the coating being a foil

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H01L23/3164

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/3164the coating being a foil

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D flex-foil package
- Patent number 11,764,122
- Issue date Sep 19, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Robert Faul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with semiconductor die having a low ohmic port...
- Patent number 11,605,572
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and manufacturing method therefor
- Patent number 11,387,210
- Issue date Jul 12, 2022
- Fuji Electric Co., Ltd.
- Takafumi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of packaging
- Patent number 10,373,870
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape containing getter material
- Patent number 10,323,163
- Issue date Jun 18, 2019
- tesa SE
- Klaus Keite-Telgenbüscher
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film for flip chip type semiconductor back surface and its use
- Patent number 10,211,083
- Issue date Feb 19, 2019
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 10,177,111
- Issue date Jan 8, 2019
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible integrated heat spreader
- Patent number 10,177,066
- Issue date Jan 8, 2019
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package
- Patent number 10,043,737
- Issue date Aug 7, 2018
- Novatek Microelectronics Corp.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 9,761,475
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,704,823
- Issue date Jul 11, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,466,585
- Issue date Oct 11, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having EMI shielding and method of fabricatin...
- Patent number 9,368,456
- Issue date Jun 14, 2016
- SK Hynix Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing semiconductor device with film for forming protective...
- Patent number 9,279,064
- Issue date Mar 8, 2016
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Capping coating for 3D integration applications
- Patent number 9,218,956
- Issue date Dec 22, 2015
- GLOBALFOUNDRIES Inc.
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 8,986,486
- Issue date Mar 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, cured prod...
- Patent number 8,963,344
- Issue date Feb 24, 2015
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Overcoming chip warping to enhance wetting of solder bumps and flip...
- Patent number 8,927,334
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping coating for 3D integration applications
- Patent number 8,912,050
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a die
- Patent number 8,907,501
- Issue date Dec 9, 2014
- Infineon Technologies AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing an electronic module, and el...
- Patent number 8,846,456
- Issue date Sep 30, 2014
- Siemens Aktiengesellschaft
- Karl Weidner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capping coating for 3D integration applications
- Patent number 8,778,736
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin film forming sheet for chip, and method for manufacturing sem...
- Patent number 8,735,881
- Issue date May 27, 2014
- Lintec Corporation
- Tomonori Shinoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface
- Patent number 8,704,382
- Issue date Apr 22, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,692,389
- Issue date Apr 8, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Package Having an Electronic Component and an Encapsulant Encapsula...
- Publication number 20230187298
- Publication date Jun 15, 2023
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH RECESSED MEMORY
- Publication number 20220406753
- Publication date Dec 22, 2022
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD
- Publication number 20220344231
- Publication date Oct 27, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL SECURE AND ENCRYPTED SSD DEVICE AND A SECURE OPERATING SYS...
- Publication number 20220108041
- Publication date Apr 7, 2022
- HS SENCDRIVE INC.
- Sergei Semeikin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH INTERNAL THERMAL B...
- Publication number 20220051962
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component with Semiconductor Die Having a Low Ohmic Port...
- Publication number 20210335687
- Publication date Oct 28, 2021
- INFINEON TECHNOLOGIES AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20200294953
- Publication date Sep 17, 2020
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FLEX-FOIL PACKAGE
- Publication number 20200279787
- Publication date Sep 3, 2020
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Robert FAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
- Publication number 20180330966
- Publication date Nov 15, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTEGRATED HEAT SPREADER
- Publication number 20180254234
- Publication date Sep 6, 2018
- Intel Corporation
- Ameya Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING
- Publication number 20180254216
- Publication date Sep 6, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE
- Publication number 20170162487
- Publication date Jun 8, 2017
- NOVATEK MICROELECTRONICS CORP.
- Wen-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...
- Publication number 20150069578
- Publication date Mar 12, 2015
- NXP B.V.
- Hartmut BUENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVIT...
- Publication number 20140246227
- Publication date Sep 4, 2014
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20140178680
- Publication date Jun 26, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140159254
- Publication date Jun 12, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN FILM FORMING SHEET FOR CHIP, AND METHOD FOR MANUFACTURING SEM...
- Publication number 20140141570
- Publication date May 22, 2014
- LINTEC CORPORATION
- Tomonori Shinoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...
- Publication number 20140084453
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging a Die
- Publication number 20140015134
- Publication date Jan 16, 2014
- INFINEON TECHNOLOGIES AG
- Chee Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR FORMING PROTECTIVE LAYER
- Publication number 20130217187
- Publication date Aug 22, 2013
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Resin Film Forming Sheet for Chip, and Method for Manufacturing Sem...
- Publication number 20130011998
- Publication date Jan 10, 2013
- LINTEC CORPORATION
- Tomonori Shinoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120329207
- Publication date Dec 27, 2012
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Coating for 3D Integration Applications
- Publication number 20120329244
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Sampath Purushothaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PRO...
- Publication number 20120289000
- Publication date Nov 15, 2012
- Nitto Denko Corporation
- Goji SHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...
- Publication number 20120261807
- Publication date Oct 18, 2012
- Shingo Itoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM FOR FORMING PROTECTIVE LAYER
- Publication number 20120208009
- Publication date Aug 16, 2012
- Nitto Denko Corporation
- Takashi Oda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120146234
- Publication date Jun 14, 2012
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE SHEET, SEMICONDUCTOR APPARATUS PROTE...
- Publication number 20120108762
- Publication date May 3, 2012
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PRO...
- Publication number 20120028415
- Publication date Feb 2, 2012
- Nitto Denko Corporation
- Goji SHIGA
- H01 - BASIC ELECTRIC ELEMENTS

the coating being a foil

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package having an electronic component and an encapsulant encapsula...

3D flex-foil package

Electronic component with semiconductor die having a low ohmic port...

Semiconductor module and manufacturing method therefor

Method of making fully molded peripheral package on package device

Semiconductor device and method of packaging

Fully molded miniaturized semiconductor module

Adhesive tape containing getter material

Film for flip chip type semiconductor back surface and its use

Power overlay structure and reconstituted semiconductor wafer havin...

Reduction of defects in wafer level chip scale package (WLCSP) devices

Flexible integrated heat spreader

Chip on film package

Film for semiconductor device production, method for producing film...

Reduction of defects in wafer level chip scale package (WLCSP) devices

Power overlay structure having wirebonds and method of manufacturin...

Reducing defects in wafer level chip scale package (WLCSP) devices

Semiconductor package having EMI shielding and method of fabricatin...

Manufacturing semiconductor device with film for forming protective...

Capping coating for 3D integration applications

Film for semiconductor device production, method for producing film...

Epoxy resin composition for semiconductor encapsulation, cured prod...

Overcoming chip warping to enhance wetting of solder bumps and flip...

Capping coating for 3D integration applications

Method of packaging a die

Method and apparatus for manufacturing an electronic module, and el...

Capping coating for 3D integration applications

Resin film forming sheet for chip, and method for manufacturing sem...

Film for flip chip type semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Patents Applicationslast 30 patents

Package Having an Electronic Component and an Encapsulant Encapsula...

MULTI-CHIP PACKAGE WITH RECESSED MEMORY

FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD

EXTERNAL SECURE AND ENCRYPTED SSD DEVICE AND A SECURE OPERATING SYS...

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH INTERNAL THERMAL B...

Electronic Component with Semiconductor Die Having a Low Ohmic Port...

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

3D FLEX-FOIL PACKAGE

FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE

FLEXIBLE INTEGRATED HEAT SPREADER

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

CHIP ON FILM PACKAGE

COMBINATION GRINDING AFTER LASER (GAL) AND LASER ON-OFF FUNCTION TO...

METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVIT...

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

RESIN FILM FORMING SHEET FOR CHIP, AND METHOD FOR MANUFACTURING SEM...

OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...

Method of Packaging a Die

FILM FOR FORMING PROTECTIVE LAYER

Resin Film Forming Sheet for Chip, and Method for Manufacturing Sem...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

Capping Coating for 3D Integration Applications

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PRO...

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PROD...

FILM FOR FORMING PROTECTIVE LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

ADHESIVE COMPOSITION, ADHESIVE SHEET, SEMICONDUCTOR APPARATUS PROTE...

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PRO...