the bump connector connecting to a bonding area protruding from the surface of the item

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H01L2224/16268

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16268the bump connector connecting to a bonding area protruding from the surface of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration of passive devices
- Patent number 11,398,456
- Issue date Jul 26, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with capacitive and enhanced induc...
- Patent number 10,910,305
- Issue date Feb 2, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,861,832
- Issue date Dec 8, 2020
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,714,452
- Issue date Jul 14, 2020
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solenoid structure with conductive pillar technology
- Patent number 10,693,432
- Issue date Jun 23, 2020
- QUALCOMMM Incorporated
- Nosun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,600,708
- Issue date Mar 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Wen-Shan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration of passive devices
- Patent number 10,468,381
- Issue date Nov 5, 2019
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer, package structure and method of manufacturing the same
- Patent number 9,947,640
- Issue date Apr 17, 2018
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,793,234
- Issue date Oct 17, 2017
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising a capacitor that includes multiple pin...
- Patent number 9,704,796
- Issue date Jul 11, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to integrate different function devices fabricated by differ...
- Patent number 9,337,182
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated passive devices on glass substrates
- Patent number 9,184,154
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attaching passive components to a semiconductor package
- Patent number 9,171,744
- Issue date Oct 27, 2015
- Marvell World Trade Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 8,492,907
- Issue date Jul 23, 2013
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Varistor
- Patent number 7,994,894
- Issue date Aug 9, 2011
- TDK Corporation
- Hiroyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric porcelain composition and electronic component
- Patent number 7,781,360
- Issue date Aug 24, 2010
- NGK Insulators, Ltd.
- Tomoyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor built-in interposer and method of manufacturing the same...
- Patent number 7,755,910
- Issue date Jul 13, 2010
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-built-in type printed wiring substrate, printed wiring su...
- Patent number 7,239,014
- Issue date Jul 3, 2007
- NGK Spark Plug Co., Ltd.
- Kouki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-built-in type printed wiring substrate, printed wiring su...
- Patent number 6,952,049
- Issue date Oct 4, 2005
- NGK Spark Plug Co., Ltd.
- Kouki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance via capacitor and method for manufacturing same
- Patent number 6,525,922
- Issue date Feb 25, 2003
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20220320048
- Publication date Oct 6, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURE
- Publication number 20220246500
- Publication date Aug 4, 2022
- PRAGMATIC PRINTING LTD.
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) US...
- Publication number 20210384292
- Publication date Dec 9, 2021
- QUALCOMM Incorporated
- Karim ARABI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200328182
- Publication date Oct 15, 2020
- Intel IP Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION OF PASSIVE DEVICES
- Publication number 20200027861
- Publication date Jan 23, 2020
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLENOID STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY
- Publication number 20190356294
- Publication date Nov 21, 2019
- QUALCOMM Incorporated
- Nosun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH CAPACITIVE AND ENHANCED INDUC...
- Publication number 20190326213
- Publication date Oct 24, 2019
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
- Publication number 20180277512
- Publication date Sep 27, 2018
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20180204825
- Publication date Jul 19, 2018
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180190623
- Publication date Jul 5, 2018
- UNITED MICROELECTRONICS CORP.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND PACKAGE SUBSTRATE
- Publication number 20170186709
- Publication date Jun 29, 2017
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160315061
- Publication date Oct 27, 2016
- XINTEC INC.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20160035689
- Publication date Feb 4, 2016
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATTACHING PASSIVE COMPONENTS TO A SEMICONDUCTOR PACKAGE
- Publication number 20150200114
- Publication date Jul 16, 2015
- Marvell World Trade Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO INTEGRATE DIFFERENT FUNCTION DEVICES FABRICATED BY DIFFER...
- Publication number 20140183611
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Integrated Passive Devices on Glass Substrates
- Publication number 20140134801
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Integrated Passive Devices on Glass Substrates
- Publication number 20120190152
- Publication date Jul 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, DICING TAPE-INT...
- Publication number 20120018903
- Publication date Jan 26, 2012
- Nitto Denko Corporation
- Naohide TAKAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ATTACHING PASSIVE COMPONENTS TO A SEMICONDUCTOR PACKAGE
- Publication number 20110169163
- Publication date Jul 14, 2011
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARISTOR
- Publication number 20100117782
- Publication date May 13, 2010
- TDK Corporation
- Hiroyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PORCELAIN COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20090011923
- Publication date Jan 8, 2009
- NGK Insulators, Ltd.
- Tomoyuki Hasegawa
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Capacitor built-in interposer and method of manufacturing the same...
- Publication number 20080030968
- Publication date Feb 7, 2008
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor-built-in-type printed wiring substrate printed wiring sub...
- Publication number 20050258548
- Publication date Nov 24, 2005
- NGK SPARK PLUG CO., LTD.
- Kouki Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High performance via capacitor and method for manufacturing same
- Publication number 20020085336
- Publication date Jul 4, 2002
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods of manufacturing semiconductor device with bump interconnec...

Methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Chip integration module, chip package structure, and chip integrati...

Wafer level integration of passive devices

Microelectronic devices designed with capacitive and enhanced induc...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Package structure and method of manufacturing the same

Embedded-bridge substrate connectors and methods of assembling same

Package structure and method of manufacturing the same

Solenoid structure with conductive pillar technology

Electronic package and method for fabricating the same

Structures and methods for low temperature bonding using nanoparticles

Wafer level integration of passive devices

Wafer, package structure and method of manufacturing the same

Chip package and manufacturing method thereof

Integrated device comprising a capacitor that includes multiple pin...

Method to integrate different function devices fabricated by differ...

Methods for fabricating integrated passive devices on glass substrates

Attaching passive components to a semiconductor package

Film for flip chip type semiconductor back surface, dicing tape-int...

Varistor

Dielectric porcelain composition and electronic component

Capacitor built-in interposer and method of manufacturing the same...

Capacitor-built-in type printed wiring substrate, printed wiring su...

Capacitor-built-in type printed wiring substrate, printed wiring su...

High performance via capacitor and method for manufacturing same

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

Wafer Level Integration of Passive Devices

FLEXIBLE ELECTRONIC STRUCTURE

INTEGRATION OF INDUCTORS WITH ADVANCED-NODE SYSTEM-ON-CHIP (SOC) US...

Structures And Methods For Low Temperature Bonding Using Nanoparticles

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

Structures And Methods For Low Temperature Bonding Using Nanoparticles

WAFER LEVEL INTEGRATION OF PASSIVE DEVICES

SOLENOID STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY

MICROELECTRONIC DEVICES DESIGNED WITH CAPACITIVE AND ENHANCED INDUC...

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF CHIP PACKAGE AND PACKAGE SUBSTRATE

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...

ATTACHING PASSIVE COMPONENTS TO A SEMICONDUCTOR PACKAGE

METHOD TO INTEGRATE DIFFERENT FUNCTION DEVICES FABRICATED BY DIFFER...

Methods for Fabricating Integrated Passive Devices on Glass Substrates

Methods for Fabricating Integrated Passive Devices on Glass Substrates

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, DICING TAPE-INT...

ATTACHING PASSIVE COMPONENTS TO A SEMICONDUCTOR PACKAGE

VARISTOR

DIELECTRIC PORCELAIN COMPOSITION AND ELECTRONIC COMPONENT

Capacitor built-in interposer and method of manufacturing the same...

Capacitor-built-in-type printed wiring substrate printed wiring sub...

High performance via capacitor and method for manufacturing same