features for microelectronics applications

Conductive barrier direct hybrid bonding

Semiconductor device

Semiconductor device

Light-emitting diode device with driving mechanism

Conductive barrier direct hybrid bonding

Semiconductor device and electronic apparatus

Flat metal features for microelectronics applications

3D stack of electronic chips

Semiconductor device and electronic apparatus

Electronic device with common electrode

Packaging through pre-formed metal pins

Flat metal features for microelectronics applications

Three dimensional device integration method and integrated device

Semiconductor device

Semiconductor structure

Packaging through pre-formed metal pins

Semiconductor device

Bond pad structure for low temperature flip chip bonding

Packaging through pre-formed metal pins

Electrical assembly

Process to allow electrical and mechanical connection of an electri...

Patents Applicationslast 30 patents

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE

LIGHT-EMITTING DIODE DEVICE WITH DRIVING MECHANISM

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

ELECTRONIC DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE

Packaging through Pre-Formed Metal Pins

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING

BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING

Packaging through Pre-Formed Metal Pins

SEMICONDUCTOR DEVICE

Process to Allow Electrical and Mechanical Connection of an Electri...

Process to allow electrical and mechanical connection of an electri...