the bump connector connecting to a bonding area protruding from the surface of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16168the bump connector connecting to a bonding area protruding from the surface of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,749,595
- Issue date Sep 5, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,069,606
- Issue date Jul 20, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,510,653
- Issue date Dec 17, 2019
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with enhanced package integration level and ther...
- Patent number 10,217,686
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with dual signal-transition sides
- Patent number 10,217,685
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,192,815
- Issue date Jan 29, 2019
- Shinko Electric Industries Co., Ltd.
- Kosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,103,095
- Issue date Oct 16, 2018
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film RDL for IC package
- Patent number 9,502,321
- Issue date Nov 22, 2016
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for semiconductor package
- Patent number 9,355,977
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and fabrication method thereof
- Patent number 9,343,387
- Issue date May 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chu-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level device packaging
- Patent number 9,117,715
- Issue date Aug 25, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for semiconductor package
- Patent number 8,970,035
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014163
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jong Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384381
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...
- Publication number 20220328371
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20200035594
- Publication date Jan 30, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20180366404
- Publication date Dec 20, 2018
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20180102312
- Publication date Apr 12, 2018
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20170263545
- Publication date Sep 14, 2017
- Shinko Electric Industries Co., Ltd.
- Kosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160163632
- Publication date Jun 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Hsien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structures for Semiconductor Package
- Publication number 20150171038
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structures for Semiconductor Package
- Publication number 20140061897
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DEVICE PACKAGING
- Publication number 20140021596
- Publication date Jan 23, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device package and method of manufacturing the same

Fabrication process and structure of fine pitch traces for a solid...

Multilayered transient liquid phase bonding

Semiconductor structure having a dielectric layer edge covering cir...

Fabrication process and structure of fine pitch traces for a solid...

Fabrication process and structure of fine pitch traces for a solid...

Air-cavity package with enhanced package integration level and ther...

Air-cavity package with dual signal-transition sides

Wiring board and semiconductor device

Fabrication process and structure of fine pitch traces for a solid...

IC structure with angled interconnect elements

Thin film RDL for IC package

Bump structures for semiconductor package

Package on package structure and fabrication method thereof

Wafer-level device packaging

Bump structures for semiconductor package

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

WIRING BOARD AND SEMICONDUCTOR DEVICE

PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME

Bump Structures for Semiconductor Package

Bump Structures for Semiconductor Package

WAFER-LEVEL DEVICE PACKAGING