the bump connector connecting to a pin of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1623the bump connector connecting to a pin of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems for semiconductor package mounting with improved co-planarity
- Patent number 12,327,782
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package assembly lid and methods for forming the same
- Patent number 12,322,666
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit packages and fabrication methods using bond-on-pad (BoP) su...
- Patent number 12,322,690
- Issue date Jun 3, 2025
- Avago Technologies International Sales Pte. Limited
- Wen-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including lid with additional stress mitigating fe...
- Patent number 12,315,768
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
- Patent number 12,300,772
- Issue date May 13, 2025
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 12,300,509
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Junyong Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using discrete thermal interface m...
- Patent number 12,300,568
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 12,300,652
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,293,989
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED mounting substrate, micro-led display, and method of manu...
- Patent number 12,288,769
- Issue date Apr 29, 2025
- SHARP KABUSHIKI KAISHA
- Yoshiyuki Harumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated capacitors
- Patent number 12,288,756
- Issue date Apr 29, 2025
- Chipletz, Inc.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...
- Publication number 20250192017
- Publication date Jun 12, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192016
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192011
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...
- Publication number 20250192099
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Ashish Alawani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250183121
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250183142
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING
- Publication number 20250183145
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...
- Publication number 20250183237
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250174583
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Kazuya OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250176111
- Publication date May 29, 2025
- Samsung Electronics Co., LTD
- Kyoungok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20250167123
- Publication date May 22, 2025
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
- Publication number 20250167142
- Publication date May 22, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20250167048
- Publication date May 22, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250167162
- Publication date May 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Hsin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems for semiconductor package mounting with improved co-planarity

Semiconductor device and manufacturing method thereof

Die coupling using a substrate with a glass core

Device and method for UBM/RDL routing

Semiconductor device and method of forming microelectromechanical s...

Package assembly lid and methods for forming the same

Circuit packages and fabrication methods using bond-on-pad (BoP) su...

Semiconductor device package

Package assembly including lid with additional stress mitigating fe...

Wiring board, semiconductor device, and method of manufacturing wir...

Electronic component module, sub-module, and method for manufacturi...

Structures to increase substrate routing density and methods of for...

Semiconductor package

Molded product for semiconductor strip and method of manufacturing...

Electronic package

Semiconductor package structure

Light-emitting device, manufacturing method thereof and display mod...

Semiconductor package

Aligning bumps in fan-out packaging process

Devices with conductive or magnetic nanowires for localized heating...

Method of manufacturing semiconductor package

Solid metal foam thermal interface material

High efficiency heat dissipation using discrete thermal interface m...

Substrate and package structure

Semiconductor package and method

Integrated circuit package and method of forming same

Semiconductor package

Micro-LED mounting substrate, micro-led display, and method of manu...

Semiconductor package with integrated capacitors

Semiconductor package

Patents Applicationslast 30 patents

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER

ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...

3D STACK PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT(IC) PACKAGE HAVING A SUBSTRATE EMPLOYING REDUCED...

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

COMBINED FRONTSIDE/BACKSIDE POWER SUPPLY FOR CHARGE SHARING

PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTO...

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS

Structure and Method for Fabricating a Computing System with an Int...

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

ELECTRONIC DEVICE

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

Wafer Level Integration of Passive Devices

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

PACKAGE STRUCTURE FOR HEAT DISSIPATION

MANUFACTURING METHOD OF PACKAGE DEVICE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET