the bump connector connecting to a via connection in the semiconductor or solid-state body

Industry

CPC
H01L2224/16146

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16146the bump connector connecting to a via connection in the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
- Patent number 11,973,019
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon transmission lines and other structures enabled by...
- Patent number 11,973,057
- Issue date Apr 30, 2024
- Analog Devices, Inc.
- Ed Balboni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package including under-bump metallurgy
- Patent number 11,961,792
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a through-electrode penetrating a m...
- Patent number 11,942,458
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 11,935,837
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G02 - OPTICS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 11,929,338
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with stacking structure
- Patent number 11,901,350
- Issue date Feb 13, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
- Patent number 11,901,299
- Issue date Feb 13, 2024
- Intel Corporation
- Md Altaf Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package RF waveguides as high bandwidth chip-to-chip interconnec...
- Patent number 11,894,324
- Issue date Feb 6, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of operating microelectronic package
- Patent number 11,887,974
- Issue date Jan 30, 2024
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 11,862,610
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with interconnection features in a seal regi...
- Patent number 11,854,987
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV testing method and apparatus
- Patent number 11,835,573
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20240154639
- Publication date May 9, 2024
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20240128309
- Publication date Apr 18, 2024
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112992
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
- Publication number 20240105688
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV TESTING
- Publication number 20240094280
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CIRCUIT
- Publication number 20240094289
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY ROUTING TECHNIQUES
- Publication number 20240096852
- Publication date Mar 21, 2024
- Lodestar Licensing Group, LLC
- Brent Keeth
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096754
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088082
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Sang Ho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...
- Publication number 20240088102
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TSV INDUCTOR
- Publication number 20240079444
- Publication date Mar 7, 2024
- MEDIATEK INC.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20240071874
- Publication date Feb 29, 2024
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071882
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Seongho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...
- Publication number 20240055408
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240055403
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
- Publication number 20240047295
- Publication date Feb 8, 2024
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240047385
- Publication date Feb 8, 2024
- Huawei Technologies Co., Ltd
- Kehan Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI MODULE
- Publication number 20240038726
- Publication date Feb 1, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Koji OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for Computing System Package
- Publication number 20240038669
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20240030117
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030103
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Taeyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...
- Publication number 20240021503
- Publication date Jan 18, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
- Publication number 20240021522
- Publication date Jan 18, 2024
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006382
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Wonjung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS

the bump connector connecting to a via connection in the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Deep trench capacitors in an inter-layer medium on an interconnect...

Through-silicon transmission lines and other structures enabled by...

Semiconductor package dielectric substrate including a trench

Fan-out semiconductor package including under-bump metallurgy

Memories and memory components with interconnected and redundant da...

Semiconductor package including high thermal conductivity layer

Semiconductor package including a through-electrode penetrating a m...

Photonics integrated circuit package

Honeycomb pattern for conductive features

Method for manufacturing semiconductor device having chip stacked a...

LTHC as charging barrier in info package formation

3D semiconductor device and structure with bonding

3D semiconductor device and structure with memory

Method for fabricating semiconductor device with stacking structure

Interconnect architecture with silicon interposer and EMIB

Multilayer substrate

In-package RF waveguides as high bandwidth chip-to-chip interconnec...

Method of operating microelectronic package

Signal delivery in stacked device

Semiconductor device and method of stacking semiconductor die for s...

3D semiconductor device and structure with single-crystal layers

Semiconductor components having conductive vias with aligned back s...

Fan-out packages providing enhanced mechanical strength and methods...

Method for producing a 3D semiconductor device and structure with m...

Semiconductor packages with interconnection features in a seal regi...

Semiconductor die connection system and method

Methods for producing a 3D semiconductor device and structure with...

Semiconductor device and method of manufacturing the same

TSV testing method and apparatus

Patents Applicationslast 30 patents

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...

TSV TESTING

INTERPOSER CIRCUIT

STACKED MEMORY ROUTING TECHNIQUES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...

SEMICONDUCTOR PACKAGE WITH TSV INDUCTOR

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...

SEMICONDUCTOR PACKAGES

3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...

FILTERING STRUCTURE AND ELECTRONIC DEVICE

AI MODULE

Architecture for Computing System Package

MULTI-LEVEL 3D STACKED PACKAGE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...

WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT

SEMICONDUCTOR PACKAGE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...