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ELECTRICITY
H01
Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/811
the bump connector being supplied to the parts to be connected in the bonding apparatus
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last 30 patents
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Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and methods of manufacture
Patent number
11,978,720
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Kai Jun Zhan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing substrate structure with filling material f...
Patent number
11,973,014
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chang-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for transferring electronic device
Patent number
11,973,054
Issue date
Apr 30, 2024
Stroke Precision Advanced Engineering Co., Ltd.
Yu-Min Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Array substrate and method of mounting integrated circuit using the...
Patent number
11,967,597
Issue date
Apr 23, 2024
Samsung Display Co., Ltd.
Dae Geun Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Solderless interconnection structure and method of forming same
Patent number
11,961,810
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company
Yu-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
Patent number
11,955,346
Issue date
Apr 9, 2024
Micron Technology, Inc.
Shijian Luo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced bump height variation
Patent number
11,935,866
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
Patent number
11,929,349
Issue date
Mar 12, 2024
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Die attached leveling control by metal stopper bumps
Patent number
11,923,331
Issue date
Mar 5, 2024
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for repairing a light-emitting device and a method for manuf...
Patent number
11,916,041
Issue date
Feb 27, 2024
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device interconnection systems and methods
Patent number
11,916,039
Issue date
Feb 27, 2024
Teledyne FLIR Commercial Systems, Inc.
Richard E. Bornfreund
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
Patent number
11,908,820
Issue date
Feb 20, 2024
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Microelectronic assemblies
Patent number
11,901,330
Issue date
Feb 13, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multilayer substrate
Patent number
11,901,325
Issue date
Feb 13, 2024
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with routing patch and conductive interconnec...
Patent number
11,901,335
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
Patent number
11,894,330
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level heterogeneous dies integration structure and method
Patent number
11,887,964
Issue date
Jan 30, 2024
ZHEJIANG LAB
Shunbin Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with through-mold via
Patent number
11,869,829
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Joo Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
11,869,879
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Hybrid felts of electrospun nanofibers
Patent number
RE49773
Issue date
Jan 2, 2024
NANOPAREIL, LLC
Todd J. Menkhaus
Information
Patent Grant
Methods of embedding magnetic structures in substrates
Patent number
11,862,552
Issue date
Jan 2, 2024
Intel Corporation
Sai Vadlamani
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for assembling components implementing a pre-treatment of th...
Patent number
11,855,038
Issue date
Dec 26, 2023
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Olivier Castany
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Integrated circuit device, device, and manufacturing method
Patent number
11,854,957
Issue date
Dec 26, 2023
Seiko Epson Corporation
Naoki Il
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,848,346
Issue date
Dec 19, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pillars as stops for precise chip-to-chip separation
Patent number
11,842,973
Issue date
Dec 12, 2023
Google LLC
Erik Anthony Lucero
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
Patent number
11,842,972
Issue date
Dec 12, 2023
Rohm Co., Ltd.
Kazumasa Tanida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Seal ring structures and methods of forming same
Patent number
11,842,992
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Ming Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
Publication number
20240162163
Publication date
May 16, 2024
TEXAS INSTRUMENTS INCORPORATED
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
Publication number
20240162183
Publication date
May 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240162184
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Sang-Sick Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
Publication number
20240162179
Publication date
May 16, 2024
Google LLC
Erik Anthony Lucero
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
Publication number
20240153908
Publication date
May 9, 2024
HKC Corporation Limited
YANG PU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240145418
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Junghoo Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240136323
Publication date
Apr 25, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Publication number
20240136322
Publication date
Apr 25, 2024
LG Innotek Co., Ltd.
Tae Sup CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
Publication number
20240112966
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
Publication number
20240107780
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP FABRICATION METHOD AND PRODUCT
Publication number
20240071944
Publication date
Feb 29, 2024
IQM Finland Oy
Máté JENEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Structure with Warpage Tuning Layer
Publication number
20240063083
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chieh-Lung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240055385
Publication date
Feb 15, 2024
WISTRON NEWEB CORPORATION
KUO-HUA HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
Publication number
20240055384
Publication date
Feb 15, 2024
Rohm Co., Ltd.
Kazumasa Tanida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240047446
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTED STRUCTURE, LED DISPLAY, AND MOUNTING METHOD
Publication number
20240038951
Publication date
Feb 1, 2024
DAICEL CORPORATION
Hiroto MIYAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD
Publication number
20240021578
Publication date
Jan 18, 2024
ZHEJIANG LAB
Shunbin LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
Publication number
20240021567
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Jhih Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...
Publication number
20240006370
Publication date
Jan 4, 2024
STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
ZELONG YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
Publication number
20230395766
Publication date
Dec 7, 2023
TDK Corporation
Tomohisa MITOSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...
Publication number
20230395549
Publication date
Dec 7, 2023
Hewlett-Packard Development Company, L.P.
DAVID WAYNE GEORGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP DIE ALIGNMENT
Publication number
20230378081
Publication date
Nov 23, 2023
International Business Machines Corporation
Effendi Leobandung
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
Publication number
20230380302
Publication date
Nov 23, 2023
Daniel Yohannes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
Publication number
20230369182
Publication date
Nov 16, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Marc Alan Mangrum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
Publication number
20230369071
Publication date
Nov 16, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
Publication number
20230352437
Publication date
Nov 2, 2023
Meta Platforms Technologies, LLC
Daniel Brodoceanu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
Publication number
20230352441
Publication date
Nov 2, 2023
TEXAS INSTRUMENTS INCORPORATED
Dolores Milo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
Publication number
20230343803
Publication date
Oct 26, 2023
Sony Semiconductor Solutions Corporation
Toshiaki IWAFUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
Publication number
20230335411
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Ching HSU
H01 - BASIC ELECTRIC ELEMENTS