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Semiconductor package
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Patent number 12,272,652
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Issue date Apr 8, 2025
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Samsung Electronics Co., Ltd.
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Jiwon Shin
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,261,103
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Issue date Mar 25, 2025
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Samsung Electronics Co., Ltd.
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Yonghwan Kwon
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package
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Patent number 12,261,106
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Issue date Mar 25, 2025
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Samsung Electronics Co., Ltd.
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Hyeonjeong Hwang
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H01 - BASIC ELECTRIC ELEMENTS
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Terminal and connection method
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Patent number 12,261,138
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Issue date Mar 25, 2025
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SONY SEMICONDUCTOR SOLUTIONS CORPORATION
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Jo Umezawa
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H01 - BASIC ELECTRIC ELEMENTS
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Chip package structure
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Patent number 12,255,173
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Issue date Mar 18, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd
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Ling-Wei Li
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H01 - BASIC ELECTRIC ELEMENTS
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Game engine on a chip
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Patent number 12,249,018
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Issue date Mar 11, 2025
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TMRW FOUNDATION IP S.ÀR.L.
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Cevat Yerli
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G06 - COMPUTING CALCULATING COUNTING
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Semiconductor device
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Patent number 12,249,563
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Issue date Mar 11, 2025
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Samsung Electronics Co., Ltd.
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Donguk Kim
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H01 - BASIC ELECTRIC ELEMENTS
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