the circuit boards having internal via connections between two or more circuit layers before lamination

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CPC
H05K3/4623

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4623the circuit boards having internal via connections between two or more circuit layers before lamination

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board having laminated build-up layers
- Patent number 12,057,381
- Issue date Aug 6, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,052,824
- Issue date Jul 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,004,292
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for removing undesired metal within vias from p...
- Patent number 11,997,800
- Issue date May 28, 2024
- TTM Technologies, Inc.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,956,897
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide liner stress buffer
- Patent number 11,659,660
- Issue date May 23, 2023
- Raytheon Company
- Christine Frandsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a closed cavity printed circuit board with pattern...
- Patent number 11,622,453
- Issue date Apr 4, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,558,961
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jungwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,457,532
- Issue date Sep 27, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,452,214
- Issue date Sep 20, 2022
- HELLA GMBH & CO. KGAA
- Ralf Stanzmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making printed circuit board structure including a closed...
- Patent number 11,445,620
- Issue date Sep 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,399,429
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a backplane circuit board
- Patent number 11,350,530
- Issue date May 31, 2022
- Safran Electronics & Defense
- François Guillot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,310,922
- Issue date Apr 19, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,291,124
- Issue date Mar 29, 2022
- Lincstech Co., Ltd.
- Yuto Tanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,291,123
- Issue date Mar 29, 2022
- SAMWON ACT CO., LTD.
- Kyung Yul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with exposed layer
- Patent number 11,277,907
- Issue date Mar 15, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric filter and method for manufacturing the same
- Patent number 11,228,080
- Issue date Jan 18, 2022
- DUPONT ELECTRONICS, INC.
- Yusuke Tachibana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 11,172,572
- Issue date Nov 9, 2021
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming laminated circuit board
- Patent number 11,122,693
- Issue date Sep 14, 2021
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing high-speed signaling via dedicated printed circuit-boa...
- Patent number 11,076,493
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Douglas A. Baska
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-ceramic composite
- Patent number 11,021,406
- Issue date Jun 1, 2021
- Heraeus Deutschland GmbH & Co. KG
- Kai Herbst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making printed circuit board structure including a closed...
- Patent number 10,986,739
- Issue date Apr 20, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Component Carriers Connected by Staggered Interconnect Elements
- Publication number 20240314931
- Publication date Sep 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING ANTENNA
- Publication number 20240291149
- Publication date Aug 29, 2024
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20240282687
- Publication date Aug 22, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240260181
- Publication date Aug 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240138060
- Publication date Apr 25, 2024
- Huawei Technologies Co., Ltd
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20230328901
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20230189440
- Publication date Jun 15, 2023
- Nitto Denko Corporation
- Kanayo SAWASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141412
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220394859
- Publication date Dec 8, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Component Carrier Interconnection and Manufacturing Method
- Publication number 20220386464
- Publication date Dec 1, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengensellschaft
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220361326
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carriers Connected by Staggered Interconnect Elements
- Publication number 20220256704
- Publication date Aug 11, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220230949
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220061167
- Publication date Feb 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A BACKPLANE CIRCUIT BOARD
- Publication number 20220046807
- Publication date Feb 10, 2022
- SAFRAN ELECTRONICS & DEFENSE
- François GUILLOT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...
- Publication number 20210315110
- Publication date Oct 7, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20210315109
- Publication date Oct 7, 2021
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Exposed Layer
- Publication number 20210144849
- Publication date May 13, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM P...
- Publication number 20210136928
- Publication date May 6, 2021
- TTM TECHNOLOGIES, INC.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXIDE LINER STRESS BUFFER
- Publication number 20210136915
- Publication date May 6, 2021
- Raytheon Company
- Christine Frandsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20200383208
- Publication date Dec 3, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jungwoo CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200365500
- Publication date Nov 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200296827
- Publication date Sep 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE
- Publication number 20200296828
- Publication date Sep 17, 2020
- Hitachi Metals, Ltd.
- Hisashi TANIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20200154566
- Publication date May 14, 2020
- Fujitsu Limited
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC FILTER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200144691
- Publication date May 7, 2020
- DUPONT ELECTRONICS, INC.
- YUSUKE TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the circuit boards having internal via connections between two or more circuit layers before lamination

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board having laminated build-up layers

Component carriers connected by staggered interconnect elements

Resin multilayer substrate and method for manufacturing resin multi...

Methods of forming flexible interconnect circuits

Printed circuit board

Systems and methods for removing undesired metal within vias from p...

Laminated circuit board

Methods of forming interconnect circuits

Semiconductor package device and method of manufacturing the same

Circuit board preparation method

Oxide liner stress buffer

Method of making a closed cavity printed circuit board with pattern...

Printed circuit board

Method of manufacturing circuit board

Printed circuit board

Method of making printed circuit board structure including a closed...

Semiconductor package device

Printed wiring board and method for manufacturing the same

Method for producing a backplane circuit board

Board-to-board connecting structure and method for manufacturing th...

Method for manufacturing multilayer wiring board

Circuit board

Component carrier with exposed layer

Dielectric filter and method for manufacturing the same

Supporting substrate, supporting substrate-attached laminate and me...

Multilayer electronics assembly and method for embedding electrical...

Method for forming laminated circuit board

Implementing high-speed signaling via dedicated printed circuit-boa...

Copper-ceramic composite

Method of making printed circuit board structure including a closed...

Patents Applicationslast 30 patents

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

Component Carriers Connected by Staggered Interconnect Elements

ELECTRONIC DEVICE HAVING ANTENNA

MANUFACTURING METHOD OF CIRCUIT BOARD

Interconnect Circuit Methods And Devices

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

INTERCONNECT CIRCUIT METHODS AND DEVICES

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

Component Carrier Interconnection and Manufacturing Method

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Component Carriers Connected by Staggered Interconnect Elements

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...

METHOD FOR PRODUCING A BACKPLANE CIRCUIT BOARD

METHOD OF MAKING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

Component Carrier With Exposed Layer

SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM P...

OXIDE LINER STRESS BUFFER

PRINTED CIRCUIT BOARD

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CERAMIC SUBSTRATE

WIRING SUBSTRATE AND ELECTRONIC DEVICE

DIELECTRIC FILTER AND METHOD FOR MANUFACTURING THE SAME