the bump connector connecting between different semiconductor or solid-state bodies

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H01L2224/16135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16135the bump connector connecting between different semiconductor or solid-state bodies

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor integrated in system on chip (SOC) device
- Patent number 11,469,295
- Issue date Oct 11, 2022
- MARVELL ASIA PTE. LTD.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module
- Patent number 10,492,300
- Issue date Nov 26, 2019
- Toshiba Hokuto Electronics Corporation
- Keiichi Maki
- F21 - LIGHTING
Information Patent Grant
Integration of laminate MEMS in BBUL coreless package
- Patent number 9,708,178
- Issue date Jul 18, 2017
- Intel Corporation
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including stacked semiconductor chips and a r...
- Patent number 9,496,216
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- Sung-Hoon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode array module and method for manufacturing same
- Patent number 9,496,298
- Issue date Nov 15, 2016
- Hamamatsu Photonics K.K.
- Masatoshi Ishihara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Technique for controlling positions of stacked dies
- Patent number 9,209,165
- Issue date Dec 8, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ramp-stack chip package with static bends
- Patent number 8,283,766
- Issue date Oct 9, 2012
- Oracle America, Inc.
- John A. Harada
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS
- Publication number 20240312941
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20240096849
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230121888
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Minsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE
- Publication number 20140203379
- Publication date Jul 24, 2014
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTODIODE ARRAY MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140008754
- Publication date Jan 9, 2014
- Hamamatsu Photonics K.K.
- Masatoshi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Stacked Semiconductor Chips and a R...
- Publication number 20130161788
- Publication date Jun 27, 2013
- Sung-Hoon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH STATIC BENDS
- Publication number 20120056327
- Publication date Mar 8, 2012
- Oracle International Corporation
- John A. Harada
- G02 - OPTICS

the bump connector connecting between different semiconductor or solid-state bodies

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of manufacturing semiconductor device with bump interconnec...

Decoupling capacitor integrated in system on chip (SOC) device

Light-emitting module

Integration of laminate MEMS in BBUL coreless package

Semiconductor package including stacked semiconductor chips and a r...

Photodiode array module and method for manufacturing same

Technique for controlling positions of stacked dies

Ramp-stack chip package with static bends

Patents Applicationslast 30 patents

ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS

SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...

SEMICONDUCTOR PACKAGE

INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE

PHOTODIODE ARRAY MODULE AND METHOD FOR MANUFACTURING SAME

Semiconductor Package Including Stacked Semiconductor Chips and a R...

RAMP-STACK CHIP PACKAGE WITH STATIC BENDS