the conductive material being removed chemically or electrolytically

Industry

CPC
H05K3/06

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/06the conductive material being removed chemically or electrolytically

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,963,306
- Issue date Apr 16, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for laminating conductive-lubricant coated metals for print...
- Patent number 11,963,309
- Issue date Apr 16, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,957,018
- Issue date Apr 9, 2024
- Innolux Corporation
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing same
- Patent number 11,950,365
- Issue date Apr 2, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Subtractive etch resolution implementing a functional thin metal re...
- Patent number 11,948,848
- Issue date Apr 2, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent conductive circuit
- Patent number 11,943,865
- Issue date Mar 26, 2024
- Chasm Advanced Materials, Inc.
- Richard P. Heroux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic etching using photosensitive compound
- Patent number 11,937,379
- Issue date Mar 19, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board and resist laminate f...
- Patent number 11,937,378
- Issue date Mar 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,917,756
- Issue date Feb 27, 2024
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,917,767
- Issue date Feb 27, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method for manufacturing substrate structure having thick e...
- Patent number 11,895,778
- Issue date Feb 6, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etch chemistry for metallic materials
- Patent number 11,873,564
- Issue date Jan 16, 2024
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemically controlled capillarity to dynamically connect por...
- Patent number 11,855,341
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Samuel Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 11,845,108
- Issue date Dec 19, 2023
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method of directly patterning stretchable substrate and stretchable...
- Patent number 11,839,033
- Issue date Dec 5, 2023
- Korea University Research and Business Foundation
- Soong Ju Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate manufacturing method
- Patent number 11,825,607
- Issue date Nov 21, 2023
- Montage Technology (Kunshan) Co., Ltd.
- Meng Mei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible cable jumper structure, and method for producing same
- Patent number 11,785,713
- Issue date Oct 10, 2023
- AMOGREENTECH CO., LTD.
- Jeong-Sang Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board including metal-containing l...
- Patent number 11,770,903
- Issue date Sep 26, 2023
- Korea Institute of Science and Technology
- Ji Young Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reflectance measurement system and method thereof
- Patent number 11,756,840
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yan-Hong Liu
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of metal structure
- Patent number 11,758,666
- Issue date Sep 12, 2023
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Patterning paste
- Patent number 11,753,561
- Issue date Sep 12, 2023
- PPG Industries Ohio, Inc.
- Paul F. Cheetham
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...
- Publication number 20240134277
- Publication date Apr 25, 2024
- Resonac Corporation
- Yuta DAIJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...
- Publication number 20240121896
- Publication date Apr 11, 2024
- Unimicron Technology Corp.
- Chien Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
- Publication number 20240114627
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240107683
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Etch Chemistry For Metallic Materials
- Publication number 20240102174
- Publication date Mar 28, 2024
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING THROUGH-VIA METAL WIRING
- Publication number 20240080993
- Publication date Mar 7, 2024
- EXTOLCO.,LTD.
- Sung Woong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...
- Publication number 20240074064
- Publication date Feb 29, 2024
- Heraeus Deutschland GmbH & Co. KG
- Richard WACKER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD
- Publication number 20240049396
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20230407486
- Publication date Dec 21, 2023
- MEC COMPANY LTD.
- Yu FUKUI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Manufacturing Ceramic Circuit Board
- Publication number 20230390845
- Publication date Dec 7, 2023
- Kabushiki Kaisha Toshiba
- Akito SASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...
- Publication number 20230389170
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HUAN-YU HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230380071
- Publication date Nov 23, 2023
- InnoLux Corporation
- Hsueh-Hsuan CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE
- Publication number 20230371189
- Publication date Nov 16, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20230360977
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Hong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230337366
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Ji Myoung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...
- Publication number 20230337358
- Publication date Oct 19, 2023
- The Trustees of the University of Pennsylvania
- Alan T. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230309217
- Publication date Sep 28, 2023
- TORAY INDUSTRIES, INC.
- Ryutaro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ETCHING DEVICE AND METHOD FOR IMPROVING ETCHING FACTOR
- Publication number 20230300989
- Publication date Sep 21, 2023
- TEMG TAI PCB MACHINERY CO., LTD.
- PATRICK LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARDS
- Publication number 20230284391
- Publication date Sep 7, 2023
- Gebr. Schmid GmbH
- Christian Buchner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display device
- Publication number 20230276672
- Publication date Aug 31, 2023
- InnoLux Corporation
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230269880
- Publication date Aug 24, 2023
- TOYO KOHAN CO., LTD
- Youhei YOSHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...
- Publication number 20230269881
- Publication date Aug 24, 2023
- DEVICEENG CO., LTD
- Taek Youb LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

the conductive material being removed chemically or electrolytically

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board structure including a closed cavity

Apparatus for manufacturing printed circuit boards

Process for laminating conductive-lubricant coated metals for print...

Display device

Flexible printed circuit board and method of manufacturing same

Subtractive etch resolution implementing a functional thin metal re...

Transparent conductive circuit

Anisotropic etching using photosensitive compound

Method of manufacturing printed circuit board and resist laminate f...

Printed wiring board and method for manufacturing printed wiring board

Apparatus for manufacturing printed circuit boards

Single-layer circuit board, multi-layer circuit board, and manufact...

Etching method for manufacturing substrate structure having thick e...

Etch chemistry for metallic materials

Catalyzed metal foil and uses thereof

Method of manufacturing multilayer substrate

Electrochemically controlled capillarity to dynamically connect por...

Methods for manufacturing ultrasound transducers and other components

Method of directly patterning stretchable substrate and stretchable...

Package substrate manufacturing method

Resist layer forming method, method for manufacturing wiring board,...

Methods for producing an etch resist pattern on a metallic surface

Multilayer coil circuit substrate

Circuit board structure and method for manufacturing a circuit boar...

Flexible cable jumper structure, and method for producing same

Method for manufacturing circuit board including metal-containing l...

Reflectance measurement system and method thereof

Manufacturing method of metal structure

Methods and systems of forming metal interconnect layers using engi...

Patterning paste

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...

CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

PRINTED WIRING BOARD

WIRING CIRCUIT BOARD

Etch Chemistry For Metallic Materials

INTERCONNECT CIRCUIT METHODS AND DEVICES

METHOD FOR FORMING THROUGH-VIA METAL WIRING

METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED MET...

METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD

Method For Manufacturing Ceramic Circuit Board

CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...

ELECTRONIC DEVICE

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

WAFER PROCESSING METHOD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Scalable, Printable, Patterned Sheet Of High Mobility Graphene On F...

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

WIRING BOARD

CIRCUIT BOARD ETCHING DEVICE AND METHOD FOR IMPROVING ETCHING FACTOR

METHOD OF PRODUCING PRINTED CIRCUIT BOARDS

Display device

COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME

DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...