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H01L2224/73204
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/73204
the bump connector being embedded into the layer connector
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last 30 patents
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Semiconductor package
Patent number
12,002,731
Issue date
Jun 4, 2024
Samsung Electronics Co., Ltd.
Ae-Nee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display apparatus
Patent number
11,995,277
Issue date
May 28, 2024
Samsung Display Co., Ltd.
Kiwook Kim
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
11,990,435
Issue date
May 21, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sung Sun Park
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Physically unclonable function circuitry of a package substrate and...
Patent number
11,990,419
Issue date
May 21, 2024
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,990,351
Issue date
May 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Ting Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
11,990,441
Issue date
May 21, 2024
Samsung Electronics Co., Ltd.
Namhoon Kim
H01 - BASIC ELECTRIC ELEMENTS
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IC die and heat spreaders with solderable thermal interface structu...
Patent number
11,984,377
Issue date
May 14, 2024
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
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Electronic package and manufacturing method thereof
Patent number
11,984,379
Issue date
May 14, 2024
Siliconware Precision Industries Co., Ltd.
Yu-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package structure and method for forming the same
Patent number
11,984,378
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
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3D semiconductor devices and structures with metal layers
Patent number
11,984,445
Issue date
May 14, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
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Structure and formation method of chip package with protective lid
Patent number
11,978,715
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Heat dissipation plate and semiconductor device
Patent number
11,973,000
Issue date
Apr 30, 2024
Shinko Electric Industries Co., Ltd.
Takuya Kurosawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Lid attach process and dispenser head
Patent number
11,972,956
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
11,972,995
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Dahee Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Double-layer stacked 3D fan-out packaging structure and method maki...
Patent number
11,973,070
Issue date
Apr 30, 2024
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,961,742
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and fabricating method thereof
Patent number
11,961,797
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Keun Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package dielectric substrate including a trench
Patent number
11,961,796
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yueh-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
Patent number
11,955,346
Issue date
Apr 9, 2024
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Power semiconductor component and method for producing a power semi...
Patent number
11,955,402
Issue date
Apr 9, 2024
Vitesco Technologies GbmH
Christina Quest-Matt
H01 - BASIC ELECTRIC ELEMENTS
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Electronic device
Patent number
11,955,453
Issue date
Apr 9, 2024
Ultra Display Technology Corp.
Hsien-Te Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
Patent number
11,955,396
Issue date
Apr 9, 2024
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of providing the same
Patent number
11,950,467
Issue date
Apr 2, 2024
Samsung Display Co., Ltd.
Byoungyong Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240178095
Publication date
May 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LIGHT DETECTION DEVICE
Publication number
20240178249
Publication date
May 30, 2024
HAMAMATSU PHOTONICS K. K.
Nao INOUE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
Publication number
20240178150
Publication date
May 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzuan-Horng LIU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
Publication number
20240178040
Publication date
May 30, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED...
Publication number
20240178084
Publication date
May 30, 2024
Intel Corporation
Soham Agarwal
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PERMANENT LAYER FOR BUMP CHIP ATTACH
Publication number
20240178097
Publication date
May 30, 2024
Intel Corporation
Frederick Atadana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240178116
Publication date
May 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Ting Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240178206
Publication date
May 30, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyeon LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240170449
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
HYOUNGJOO LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240170458
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
Min Seung Ji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR...
Publication number
20240170511
Publication date
May 23, 2024
Sony Semiconductor Solutions Corporation
Naoki KOMAI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240170360
Publication date
May 23, 2024
MEDIATEK INC.
Chun-Yin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240170382
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
Juhyeon Oh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
Publication number
20240170319
Publication date
May 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240170455
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
Yonghoe CHO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE
Publication number
20240170437
Publication date
May 23, 2024
Advanced Semiconductor Engineering, Inc.
Chun Fu KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240170440
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
Hwanyoung Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240170473
Publication date
May 23, 2024
Industrial Technology Research Institute
Hao-Che Kao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...
Publication number
20240170351
Publication date
May 23, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
Publication number
20240170366
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
Jonggyu Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE WITH THERMAL PADS AND PRINTED...
Publication number
20240162106
Publication date
May 16, 2024
Western Digital Technologies, Inc.
Teng Sun
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Publication number
20240162115
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Youngdeuk KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240162135
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Jingu KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
Publication number
20240162206
Publication date
May 16, 2024
Micron Technology, Inc.
Seng Kim YE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SIP MODULE
Publication number
20240162266
Publication date
May 16, 2024
LG Innotek Co., Ltd.
Byung Hyun CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240162113
Publication date
May 16, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Dong Hyeon Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS
Publication number
20240162127
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Sanghyuck Oh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED HYBRID HEAT DISSIPATION SYSTEM THAT MAXIMIZES HEAT TRANS...
Publication number
20240162107
Publication date
May 16, 2024
SHUN-PING HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
Publication number
20240162109
Publication date
May 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hung-Yi Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240162195
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Yongjin Park
H01 - BASIC ELECTRIC ELEMENTS