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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/1616
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last 30 patents
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Patent Grant
Integrated self-aligned assembly
Patent number
12,119,307
Issue date
Oct 15, 2024
Rockley Photonics Limited
Chia-Te Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
12,113,044
Issue date
Oct 8, 2024
Advanced Semiconductor Engineering, Inc.
Shan-Bo Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-hole electrode substrate
Patent number
12,080,637
Issue date
Sep 3, 2024
Dai Nippon Printing Co., Ltd.
Satoru Kuramochi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture for computing system package
Patent number
12,051,649
Issue date
Jul 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with a barrier layer
Patent number
11,984,419
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and method of manufacturing the same
Patent number
11,855,034
Issue date
Dec 26, 2023
Advanced Semiconductor Engineering, Inc.
Chung-Hung Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including interposer
Patent number
11,791,325
Issue date
Oct 17, 2023
Samsung Electronics Co, Ltd.
Kiwon Baek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture for computing system package
Patent number
11,769,731
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
Patent number
11,749,595
Issue date
Sep 5, 2023
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrates with magnetic build-up layers
Patent number
11,682,613
Issue date
Jun 20, 2023
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayered transient liquid phase bonding
Patent number
11,546,998
Issue date
Jan 3, 2023
Skyworks Solutions, Inc.
Bradley Paul Barber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming package structure with a barrier layer
Patent number
11,469,203
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having a dielectric layer edge covering cir...
Patent number
11,410,897
Issue date
Aug 9, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-hole electrode substrate
Patent number
11,362,028
Issue date
Jun 14, 2022
Dai Nippon Printing Co., Ltd.
Satoru Kuramochi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrates with magnetic build-up layers
Patent number
11,081,434
Issue date
Aug 3, 2021
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
Patent number
11,069,606
Issue date
Jul 20, 2021
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with a barrier layer and method for forming the same
Patent number
10,811,377
Issue date
Oct 20, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-hole electrode substrate
Patent number
10,790,221
Issue date
Sep 29, 2020
Dai Nippon Printing Co., Ltd.
Satoru Kuramochi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-hole electrode substrate
Patent number
10,580,727
Issue date
Mar 3, 2020
Dai Nippon Printing Co., Ltd.
Satoru Kuramochi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
Patent number
10,510,653
Issue date
Dec 17, 2019
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
Patent number
10,366,965
Issue date
Jul 30, 2019
Industrial Technology Research Institute
Shu-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air-cavity package with enhanced package integration level and ther...
Patent number
10,217,686
Issue date
Feb 26, 2019
Qorvo US, Inc.
Walid M. Meliane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air-cavity package with dual signal-transition sides
Patent number
10,217,685
Issue date
Feb 26, 2019
Qorvo US, Inc.
Kevin J. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and semiconductor device
Patent number
10,192,815
Issue date
Jan 29, 2019
Shinko Electric Industries Co., Ltd.
Kosuke Tsukamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques and configurations to control movement and position of s...
Patent number
10,186,497
Issue date
Jan 22, 2019
Intel Corporation
Mark D. Summers
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabrication process and structure of fine pitch traces for a solid...
Patent number
10,103,095
Issue date
Oct 16, 2018
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, display panel assembly, semiconductor structure
Patent number
9,960,151
Issue date
May 1, 2018
Novatek Microelectronics Corp.
Chieh-Hsiang Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D integrated DC-DC power converters
Patent number
9,819,269
Issue date
Nov 14, 2017
International Business Machines Corporation
Hariklia Deligianni
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
IC structure with angled interconnect elements
Patent number
9,754,911
Issue date
Sep 5, 2017
GLOBALFOUNDRIES Inc.
David J. West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with narrow-factor via including finish layer
Patent number
9,603,247
Issue date
Mar 21, 2017
Intel Corporation
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
Publication number
20240387349
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
Publication number
20240355746
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
Publication number
20240312889
Publication date
Sep 19, 2024
Siliconware Precision Industries Co., Ltd.
Fang-Lin TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
Publication number
20240297138
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTISIDED INTEGRATED CIRCUIT ASSEMBLY
Publication number
20240112966
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240055338
Publication date
Feb 15, 2024
Samsung Electronics Co., Ltd.
Byungho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
Publication number
20240047385
Publication date
Feb 8, 2024
Huawei Technologies Co., Ltd
Kehan Sui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Architecture for Computing System Package
Publication number
20240038669
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240014163
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Jong Youn KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND EQUIPMENT
Publication number
20240006389
Publication date
Jan 4, 2024
Canon Kabushiki Kaisha
HIROAKI KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230011353
Publication date
Jan 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220384381
Publication date
Dec 1, 2022
Advanced Semiconductor Engineering, Inc.
Chung-Hung LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
Publication number
20220367398
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING DIELECTRIC L...
Publication number
20220328371
Publication date
Oct 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Architecture for Computing System Package
Publication number
20220223530
Publication date
Jul 14, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED SELF-ALIGNED ASSEMBLY
Publication number
20220122924
Publication date
Apr 21, 2022
ROCKLEY PHOTONICS LIMITED
Chia-Te CHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
Publication number
20220028848
Publication date
Jan 27, 2022
Samsung Electronics Co., Ltd.
KIWON BAEK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
Publication number
20210035937
Publication date
Feb 4, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
Publication number
20200035594
Publication date
Jan 30, 2020
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20190189577
Publication date
Jun 20, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
Publication number
20190131271
Publication date
May 2, 2019
Industrial Technology Research Institute
Shu-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
Publication number
20180366404
Publication date
Dec 20, 2018
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID
Publication number
20180166356
Publication date
Jun 14, 2018
GLOBALFOUNDRIES INC.
Shahid A. Butt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication Process and Structure of Fine Pitch Traces for a Solid...
Publication number
20180102312
Publication date
Apr 12, 2018
Compass Technology Company Limited
Kelvin Po Leung Pun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, DISPLAY PANEL ASSEMBLY, SEMICONDUCTOR STRUCTURE
Publication number
20180040596
Publication date
Feb 8, 2018
NOVATEK MICROELECTRONICS CORP.
Chieh-Hsiang Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
Publication number
20170263545
Publication date
Sep 14, 2017
Shinko Electric Industries Co., Ltd.
Kosuke Tsukamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...
Publication number
20170229420
Publication date
Aug 10, 2017
Intel Corporation
Mark D. Summers
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20160163632
Publication date
Jun 9, 2016
Siliconware Precision Industries Co., Ltd.
Hsien-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER
Publication number
20160044786
Publication date
Feb 11, 2016
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump Structures for Semiconductor Package
Publication number
20150171038
Publication date
Jun 18, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS