the bump connector connecting to a bonding area protruding from the surface of the item

Industry

CPC
H01L2224/16258

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16258the bump connector connecting to a bonding area protruding from the surface of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,119,288
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tapeless leadframe package with exposed integrated circuit die
- Patent number 11,916,090
- Issue date Feb 27, 2024
- STMicroelectronics, Inc.
- Aaron Cadag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package assembly
- Patent number 11,637,083
- Issue date Apr 25, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a reflow wall
- Patent number 11,437,333
- Issue date Sep 6, 2022
- Texas Instruments Incorporated
- Vikas Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having dies with connectors of differe...
- Patent number 11,183,473
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with multi-layer resin structure and semiconductor device...
- Patent number 10,943,857
- Issue date Mar 9, 2021
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance multi-component electronics power module
- Patent number 10,903,148
- Issue date Jan 26, 2021
- Microchip Technology Incorporated
- Man Kit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having dies with connectors of differe...
- Patent number 10,475,759
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flip chip systems
- Patent number 10,236,267
- Issue date Mar 19, 2019
- Kyocera International, Inc.
- Dinah Lieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor package and method...
- Patent number 10,002,843
- Issue date Jun 19, 2018
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip module with enhanced properties
- Patent number 9,960,145
- Issue date May 1, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip module with enhanced properties
- Patent number 9,929,125
- Issue date Mar 27, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip module with enhanced properties
- Patent number 9,899,350
- Issue date Feb 20, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame structure for light emitting diode
- Patent number 9,852,967
- Issue date Dec 26, 2017
- ECOCERA OPTRONICS CO., LTD.
- Yu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,653,444
- Issue date May 16, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,646,948
- Issue date May 9, 2017
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 9,343,334
- Issue date May 17, 2016
- Sumida Corporation
- Yasuo Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,269,699
- Issue date Feb 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for back surface of flip-chip semiconductor, dicing-tape-integ...
- Patent number 9,196,533
- Issue date Nov 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microelectronic flip chip packages with solder wetting pads and ass...
- Patent number 9,070,671
- Issue date Jun 30, 2015
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...
- Publication number 20240222139
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240213166
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASING TO ATTACH DIE TO LEAD FRAME
- Publication number 20240145419
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daiki KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
- Publication number 20240071998
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20230260958
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20230017846
- Publication date Jan 19, 2023
- Changxin Memory Technologies, Inc.
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...
- Publication number 20220336314
- Publication date Oct 20, 2022
- SMArim Global Corp.
- TIEN-LAI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20220320038
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE
- Publication number 20220005857
- Publication date Jan 6, 2022
- STMICROELECTRONICS, INC.
- Aaron CADAG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure Having Dies with Connectors of Differe...
- Publication number 20200043879
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE INCLUDING FAN-OUT MEMO...
- Publication number 20160329298
- Publication date Nov 10, 2016
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD...
- Publication number 20160284659
- Publication date Sep 29, 2016
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Tien-Szu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-...
- Publication number 20160141233
- Publication date May 19, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Steve Xin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20160099237
- Publication date Apr 7, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160013161
- Publication date Jan 14, 2016
- SK HYNIX INC.
- Ki Il MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20150325559
- Publication date Nov 12, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20150235995
- Publication date Aug 20, 2015
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150200176
- Publication date Jul 16, 2015
- Sharp Kabushiki Kaisha
- Katsunori Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASS...
- Publication number 20150155226
- Publication date Jun 4, 2015
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASS...
- Publication number 20140377912
- Publication date Dec 25, 2014
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140353847
- Publication date Dec 4, 2014
- SK HYNIX INC.
- Ki Il Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20140015130
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASS...
- Publication number 20140004662
- Publication date Jan 2, 2014
- Monolithic Power Systems, Inc.
- Hunt Hang Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MARKING SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SE...
- Publication number 20130328217
- Publication date Dec 12, 2013
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEG...
- Publication number 20130095639
- Publication date Apr 18, 2013
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130065361
- Publication date Mar 14, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a bonding area protruding from the surface of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Tapeless leadframe package with exposed integrated circuit die

Flip-chip package assembly

Packaged semiconductor device with a reflow wall

Integrated circuit structure having dies with connectors of differe...

Substrate with multi-layer resin structure and semiconductor device...

High performance multi-component electronics power module

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Integrated circuit structure having dies with connectors of differe...

Microelectronic die packages with metal leads, including metal lead...

Wafer level flat no-lead semiconductor packages and methods of manu...

Methods of forming flip chip systems

Microelectronic die packages with metal leads, including metal lead...

Semiconductor substrate structure, semiconductor package and method...

Flip chip module with enhanced properties

Flip chip module with enhanced properties

Flip chip module with enhanced properties

Wafer level flat no-lead semiconductor packages and methods of manu...

Lead frame structure for light emitting diode

Embedded package and method thereof

Microelectronic die packages with metal leads, including metal lead...

Electronic component and method for manufacturing electronic component

Semiconductor device

Semiconductor device

Electronic component and method for manufacturing electronic component

Embedded package and method thereof

Film for back surface of flip-chip semiconductor, dicing-tape-integ...

Microelectronic flip chip packages with solder wetting pads and ass...

Patents Applicationslast 30 patents

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

LASING TO ATTACH DIE TO LEAD FRAME

INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...

Flip-Chip Package Assembly

PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME

CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD T...

Flip-Chip Package Assembly

TAPELESS LEADFRAME PACKAGE WITH EXPOSED INTEGRATED CIRCUIT DIE

Integrated Circuit Structure Having Dies with Connectors of Differe...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE INCLUDING FAN-OUT MEMO...

SEMICONDUCTOR SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD...

FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

SEMICONDUCTOR PACKAGE

EMBEDDED PACKAGE AND METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASS...

MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASS...

SEMICONDUCTOR PACKAGE

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC FLIP CHIP PACKAGES WITH SOLDER WETTING PADS AND ASS...

METHOD OF MARKING SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SE...

FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEG...

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME