the conductive material being removed mechanically

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CPC
H05K3/04

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/04the conductive material being removed mechanically

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, method for manufacturing substrate, and electronic device
- Patent number 12,114,433
- Issue date Oct 8, 2024
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuitry device manufacturing method
- Patent number 12,089,338
- Issue date Sep 10, 2024
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and structure for alignment of lens to optical product at PC...
- Patent number 11,956,892
- Issue date Apr 9, 2024
- PixArt Imaging Inc.
- Wan Piang Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making metal patterns on flexible substrate
- Patent number 11,950,372
- Issue date Apr 2, 2024
- 3M INNOVATION PROPERTIES
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Clinch mechanism for assembling a printed circuit board with electr...
- Patent number 11,903,137
- Issue date Feb 13, 2024
- Universal Instruments Corporation
- Koenraad Alexander Gieskes
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 11,849,544
- Issue date Dec 19, 2023
- Gentherm GmbH
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Electrically conductive film
- Patent number 11,751,327
- Issue date Sep 5, 2023
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Resistive PCB traces for improved stability
- Patent number 11,723,149
- Issue date Aug 8, 2023
- Kioxia Corporation
- Stephen Pardoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display substrate, method for manufacturing the same and display de...
- Patent number 11,700,688
- Issue date Jul 11, 2023
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Yongchao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing power module substrate board and ceramic-co...
- Patent number 11,676,882
- Issue date Jun 13, 2023
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,665,833
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating edge connector pins of printed circuit boards withou...
- Patent number 11,653,455
- Issue date May 16, 2023
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB-pinout based packaged module and method for preparing PCB-pinou...
- Patent number 11,641,072
- Issue date May 2, 2023
- Huawei Technologies Co., Ltd.
- Weijian Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a double-sided laminate including dry milli...
- Patent number 11,617,270
- Issue date Mar 28, 2023
- Gentherm Incorporated
- Michael Peter Ciaccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducials for laminate structures
- Patent number 11,596,058
- Issue date Feb 28, 2023
- Qorvo US, Inc.
- John August Orlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB structure for embedding electronic components
- Patent number 11,477,892
- Issue date Oct 18, 2022
- University Of Limerick
- John Harris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,467,625
- Issue date Oct 11, 2022
- LG Electronics Inc.
- Jaeuk Ryu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...
- Publication number 20240405345
- Publication date Dec 5, 2024
- Panasonic Energy Co.,Ltd.
- FUMIYA MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PC...
- Publication number 20240206052
- Publication date Jun 20, 2024
- PixArt Imaging Inc.
- Wan Piang LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...
- Publication number 20240206075
- Publication date Jun 20, 2024
- DP Patterning AB
- Staffan Nordlinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
- Publication number 20240206076
- Publication date Jun 20, 2024
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...
- Publication number 20240107680
- Publication date Mar 28, 2024
- HSU-TUNG CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...
- Publication number 20230397332
- Publication date Dec 7, 2023
- JUMATECH GMBH
- Philipp WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380072
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Yi-Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PC...
- Publication number 20230309216
- Publication date Sep 28, 2023
- PixArt Imaging Inc.
- Wan Piang LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20230276578
- Publication date Aug 31, 2023
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20230180396
- Publication date Jun 8, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Drill for Removing Partial Metal Wall of Hole
- Publication number 20230097273
- Publication date Mar 30, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Cheng-Jui Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Resistance on Circuit Board and Circuit Board Ha...
- Publication number 20230093870
- Publication date Mar 30, 2023
- Unimicron Technology Corporation
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
- Publication number 20230007781
- Publication date Jan 5, 2023
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220386467
- Publication date Dec 1, 2022
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20220365554
- Publication date Nov 17, 2022
- LG ELECTRONICS INC.
- Jaeuk RYU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20220312595
- Publication date Sep 29, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM
- Publication number 20220287173
- Publication date Sep 8, 2022
- GENTHERM GMBH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...
- Publication number 20220279659
- Publication date Sep 1, 2022
- NVIDIA Corporation
- Mingyi YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive Compensation for Vertical Interconnect Accesses
- Publication number 20220201857
- Publication date Jun 23, 2022
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES
- Publication number 20220192028
- Publication date Jun 16, 2022
- GENTHERM GMBH
- Jan HORZELLA
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220078922
- Publication date Mar 10, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER INCLUDING AN ELECTRICAL COMPONENT
- Publication number 20210360784
- Publication date Nov 18, 2021
- CONDUCTIVE TRANSFERS LIMITED
- Paul Timothy BROOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR FLOW RATE MEASUREMENT DEVICE
- Publication number 20210348957
- Publication date Nov 11, 2021
- DENSO CORPORATION
- Kengo ITOU
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND PROCESSES FOR FORMING ELECTRICAL CIRCUITRIES ON THREE-D...
- Publication number 20210345494
- Publication date Nov 4, 2021
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

the conductive material being removed mechanically

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive compensation for vertical interconnect accesses

Electrically conductive film

Multilayer printed circuit board

Substrate, method for manufacturing substrate, and electronic device

Flexible circuitry device manufacturing method

Redistribution plate

Electrical devices with electrodes on softening polymers and method...

Methods of forming interconnect circuits

Method and structure for alignment of lens to optical product at PC...

Methods of making metal patterns on flexible substrate

Single-layer circuit board, multi-layer circuit board, and manufact...

Clinch mechanism for assembling a printed circuit board with electr...

Milling of flex foil with two conductive layers from both sides

Electrically conductive film

Dual conductor laminated substrate

Resistive PCB traces for improved stability

Display substrate, method for manufacturing the same and display de...

Method of manufacturing power module substrate board and ceramic-co...

Circuit board and manufacturing method thereof

Electroplating edge connector pins of printed circuit boards withou...

PCB-pinout based packaged module and method for preparing PCB-pinou...

Method of manufacturing a double-sided laminate including dry milli...

Fiducials for laminate structures

Electrical devices with electrodes on softening polymers and method...

Reel-to-reel lamination methods and devices in FPC fabrication

Method for manufacturing flexible circuit board

Redistribution plate

Reel-to-reel laser ablation methods and devices in FPC fabrication

PCB structure for embedding electronic components

Display device

Patents Applicationslast 30 patents

WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...

Interconnect Circuit Methods And Devices

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PC...

A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...

METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...

METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...

TAPE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PC...

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

Method and Drill for Removing Partial Metal Wall of Hole

Method for Forming Resistance on Circuit Board and Circuit Board Ha...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

REDISTRIBUTION PLATE

METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT

DISPLAY DEVICE

SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND ELECTRONIC DEVICE

ELECTRICALLY CONDUCTIVE FILM

ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOU...

Capacitive Compensation for Vertical Interconnect Accesses

MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

TRANSFER INCLUDING AN ELECTRICAL COMPONENT

AIR FLOW RATE MEASUREMENT DEVICE

METHODS AND PROCESSES FOR FORMING ELECTRICAL CIRCUITRIES ON THREE-D...