the coating covering also the sidewalls of the semiconductor body

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CPC
H01L23/3185

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3185the coating covering also the sidewalls of the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,972,995
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,439
- Issue date Mar 26, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,935,805
- Issue date Mar 19, 2024
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,923,259
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 11,925,015
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sang-yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first heat spreader and second heat spr...
- Patent number 11,915,991
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and methods of manufac...
- Patent number 11,901,256
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,277
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,279
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,894,287
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including cutting a mo...
- Patent number 11,887,907
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dams
- Patent number 11,881,494
- Issue date Jan 23, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,876,039
- Issue date Jan 16, 2024
- Amkor Technol Singapore Holding Pte. Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,869,863
- Issue date Jan 9, 2024
- Shinko Electric Industries Co., Ltd.
- Takashi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 11,869,875
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,928
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,854,929
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking via structures for stress reduction
- Patent number 11,855,008
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 11,855,029
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20240145327
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...
- Publication number 20240145363
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20240145372
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136328
- Publication date Apr 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136246
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120315
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240112975
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kwang Seok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240113090
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Myoung KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
- Publication number 20240107780
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096642
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20240088100
- Publication date Mar 14, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088124
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240087974
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF
- Publication number 20240087902
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Lung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...
- Publication number 20240088095
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking Via Structures for Stress Reduction
- Publication number 20240088061
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION
- Publication number 20240072442
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240063208
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structure with Warpage Tuning Layer
- Publication number 20240063083
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
- Publication number 20240063180
- Publication date Feb 22, 2024
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20240055313
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
- Publication number 20240047297
- Publication date Feb 8, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240047303
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Kyung Don MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXP...
- Publication number 20240038615
- Publication date Feb 1, 2024
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

the coating covering also the sidewalls of the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing substrate structure with filling material f...

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor devices and related methods

Package structure

Semiconductor package including high thermal conductivity layer

Semiconductor package structure

Package with underfill containment barrier

Package structure and method of manufacturing the same

Vertical memory devices and methods of manufacturing the same

Semiconductor device having first heat spreader and second heat spr...

Semiconductor packages with die including cavities

Semiconductor device, semiconductor package, and methods of manufac...

Semiconductor package and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Backmetal removal methods

Semiconductor package and method of manufacturing the same

Contact pad for semiconductor device

Semiconductor packages with die support structure for thin die

Adhesive and thermal interface material on a plurality of dies cove...

Method of manufacturing semiconductor device including cutting a mo...

Semiconductor package with dams

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Electronic device having a substrate-to-substrate interconnection s...

Semiconductor package using a coreless signal distribution structure

Semiconductor package and manufacturing method thereof

Metal oxide layered structure and methods of forming the same

Semiconductor package and method of forming the same

Stacking via structures for stress reduction

Semiconductor die connection system and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND PO...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

METAL OXIDE LAYERED STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF

FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PA...

Stacking Via Structures for Stress Reduction

PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION

SEMICONDUCTOR PACKAGE AND METHOD

Redistribution Structure with Warpage Tuning Layer

IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES

COATED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER

SEMICONDUCTOR PACKAGE STRUCTURE

STRESS AND WARPAGE IMPROVEMENTS FOR STIFFENER RING PACKAGE WITH EXP...