the bump connector connecting between different semiconductor or solid-state bodies

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H01L2224/16135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16135the bump connector connecting between different semiconductor or solid-state bodies

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Patents Grantslast 30 patents

Information Patent Grant
Decoupling capacitor integrated in system on chip (SOC) device
- Patent number 11,469,295
- Issue date Oct 11, 2022
- MARVELL ASIA PTE. LTD.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module
- Patent number 10,492,300
- Issue date Nov 26, 2019
- Toshiba Hokuto Electronics Corporation
- Keiichi Maki
- F21 - LIGHTING
Information Patent Grant
Integration of laminate MEMS in BBUL coreless package
- Patent number 9,708,178
- Issue date Jul 18, 2017
- Intel Corporation
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including stacked semiconductor chips and a r...
- Patent number 9,496,216
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- Sung-Hoon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodiode array module and method for manufacturing same
- Patent number 9,496,298
- Issue date Nov 15, 2016
- Hamamatsu Photonics K.K.
- Masatoshi Ishihara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Technique for controlling positions of stacked dies
- Patent number 9,209,165
- Issue date Dec 8, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ramp-stack chip package with static bends
- Patent number 8,283,766
- Issue date Oct 9, 2012
- Oracle America, Inc.
- John A. Harada
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20240096849
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230121888
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Minsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF LAMINATE MEMS IN BBUL CORELESS PACKAGE
- Publication number 20140203379
- Publication date Jul 24, 2014
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTODIODE ARRAY MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140008754
- Publication date Jan 9, 2014
- Hamamatsu Photonics K.K.
- Masatoshi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Stacked Semiconductor Chips and a R...
- Publication number 20130161788
- Publication date Jun 27, 2013
- Sung-Hoon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH STATIC BENDS
- Publication number 20120056327
- Publication date Mar 8, 2012
- Oracle International Corporation
- John A. Harada
- G02 - OPTICS