the bump connector connecting to a pin of the item

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CPC
H01L2224/1623

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1623the bump connector connecting to a pin of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 12,125,764
- Issue date Oct 22, 2024
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with cavity in interposer
- Patent number 12,125,755
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer system-level three-dimensional fan-out three-dimensional fan-...
- Patent number 12,119,295
- Issue date Oct 15, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,113,006
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,113,027
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component modules (MCMs) including configurable electromagnet...
- Patent number 12,100,669
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Jay Scott Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Size and efficiency of dies
- Patent number 12,094,827
- Issue date Sep 17, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,080,701
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling warpage during LAB
- Patent number 12,074,135
- Issue date Aug 27, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,068,297
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 12,062,618
- Issue date Aug 13, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,057,424
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,425
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Eunyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347492
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
- Publication number 20240347435
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY
- Publication number 20240339412
- Publication date Oct 10, 2024
- Intel Corporation
- Cary KULIASHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240332221
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Seungyoung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING
- Publication number 20240332252
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE T...
- Publication number 20240332195
- Publication date Oct 3, 2024
- Intel Corporation
- Naiya SOETAN-DODD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
- Publication number 20240332203
- Publication date Oct 3, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...
- Publication number 20240321709
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321669
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321673
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY
- Publication number 20240321660
- Publication date Sep 26, 2024
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321815
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compartment Shielding fo...
- Publication number 20240321845
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCI...
- Publication number 20240312856
- Publication date Sep 19, 2024
- MURATA MANUFACTURING CO., LTD.
- Hiroki YOSHIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240312864
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240297120
- Publication date Sep 5, 2024
- MEDIATEK INC.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20240297086
- Publication date Sep 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Bridge interconnection with layered interconnect structures

Semiconductor package and method of manufacturing semiconductor pac...

3D semiconductor device and structure with metal layers and memory...

Semiconductor device and method of forming hybrid TIM layers

Chip package structure with cavity in interposer

Wafer system-level three-dimensional fan-out three-dimensional fan-...

Semiconductor package

Three-dimensional integrated circuit structures and methods of form...

Chip package structure

Offset interposers for large-bottom packages and large-die package-...

Multi-component modules (MCMs) including configurable electromagnet...

Methods for producing a 3D semiconductor device and structure with...

Size and efficiency of dies

High density interconnect device and method

Embedded die microelectronic device with molded component

Semiconductor device assembly with surface-mount die support struct...

Supporting backplane, manufacturing method therefor and backplane

Microelectronic assemblies having an integrated capacitor

Bump structure having a side recess and semiconductor structure inc...

Conductive terminal for side facing packages

Semiconductor package

Fan-out interconnect integration processes and structures

Semiconductor device and method of controlling warpage during LAB

3D semiconductor device and structure with bonding and DRAM memory...

Hybrid integrated circuit package

Non-conductive film sheet and semiconductor package including the same

Chip package

Package structure and method for forming the same

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

CHIP PACKAGE HAVING MULTIPLE CHIPS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD

EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE T...

MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Forming Compartment Shielding fo...

SEMICONDUCTOR PACKAGE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

ELECTRONIC COMPONENT PACKAGE, CIRCUIT MODULE AND METHOD FOR PRODUCI...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE

ELECTRONIC PACKAGE