the complete device being wholly immersed in a fluid other than air

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/44the complete device being wholly immersed in a fluid other than air

Industries

Patents Grantslast 30 patents

Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shrouded powder patch
- Patent number 12,050,061
- Issue date Jul 30, 2024
- Aavid Thermalloy, LLC
- Sukhvinder S. Kang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bellows for immersion cooling
- Patent number 11,997,825
- Issue date May 28, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric liquid immersion cooling container
- Patent number 11,997,826
- Issue date May 28, 2024
- SLICIP, Inc.
- Gary D. Testa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric liquid immersion cooling container
- Patent number 11,943,897
- Issue date Mar 26, 2024
- SLICIP, Inc.
- Gary D. Testa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Localized immersion cooling enclosure
- Patent number 11,917,793
- Issue date Feb 27, 2024
- Cisco Technology, Inc.
- Mark Nowell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Separating temperature domains in cooled systems
- Patent number 11,917,794
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Andrew G. Kegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having a cooling area above and below a semiconductor...
- Patent number 11,778,735
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotary liquid distributor for liquid-cooled tank and liquid-cooled...
- Patent number 11,723,175
- Issue date Aug 8, 2023
- SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
- Qian Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Absorption / desorption processes and systems for liquid immersion...
- Patent number 11,497,140
- Issue date Nov 8, 2022
- TMGCore, Inc.
- John David Enright
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Single-phase immersion cooling system and method of the same
- Patent number 11,412,636
- Issue date Aug 9, 2022
- Cooler Master Co., Ltd.
- Sy chi Kuo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device and electronic device system
- Patent number 11,317,534
- Issue date Apr 26, 2022
- Fujitsu Limited
- Nobuyuki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverter arrangement
- Patent number 11,276,622
- Issue date Mar 15, 2022
- YASA LIMITED
- Simon David Hart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robotics employed in processes and systems for liquid immersion coo...
- Patent number 11,277,938
- Issue date Mar 15, 2022
- TMGCore, Inc.
- John David Enright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting computing system in a liquid hydrogen environment
- Patent number 11,266,038
- Issue date Mar 1, 2022
- Microsoft Technology Licensing, LLC
- Mark Monroe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board, chip cooling housing, assembly and method for coolin...
- Patent number 11,266,012
- Issue date Mar 1, 2022
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional laminated integrated circuit
- Patent number 11,244,887
- Issue date Feb 8, 2022
- Softbank Corp.
- Takashi Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic integrated circuits
- Patent number 11,183,449
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for liquid immersion cooling
- Patent number 11,129,298
- Issue date Sep 21, 2021
- TMGCore, Inc.
- John David Enright
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Memory system with minimized heat generation which includes memory...
- Patent number 11,127,451
- Issue date Sep 21, 2021
- SK Hynix Inc.
- Se-Won Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Enhanced boiling with selective placement of nucleation sites
- Patent number 11,092,391
- Issue date Aug 17, 2021
- Rochester Institute of Technology
- Satish G. Kandlikar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface materials for immersion cooled data storage devices
- Patent number 11,069,383
- Issue date Jul 20, 2021
- Seagate Technology LLC
- Antonia Tsoukatos
- G11 - INFORMATION STORAGE
Information Patent Grant
Physical properties measurement system
- Patent number 11,047,817
- Issue date Jun 29, 2021
- Northrop Grumman Systems Corporation
- Kurt Edward Dietrich
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Absorption/desorption processes and systems for liquid immersion co...
- Patent number 11,013,144
- Issue date May 18, 2021
- TMGCore, LLC
- John David Enright
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Mechanism with folded wrapping to seal components immersed in coolant
- Patent number 10,945,353
- Issue date Mar 9, 2021
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for liquid immersion cooling, system for liquid immersion...
- Patent number 10,888,032
- Issue date Jan 5, 2021
- Fujitsu Limited
- Yukiko Wakino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Arrangement for subsea cooling of semiconductor modules
- Patent number 10,879,150
- Issue date Dec 29, 2020
- ABB Schweiz AG
- Heinz Lendenmann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Self-circulating cooling system
- Patent number 10,847,440
- Issue date Nov 24, 2020
- HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO.,LTD.
- Chih-Hung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BELLOWS FOR IMMERSION COOLING
- Publication number 20240389263
- Publication date Nov 21, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS EMPLOYING FIELD IONIZATION
- Publication number 20240322019
- Publication date Sep 26, 2024
- Psiquantum, Corp.
- Gary Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES
- Publication number 20240321682
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LIQUID IMMERSION COOLING CONTAINER
- Publication number 20240314974
- Publication date Sep 19, 2024
- SLICIP, Inc.
- Gary D. Testa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-SIDED COOLING JACKET
- Publication number 20240087985
- Publication date Mar 14, 2024
- US Hybrid Corporation
- Alex Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240063079
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING ELECTRONIC DEVICES
- Publication number 20240063088
- Publication date Feb 22, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Yongduk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED HEATSINK
- Publication number 20240057303
- Publication date Feb 15, 2024
- YASA LIMITED
- Simon David HART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH-ELECTRON MOBILITY TRANSISTOR
- Publication number 20230327008
- Publication date Oct 12, 2023
- International Business Machines Corporation
- Eunjung Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOMINO LOGIC CIRCUITRY WITH KEEPER TRANSISTORS ON BACKSIDE OF INTEG...
- Publication number 20230318603
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH A METAL CHALCOGENID...
- Publication number 20230317517
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES
- Publication number 20230245950
- Publication date Aug 3, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230245949
- Publication date Aug 3, 2023
- InnoLux Corporation
- Chin-Lung TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230215779
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Hyunggyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR THERMOELECTRIC CHARGING OF A BATTERY
- Publication number 20230140563
- Publication date May 4, 2023
- Moroz Technologies Pty Ltd.
- Paul MOROZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230125822
- Publication date Apr 27, 2023
- Intel Corporation
- Abdulafeez Adebiyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20230019930
- Publication date Jan 19, 2023
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
- Publication number 20220406684
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING PACKAGE
- Publication number 20220406683
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED IMMERSION COOLING ENCLOSURE
- Publication number 20220225537
- Publication date Jul 14, 2022
- Cisco Technology, Inc.
- Mark Nowell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR...
- Publication number 20220183147
- Publication date Jun 9, 2022
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBOTICS EMPLOYED IN PROCESSES AND SYSTEMS FOR LIQUID IMMERSION COO...
- Publication number 20220087048
- Publication date Mar 17, 2022
- TMGCore, Inc.
- John David Enright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC INTEGRATED CIRCUITS
- Publication number 20210366819
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Li Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOILING ENHANCEMENT STRUCTURES FOR IMMERSION COOLED ELECTRONIC SYSTEMS
- Publication number 20210327787
- Publication date Oct 21, 2021
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABSORPTION / DESORPTION PROCESSES AND SYSTEMS FOR LIQUID IMMERSION...
- Publication number 20210274677
- Publication date Sep 2, 2021
- TMGCore, LLC
- John David Enright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABSORPTION/DESORPTION PROCESSES AND SYSTEMS FOR LIQUID IMMERSION CO...
- Publication number 20210022263
- Publication date Jan 21, 2021
- TMGCore, LLC
- John David Enright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL LAMINATED INTEGRATED CIRCUIT
- Publication number 20200402888
- Publication date Dec 24, 2020
- SOFTBANK CORP.
- Takashi TSUTSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING COMPUTING SYSTEM IN A LIQUID HYDROGEN ENVIRONMENT
- Publication number 20200396863
- Publication date Dec 17, 2020
- Microsoft Technology Licensing, LLC
- Mark Monroe
- G06 - COMPUTING CALCULATING COUNTING

the complete device being wholly immersed in a fluid other than air

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Data center rack system with integrated liquid and dielectric immer...

Microelectronic module

Shrouded powder patch

Bellows for immersion cooling

Dielectric liquid immersion cooling container

Dielectric liquid immersion cooling container

Localized immersion cooling enclosure

Separating temperature domains in cooled systems

Methods of manufacturing stacked semiconductor die assemblies with...

Circuit board having a cooling area above and below a semiconductor...

Rotary liquid distributor for liquid-cooled tank and liquid-cooled...

Absorption / desorption processes and systems for liquid immersion...

Single-phase immersion cooling system and method of the same

Cooling device and electronic device system

Inverter arrangement

Robotics employed in processes and systems for liquid immersion coo...

Superconducting computing system in a liquid hydrogen environment

Circuit board, chip cooling housing, assembly and method for coolin...

Three-dimensional laminated integrated circuit

Cryogenic integrated circuits

Process for liquid immersion cooling

Memory system with minimized heat generation which includes memory...

Enhanced boiling with selective placement of nucleation sites

Thermal interface materials for immersion cooled data storage devices

Physical properties measurement system

Absorption/desorption processes and systems for liquid immersion co...

Mechanism with folded wrapping to seal components immersed in coolant

Apparatus for liquid immersion cooling, system for liquid immersion...

Arrangement for subsea cooling of semiconductor modules

Self-circulating cooling system

Patents Applicationslast 30 patents

BELLOWS FOR IMMERSION COOLING

ELECTRONIC COMPONENTS EMPLOYING FIELD IONIZATION

HEAT DISSIPATION STRUCTURES

DIELECTRIC LIQUID IMMERSION COOLING CONTAINER

DUAL-SIDED COOLING JACKET

Package with Improved Heat Dissipation Efficiency and Method for Fo...

IMMERSION COOLING ELECTRONIC DEVICES

SEMICONDUCTOR COOLING ARRANGEMENT WITH IMPROVED HEATSINK

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SEMICONDUCTOR DEVICE WITH HIGH-ELECTRON MOBILITY TRANSISTOR

DOMINO LOGIC CIRCUITRY WITH KEEPER TRANSISTORS ON BACKSIDE OF INTEG...

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH A METAL CHALCOGENID...

HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES

ELECTRONIC DEVICE

SEMICONDUCTOR MODULE

SYSTEM AND METHOD FOR THERMOELECTRIC CHARGING OF A BATTERY

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

IMMERSION DIRECT COOLING MODULES AND RELATED METHODS

IMMERSION COOLING PACKAGE

LOCALIZED IMMERSION COOLING ENCLOSURE

CIRCUIT BOARD HAVING A COOLING AREA ABOVE AND BELOW A SEMICONDUCTOR...

ROBOTICS EMPLOYED IN PROCESSES AND SYSTEMS FOR LIQUID IMMERSION COO...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

CRYOGENIC INTEGRATED CIRCUITS

BOILING ENHANCEMENT STRUCTURES FOR IMMERSION COOLED ELECTRONIC SYSTEMS

ABSORPTION / DESORPTION PROCESSES AND SYSTEMS FOR LIQUID IMMERSION...

ABSORPTION/DESORPTION PROCESSES AND SYSTEMS FOR LIQUID IMMERSION CO...

THREE-DIMENSIONAL LAMINATED INTEGRATED CIRCUIT

SUPERCONDUCTING COMPUTING SYSTEM IN A LIQUID HYDROGEN ENVIRONMENT