the bump connector connecting to a via connection in the semiconductor or solid-state body

Industry

CPC
H01L2224/16146

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16146the bump connector connecting to a via connection in the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Homogeneous chiplets configurable as a two-dimensional system or a...
- Patent number 12,148,707
- Issue date Nov 19, 2024
- Microsoft Technology Licensing, LLC
- Haohua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with TSV inductor
- Patent number 12,142,633
- Issue date Nov 12, 2024
- Mediatek Inc.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory bandwidth aggregation using simultaneous access of stacked s...
- Patent number 12,131,796
- Issue date Oct 29, 2024
- RAMBUS INC.
- Yohan Frans
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermoelectric cooling packages
- Patent number 12,125,766
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies with molded support substrates
- Patent number 12,119,325
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,080,698
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Dongjoo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,080,701
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for stress sensitive component and semiconductor device
- Patent number 12,074,134
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,074,142
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jongpa Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,051,649
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked memory with interface providing offset interconnects
- Patent number 12,046,577
- Issue date Jul 23, 2024
- Tahoe Research, LTD.
- Pete D. Vogt
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for managing power of ferroelectric or paraele...
- Patent number 12,001,266
- Issue date Jun 4, 2024
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor device with stacking structure
- Patent number 11,996,390
- Issue date May 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...
- Publication number 20240387501
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240379515
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Kyoungok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240379136
- Publication date Nov 14, 2024
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- G11 - INFORMATION STORAGE
Information Patent Application
DIELECTRIC ANCHORS FOR ANCHORING A CONDUCTIVE PILLAR
- Publication number 20240379520
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung Yuan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY WITH INTERFACE PROVIDING OFFSET INTERCONNECTS
- Publication number 20240379625
- Publication date Nov 14, 2024
- Tahoe Research, Ltd.
- Pete D. VOGT
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240371835
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...
- Publication number 20240363605
- Publication date Oct 31, 2024
- QUALCOMM Incorporated
- Darko POPOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
- Publication number 20240355746
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING
- Publication number 20240332252
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED IN-PACKAGE MAIN MEMORY
- Publication number 20240332275
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaesik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
- Publication number 20240321927
- Publication date Sep 26, 2024
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP
- Publication number 20240304504
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Boin NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282749
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240264369
- Publication date Aug 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266309
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT PACKAGE
- Publication number 20240266296
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...
- Publication number 20240257863
- Publication date Aug 1, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH STACKED INTERFACE CHIPLETS
- Publication number 20240258272
- Publication date Aug 1, 2024
- Marvell Asia Pte Ltd.
- Aatreya Chakravarti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243110
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240234400
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20240234255
- Publication date Jul 11, 2024
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a via connection in the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Homogeneous chiplets configurable as a two-dimensional system or a...

Semiconductor package with TSV inductor

Integrated fan-out package and the methods of manufacturing

3D semiconductor device and structure with single-crystal layers

Memory bandwidth aggregation using simultaneous access of stacked s...

3D semiconductor device and structure with metal layers and memory...

Thermoelectric cooling packages

Semiconductor device assemblies with molded support substrates

Offset interposers for large-bottom packages and large-die package-...

Methods for producing a 3D semiconductor device and structure with...

Semiconductor package and method of manufacturing the same

Integrated circuit packages

Through-hole electrode substrate

Semiconductor package

Semiconductor package

Package for stress sensitive component and semiconductor device

Semiconductor package and method of fabricating the same

3D semiconductor device and structure with bonding and DRAM memory...

Close butted collocated variable technology imaging arrays on a sin...

Architecture for computing system package

Stacked memory with interface providing offset interconnects

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Methods for producing a 3D semiconductor device and structure with...

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor devices including through-silicon-vias and methods of...

Advanced device assembly structures and methods

Method and apparatus for managing power of ferroelectric or paraele...

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor device with stacking structure

Semiconductor package

Patents Applicationslast 30 patents

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

MEMORY DEVICE

DIELECTRIC ANCHORS FOR ANCHORING A CONDUCTIVE PILLAR

STACKED MEMORY WITH INTERFACE PROVIDING OFFSET INTERCONNECTS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

STACKED INTEGRATED CIRCUIT DEVICE INCLUDING INTEGRATED CAPACITOR DE...

ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

3D INTEGRATED IN-PACKAGE MAIN MEMORY

IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A TEST BUMP

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

OPTOELECTRONIC PACKAGE

SEMICONDUCTOR DEVICE

PHOTONICS INTEGRATED CIRCUIT PACKAGE

MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...

INTEGRATED CIRCUIT DEVICE WITH STACKED INTERFACE CHIPLETS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...