the chip support structure consisting of a plurality of insulating substrates

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H01L23/49833

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49833the chip support structure consisting of a plurality of insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple conductive posts
- Patent number 11,973,043
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device including the same
- Patent number 11,967,752
- Issue date Apr 23, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Kyung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional IC package with thermal enhancement
- Patent number 11,967,538
- Issue date Apr 23, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,961,795
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package including under-bump metallurgy
- Patent number 11,961,792
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structures and methods for 2.5D and 3D packaging
- Patent number 11,955,431
- Issue date Apr 9, 2024
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including multiple substrates with dif...
- Patent number 11,955,419
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package apparatus and method of fabricating
- Patent number 11,948,877
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of assembly
- Patent number 11,948,878
- Issue date Apr 2, 2024
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,948,852
- Issue date Apr 2, 2024
- ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly using a passive device as a standoff
- Patent number 11,942,405
- Issue date Mar 26, 2024
- ATI Technologies ULC
- Jianguo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration semiconductor package structure
- Patent number 11,942,396
- Issue date Mar 26, 2024
- Industrial Technology Research Institute
- Heng-Chieh Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive thermal management architecture for electronic devices
- Patent number 11,929,297
- Issue date Mar 12, 2024
- Hamilton Sundstrand Corporation
- Hebri Vijayendra Nayak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 11,929,338
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaged optical module
- Patent number 11,923,269
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple interposers on a single substrate
- Patent number 11,923,347
- Issue date Mar 5, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 11,923,283
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Min Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising a semiconductor die with a thermoelect...
- Patent number 11,915,994
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,916,004
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Ching-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor device
- Patent number 11,908,785
- Issue date Feb 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeru Tamari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device assembly
- Patent number 11,908,784
- Issue date Feb 20, 2024
- NXP USA, INC.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with press-fit contacts
- Patent number 11,901,273
- Issue date Feb 13, 2024
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,277
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240136272
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240136263
- Publication date Apr 25, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- Publication number 20240136269
- Publication date Apr 25, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240128157
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240128180
- Publication date Apr 18, 2024
- Hyundai Motor Company
- Myung Ill You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240128249
- Publication date Apr 18, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240120281
- Publication date Apr 11, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120286
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTERCONNECT STRUCTURES
- Publication number 20240113032
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFAC...
- Publication number 20240113004
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- GABRIEL H. LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240113056
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
- Publication number 20240113006
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES
- Publication number 20240113007
- Publication date Apr 4, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105573
- Publication date Mar 28, 2024
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
- Publication number 20240105574
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240105689
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
- Publication number 20240105655
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
- Publication number 20240105688
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- Publication number 20240096732
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096819
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Bong Ken YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR VEHICLE
- Publication number 20240088009
- Publication date Mar 14, 2024
- Hyundai Motor Company
- Jun Hee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
- Publication number 20240088007
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFAC...
- Publication number 20240088008
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED SUBSTRATE STRUCTURE
- Publication number 20240079304
- Publication date Mar 7, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240079356
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

the chip support structure consisting of a plurality of insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coplanar control for film-type thermal interface

Multiple conductive posts

Semiconductor devices and electronic systems including the same

Antenna module and electronic device including the same

Three dimensional IC package with thermal enhancement

Semiconductor package and package-on-package including the same

Semiconductor package and fabricating method thereof

Semiconductor package dielectric substrate including a trench

Fan-out semiconductor package including under-bump metallurgy

Interposer structures and methods for 2.5D and 3D packaging

Semiconductor device package including multiple substrates with dif...

Hybrid package apparatus and method of fabricating

Semiconductor chip package and method of assembly

Semiconductor device package

Semiconductor structure and manufacturing method thereof

Semiconductor package assembly using a passive device as a standoff

Heterogeneous integration semiconductor package structure

Conductive thermal management architecture for electronic devices

Honeycomb pattern for conductive features

Co-packaged optical module

Semiconductor package with multiple interposers on a single substrate

Semiconductor package and method for fabricating the same

Package structure comprising a semiconductor die with a thermoelect...

Varied ball ball-grid-array (BGA) packages

Electronic device

Semiconductor device and methods of manufacturing semiconductor device

Packaged semiconductor device assembly

Power module with press-fit contacts

Semiconductor package system and method

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE

ELECTRONIC PACKAGE

CHIP PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGED INTERCONNECT STRUCTURES

CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFAC...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER

AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES

POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME

REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Semiconductor Device and Method of Stacking Hybrid Substrates with...

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...

SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE

POWER MODULE FOR VEHICLE

POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES

FAN-OUT PACKAGING UNIT USED IN POP PACKAGING AND METHOD FOR MANUFAC...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

MANUFACTURING METHOD OF INTEGRATED SUBSTRATE STRUCTURE

Integrated Circuit Packages and Methods of Forming the Same