the bump connector connecting to a pin of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1616the bump connector connecting to a pin of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated self-aligned assembly
- Patent number 12,119,307
- Issue date Oct 15, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,051,649
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer
- Patent number 11,791,325
- Issue date Oct 17, 2023
- Samsung Electronics Co, Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 11,769,731
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,749,595
- Issue date Sep 5, 2023
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,682,613
- Issue date Jun 20, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
- Patent number 11,410,897
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with magnetic build-up layers
- Patent number 11,081,434
- Issue date Aug 3, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 11,069,606
- Issue date Jul 20, 2021
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,510,653
- Issue date Dec 17, 2019
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
- Patent number 10,366,965
- Issue date Jul 30, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with enhanced package integration level and ther...
- Patent number 10,217,686
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Walid M. Meliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity package with dual signal-transition sides
- Patent number 10,217,685
- Issue date Feb 26, 2019
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,192,815
- Issue date Jan 29, 2019
- Shinko Electric Industries Co., Ltd.
- Kosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to control movement and position of s...
- Patent number 10,186,497
- Issue date Jan 22, 2019
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
- Patent number 10,103,095
- Issue date Oct 16, 2018
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, display panel assembly, semiconductor structure
- Patent number 9,960,151
- Issue date May 1, 2018
- Novatek Microelectronics Corp.
- Chieh-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated DC-DC power converters
- Patent number 9,819,269
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
IC structure with angled interconnect elements
- Patent number 9,754,911
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with narrow-factor via including finish layer
- Patent number 9,603,247
- Issue date Mar 21, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
- Publication number 20240355746
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240112966
- Publication date Apr 4, 2024
- Azimuth Industrial Company, Inc.
- David Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240047385
- Publication date Feb 8, 2024
- Huawei Technologies Co., Ltd
- Kehan Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for Computing System Package
- Publication number 20240038669
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014163
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jong Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND EQUIPMENT
- Publication number 20240006389
- Publication date Jan 4, 2024
- Canon Kabushiki Kaisha
- HIROAKI KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230011353
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384381
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...
- Publication number 20220328371
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for Computing System Package
- Publication number 20220223530
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SELF-ALIGNED ASSEMBLY
- Publication number 20220122924
- Publication date Apr 21, 2022
- ROCKLEY PHOTONICS LIMITED
- Chia-Te CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20220028848
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- KIWON BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20200035594
- Publication date Jan 30, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190189577
- Publication date Jun 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
- Publication number 20190131271
- Publication date May 2, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20180366404
- Publication date Dec 20, 2018
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID
- Publication number 20180166356
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- Shahid A. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
- Publication number 20180102312
- Publication date Apr 12, 2018
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, DISPLAY PANEL ASSEMBLY, SEMICONDUCTOR STRUCTURE
- Publication number 20180040596
- Publication date Feb 8, 2018
- NOVATEK MICROELECTRONICS CORP.
- Chieh-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20170263545
- Publication date Sep 14, 2017
- Shinko Electric Industries Co., Ltd.
- Kosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...
- Publication number 20170229420
- Publication date Aug 10, 2017
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160163632
- Publication date Jun 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Hsien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER
- Publication number 20160044786
- Publication date Feb 11, 2016
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated self-aligned assembly

Semiconductor package and manufacturing method thereof

Through-hole electrode substrate

Architecture for computing system package

Package structure with a barrier layer

Electronic device package and method of manufacturing the same

Semiconductor package including interposer

Architecture for computing system package

Fabrication process and structure of fine pitch traces for a solid...

Package substrates with magnetic build-up layers

Multilayered transient liquid phase bonding

Method for forming package structure with a barrier layer

Semiconductor structure having a dielectric layer edge covering cir...

Through-hole electrode substrate

Package substrates with magnetic build-up layers

Fabrication process and structure of fine pitch traces for a solid...

Package structure with a barrier layer and method for forming the same

Through-hole electrode substrate

Through-hole electrode substrate

Fabrication process and structure of fine pitch traces for a solid...

Chip bonding apparatus, chip bonding method and a chip package stru...

Air-cavity package with enhanced package integration level and ther...

Air-cavity package with dual signal-transition sides

Wiring board and semiconductor device

Techniques and configurations to control movement and position of s...

Fabrication process and structure of fine pitch traces for a solid...

Semiconductor device, display panel assembly, semiconductor structure

3D integrated DC-DC power converters

IC structure with angled interconnect elements

Electronic package with narrow-factor via including finish layer

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

PACKAGE STRUCTURE WITH A BARRIER LAYER

MULTISIDED INTEGRATED CIRCUIT ASSEMBLY

SEMICONDUCTOR PACKAGE

FILTERING STRUCTURE AND ELECTRONIC DEVICE

Architecture for Computing System Package

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND EQUIPMENT

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...

Architecture for Computing System Package

INTEGRATED SELF-ALIGNED ASSEMBLY

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID

Fabrication Process and Structure of Fine Pitch Traces for a Solid...

SEMICONDUCTOR DEVICE, DISPLAY PANEL ASSEMBLY, SEMICONDUCTOR STRUCTURE

WIRING BOARD AND SEMICONDUCTOR DEVICE

TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...

PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME

ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER