the bump connector being supplied to the parts to be connected in the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/811the bump connector being supplied to the parts to be connected in the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,368,132
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
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- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump to package substrate solder joint
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- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
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Information Patent Grant
Resin shaping device
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- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
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- Ying-Chen Chang
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Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attached leveling control by metal stopper bumps
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Information Patent Grant
System and method for superconducting multi-chip module
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Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
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- Tomonori Kawata
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Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
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- Issue date May 13, 2025
- Regents of The University of Minnesota
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Information Patent Grant
Conductive adhesive composition, and method for producing connectio...
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Information Patent Grant
Integrated circuit package and method of forming same
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Information Patent Grant
Method for forming chip packages and a chip package
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- Issue date May 6, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
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- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
Method for packaging stacking flip chip
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Information Patent Grant
Micro-LED mounting substrate, micro-led display, and method of manu...
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Information Patent Grant
Adhesive for semiconductor, production method therefor, and semicon...
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- Issue date Apr 22, 2025
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
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- Issue date Apr 8, 2025
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Information Patent Grant
Window assemblies, imaging system including the same, method of man...
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Information Patent Grant
Flip-chip package assembly
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Information Patent Grant
Package process and package structure
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Information Patent Grant
Semiconductor package and method of forming the same
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- Li-Ling Liao
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Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
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- Commissariat a l'Energie Atomique et Aux Energies Alternatives
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
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- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages and Methods of Forming Same
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- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
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- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
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- Ming Li
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Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
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- Yifan Guo
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SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE
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- Murata Manufacturing Co., Ltd.
- Akira FUJIHARA
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PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
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- Google LLC
- Erik Anthony Lucero
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF BONDING LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURIN...
- Publication number 20250210584
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- SAMSUNG DISPLAY CO., LTD.
- Jae Gwang UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250201686
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
- Publication number 20250201761
- Publication date Jun 19, 2025
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192071
- Publication date Jun 12, 2025
- Samsung Electronics Co.,Ltd.
- Chengjing ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20250192095
- Publication date Jun 12, 2025
- TRON FUTURE TECH INC.
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183212
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183239
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
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- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
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- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20250157982
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- STMicroelectronics International N.V.
- Guendalina CATALANO
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Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20250157975
- Publication date May 15, 2025
- NITTO DENKO CORPORATION
- Tsubasa OMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF M...
- Publication number 20250157989
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING TH...
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- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP DIE BACK-SIDE MARKING FOR MEMORY SYSTEMS
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- Micron Technology, Inc.
- Po Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
- Publication number 20250149488
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
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- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FLIP CHIP PACKAGING
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- YIN-JUI SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
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- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector being supplied to the parts to be connected in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Joint structure in semiconductor package and manufacturing method t...

Hybrid integrated circuit packages

Thermocompression bonding with passivated silver-based contacting m...

Thermocompression bonding with passivated gold contacting metal

Thermocompression bonding with passivated tin-based contacting metal

Bump to package substrate solder joint

Resin shaping device

Chip packaging structure and related inner lead bonding method

Semiconductor device and method of forming microelectromechanical s...

Die attached leveling control by metal stopper bumps

System and method for superconducting multi-chip module

Wiring board, semiconductor device, and method of manufacturing wir...

Devices with conductive or magnetic nanowires for localized heating...

Conductive adhesive composition, and method for producing connectio...

Integrated circuit package and method of forming same

Method for forming chip packages and a chip package

Semiconductor packages and methods of forming same

Method for packaging stacking flip chip

Micro-LED mounting substrate, micro-led display, and method of manu...

Adhesive for semiconductor, production method therefor, and semicon...

Metal-bump sidewall protection

Window assemblies, imaging system including the same, method of man...

Flip-chip package assembly

Package process and package structure

Semiconductor package and method of forming the same

Integrated structure with bifunctional routing and assembly compris...

Package structure, RDL structure comprising redistribution layer ha...

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Patents Applicationslast 30 patents

Semiconductor Packages and Methods of Forming Same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR MODULE AND METHOD OF PRODUCING SEMICONDUCTOR MODULE

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

METHOD OF BONDING LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

Wafer Level Integration of Passive Devices

MANUFACTURING METHOD OF PACKAGE DEVICE

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH SIGNAL INTEGRATION AND THE METHODS OF M...

SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING TH...

TOP DIE BACK-SIDE MARKING FOR MEMORY SYSTEMS

BONDING SCHEME FOR SEMICONDUCTOR PACKAGING

METHOD AND SYSTEM FOR DIE BONDING

PROCESS FOR FLIP CHIP PACKAGING

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...