the bump connector connecting to a bond pad of the item

Industry

CPC
H01L2224/16227

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16227the bump connector connecting to a bond pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer stacking structure and manufacturing method thereof
- Patent number 11,967,558
- Issue date Apr 23, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 11,967,567
- Issue date Apr 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional IC package with thermal enhancement
- Patent number 11,967,538
- Issue date Apr 23, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,961,804
- Issue date Apr 16, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 11,961,822
- Issue date Apr 16, 2024
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package including a redistribution substrate and a me...
- Patent number 11,961,793
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package including under-bump metallurgy
- Patent number 11,961,792
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having substrate with electrically floating vias
- Patent number 11,955,417
- Issue date Apr 9, 2024
- Industrial Technology Research Institute
- Tsung-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,401
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control element utilized in device die packages
- Patent number 11,955,406
- Issue date Apr 9, 2024
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture to manage FLI bump height delta and reliability needs...
- Patent number 11,955,448
- Issue date Apr 9, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,955,442
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package including glass substrate and a plurality of r...
- Patent number 11,955,499
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136307
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136340
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Mina Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136266
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240136273
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240136293
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20240136323
- Publication date Apr 25, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136331
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyun Soo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240136334
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240136312
- Publication date Apr 25, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR
- Publication number 20240136238
- Publication date Apr 25, 2024
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128174
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SIZE PACKAGE AND SYSTEM
- Publication number 20240128203
- Publication date Apr 18, 2024
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY...
- Publication number 20240130144
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Dong Joo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240128150
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240128153
- Publication date Apr 18, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128195
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sangwoong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
- Publication number 20240128205
- Publication date Apr 18, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...
- Publication number 20240128230
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sinyeop LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128239
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
- Publication number 20240128209
- Publication date Apr 18, 2024
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Edward Preisler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128172
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Inwon O
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer stacking structure and manufacturing method thereof

Structure and method for fabricating a computing system with an int...

Fabric-based items with electrical component arrays

Semiconductor package with EMI shield and fabricating method thereof

Semiconductor package having improved thermal interface between sem...

Three dimensional IC package with thermal enhancement

3DIC packaging with hot spot thermal management features

Semiconductor package and fabricating method thereof

Semiconductor device and manufacturing method thereof

Efficient wave guide transition between package and PCB using solde...

Solderless interconnection structure and method of forming same

Size and efficiency of dies

Devices and methods related to dual-sided radio-frequency package w...

Display device, and tiled display device including the display device

Semiconductor package including a redistribution substrate and a me...

Fan-out semiconductor package including under-bump metallurgy

Dual metal gate structure having portions of metal gate layers in c...

Ultra small molded module integrated with die by module-on-wafer as...

Memories and memory components with interconnected and redundant da...

Heterogeneous metal line compositions for advanced integrated circu...

Electronic component apparatus having a first lead frame and a seco...

Electronic device having substrate with electrically floating vias

Semiconductor device with a multi-layered encapsulant and associate...

Package structure

Temperature control element utilized in device die packages

Regulator circuit package techniques

Architecture to manage FLI bump height delta and reliability needs...

Semiconductor package and method

Semiconductor chip having stepped conductive pillars

Image sensor package including glass substrate and a plurality of r...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

MICROELECTRONIC ASSEMBLIES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE

CHIP SIZE PACKAGE AND SYSTEM

SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY...

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

SEMICONDUCTOR POWER DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

MULTI-CHIP PACKAGING

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHO...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

Efficient Integration of a First Substrate without Solder Bumps wit...

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE