the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

CPC
H01L2224/16237

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16237the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die with embedded communication cavity
- Patent number 11,978,948
- Issue date May 7, 2024
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,948,852
- Issue date Apr 2, 2024
- ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,894,306
- Issue date Feb 6, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component, wherein a semiconduct...
- Patent number 11,842,980
- Issue date Dec 12, 2023
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and apparatuses for implementing a pad on solder mask (POSM...
- Patent number 11,823,994
- Issue date Nov 21, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor
- Patent number 11,810,863
- Issue date Nov 7, 2023
- TDK TAIWAN CORP.
- An-Ping Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for signal integrity protection technique
- Patent number 11,798,894
- Issue date Oct 24, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and semiconductor packages including the same
- Patent number 11,742,294
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including penetratio...
- Patent number 11,728,245
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor module and method of manufacturing the same
- Patent number 11,722,800
- Issue date Aug 8, 2023
- Sony Group Corporation
- Shin Iwabuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electro-magne...
- Patent number 11,721,639
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips and dummy pad
- Patent number 11,664,346
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,658,137
- Issue date May 23, 2023
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145455
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
- Publication number 20240105655
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240096725
- Publication date Mar 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Dae Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION P...
- Publication number 20240047335
- Publication date Feb 8, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240038550
- Publication date Feb 1, 2024
- InnoLux Corporation
- Chin-Lung TING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
- Publication number 20240021538
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240014095
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE
- Publication number 20240006371
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
- Publication number 20230420345
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230411171
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...
- Publication number 20230411269
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, DATA DRIVING APPARATUS, AND CHIP-ON-FILM PACKAGE
- Publication number 20230402419
- Publication date Dec 14, 2023
- LX Semicon Co., Ltd.
- Yong Sung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
- Publication number 20230395766
- Publication date Dec 7, 2023
- TDK Corporation
- Tomohisa MITOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395484
- Publication date Dec 7, 2023
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Stacking Architecture Through TSV and Methods Forming Same
- Publication number 20230395517
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230387063
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIM PACKAGES AND METHOD FORMING SAME
- Publication number 20230378020
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...
- Publication number 20230369156
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230352411
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Yunseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20230335467
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bonding area disposed in a recess of the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die with embedded communication cavity

Semiconductor device and manufacturing method thereof

Semiconductor device package

Multilayer substrate

Semiconductor device and manufacturing method thereof

Chip package

Manufacturing method of package structure

Semiconductor device with through-mold via

Semiconductor device and package assembly including the same

Semiconductor package having an encapsulant comprising conductive f...

Method for producing an electronic component, wherein a semiconduct...

Semiconductor device and method of forming a 3D interposer system-i...

Systems and apparatuses for implementing a pad on solder mask (POSM...

Semiconductor device comprising a can housing a semiconductor die w...

Sensor

Semiconductor packages

Hybrid bonding structures and semiconductor devices including the same

Devices and methods for signal integrity protection technique

Direct bonded heterogeneous integration silicon bridge

Interposers and semiconductor packages including the same

Micro device integration into system substrate

Semiconductor device and semiconductor package including penetratio...

Semiconductor image sensor module and method of manufacturing the same

Multi-component modules (MCMs) including configurable electro-magne...

Package structure and manufacturing method thereof

Fan-out interconnect integration processes and structures

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor package including semiconductor chips and dummy pad

Forming recesses in molding compound of wafer to reduce stress

Semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION P...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGES

MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...

INTEGRATED CIRCUIT, DATA DRIVING APPARATUS, AND CHIP-ON-FILM PACKAGE

MOUNTING BOARD AND CIRCUIT BOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

3D Stacking Architecture Through TSV and Methods Forming Same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

MULTI-TIM PACKAGES AND METHOD FORMING SAME

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER