the bump being used as a mask for patterning the bonding area

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03912the bump being used as a mask for patterning the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- Taiwan Semiconductor Manufacturing Company, Ltd
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Structure and method of forming a joint assembly
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Patents Applicationslast 30 patents

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS

the bump being used as a mask for patterning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor product with interlocking metal-to-metal bonds and me...

Structure and method of forming a joint assembly

Advanced device assembly structures and methods

Multiple plated via arrays of different wire heights on a same subs...

Fingerprint sensor and manufacturing method thereof

Semiconductor device having reduced bump height variation

Semiconductor device and package assembly including the same

Connector structure and method of forming same

Semiconductor package

Integrated device comprising pillar interconnect with cavity

Coupling inductors in an IC device using interconnecting elements w...

Semiconductor device

Conductive external connector structure and method of forming

Semiconductor contact structure having stress buffer layer formed b...

Alternative integration for redistribution layer process

Shaped interconnect bumps in semiconductor devices

Fingerprint sensor and manufacturing method thereof

Logic drive with brain-like elasticity and integrality based on sta...

Structure and method of forming a joint assembly

Semiconductor device and bump formation process

Conical-shaped or tier-shaped pillar connections

Devices with three-dimensional structures and support elements to i...

Method of making a pillar structure having a non-metal sidewall pro...

Mechanisms for forming post-passivation interconnect structure

Method of forming vias using silicon on insulator substrate

Semiconductor device and a method of manufacturing the same

Single-shot encapsulation

Leadframes in semiconductor devices

Method for forming bump structure

Fabrication method of semiconductor package with stacked semiconduc...

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

ALLOY FOR METAL UNDERCUT REDUCTION

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THICK REDISTRIBUTION LAYER FEATURES

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

Structure and Method of Forming a Joint Assembly

Advanced Device Assembly Structures And Methods

Leadframes in Semiconductor Devices

Pre-Molded Leadframes in Semiconductor Devices

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Connector Structure and Method of Forming Same

SEMICONDUCTOR CONTACT STRUCTURE HAVING STRESS BUFFER LAYER FORMED B...

DEVICES THREE-DIMENSIONAL STRUCTURES TO SUBSTRATES

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

EXPANDED HEAD PILLAR FOR BUMP BONDS

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

Semiconductor Device and Bump Formation Process

Semiconductor Device

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

Design Scheme for Connector Site Spacing and Resulting Structures