the conductive materials containing semiconductor material

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H01L23/49872

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49872the conductive materials containing semiconductor material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with die mounted to an insulating substrate an...
- Patent number 12,040,263
- Issue date Jul 16, 2024
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing pad apparatus for through-silicon-vias
- Patent number 11,742,270
- Issue date Aug 29, 2023
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with a metal oxide coating and method of forming the same
- Patent number 11,735,512
- Issue date Aug 22, 2023
- STMICROELECTRONICS INTERNATIONAL N.V.
- Luca Maria Carlo Di Dio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for RF integrated circuit
- Patent number 11,557,539
- Issue date Jan 17, 2023
- MONDE WIRELESS INC.
- Brian Romanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, supporting structure and fabrication method the...
- Patent number 11,527,472
- Issue date Dec 13, 2022
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer including through-silicon via structures with en...
- Patent number 11,456,245
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with in-package compartmental shielding and a...
- Patent number 11,211,340
- Issue date Dec 28, 2021
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with integrated thermally conductive cooling stru...
- Patent number 11,171,070
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Vockenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with stabilizing structure for interface adhesion
- Patent number 11,127,670
- Issue date Sep 21, 2021
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure using silicon interposer as interconnection...
- Patent number 11,088,080
- Issue date Aug 10, 2021
- Powertech Technology Inc.
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 10,879,301
- Issue date Dec 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yusuke Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing the same and power c...
- Patent number 10,777,499
- Issue date Sep 15, 2020
- Mitsubishi Electric Corporation
- Yasuo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensing structure with small curvature radius
- Patent number 10,685,207
- Issue date Jun 16, 2020
- SuperC-Touch Corporation
- Hsiang-Yu Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit structure
- Patent number 10,607,932
- Issue date Mar 31, 2020
- E Ink Holdings Inc.
- Yu-Chieh Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for producing wiring structure
- Patent number 10,573,556
- Issue date Feb 25, 2020
- Hamamatsu Photonics K.K.
- Masaharu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
- Patent number 10,403,591
- Issue date Sep 3, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal silicate spacers for fully aligned vias
- Patent number 10,211,138
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,163,775
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Hideaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relieving through-silicon vias
- Patent number 10,134,635
- Issue date Nov 20, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal silicate spacers for fully aligned vias
- Patent number 10,049,974
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid carbon-metal interconnect structures
- Patent number 10,003,028
- Issue date Jun 19, 2018
- Intel Corporation
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D package having plurality of substrates
- Patent number 9,741,689
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible light emitting semiconductor device
- Patent number 9,716,061
- Issue date Jul 25, 2017
- 3M Innovative Properties Company
- Ravi Palaniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid carbon-metal interconnect structures
- Patent number 9,680,105
- Issue date Jun 13, 2017
- Intel Corporation
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried hard mask for embedded semiconductor device patterning
- Patent number 9,673,206
- Issue date Jun 6, 2017
- Cypress Semiconductor Corporation
- Scott A. Bell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafers, panels, semiconductor devices, and glass treatment methods
- Patent number 9,648,734
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Through substrate vias and device
- Patent number 9,607,915
- Issue date Mar 28, 2017
- Silex Microsystems AB
- Ulf Erlesand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating semiconductor package having an interposer st...
- Patent number 9,548,220
- Issue date Jan 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D package having plurality of substrates
- Patent number 9,425,128
- Issue date Aug 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon vias and interposers formed by metal-catalyzed wet...
- Patent number 9,343,363
- Issue date May 17, 2016
- Semprius, Inc.
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR FOR MEASURING A GAS PROPERTY
- Publication number 20240248071
- Publication date Jul 25, 2024
- INFINEON TECHNOLOGIES AG
- Julia Isabel PEREZ BARRAZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE I...
- Publication number 20240120246
- Publication date Apr 11, 2024
- Meta Platforms Technologies, LLC
- Omar Awartani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND EQUIPMENT
- Publication number 20240006389
- Publication date Jan 4, 2024
- Canon Kabushiki Kaisha
- HIROAKI KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME
- Publication number 20230402364
- Publication date Dec 14, 2023
- STMicroelectronics International N.V.
- Luca Maria Carlo DI DIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Device Power Module Arrangement
- Publication number 20230369256
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR RF INTEGRATED CIRCUIT
- Publication number 20230197611
- Publication date Jun 22, 2023
- MONDE Wireless Inc.
- Brian Romanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20230020959
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE
- Publication number 20220157621
- Publication date May 19, 2022
- Imperial College Innovations Limited
- Maximilian GRELL
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157707
- Publication date May 19, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH METALLIC CAP
- Publication number 20220108930
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20220102258
- Publication date Mar 31, 2022
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...
- Publication number 20210375741
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Ju TSOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20210305148
- Publication date Sep 30, 2021
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING PAD APPARATUS FOR THROUGH-SILICON-VIAS
- Publication number 20210287975
- Publication date Sep 16, 2021
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE USING SILICON INTERPOSER AS INTERCONNECTION...
- Publication number 20210074645
- Publication date Mar 11, 2021
- Powertech Technology Inc.
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier
- Publication number 20200243436
- Publication date Jul 30, 2020
- AT&S (China) Co. Ltd.
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME
- Publication number 20200211953
- Publication date Jul 2, 2020
- STMicroelectronics International N.V.
- Luca Maria Carlo DI DIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND A...
- Publication number 20200168561
- Publication date May 28, 2020
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Integrated Thermally Conductive Cooling Stru...
- Publication number 20190393117
- Publication date Dec 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Christian Vockenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND POWER C...
- Publication number 20190164880
- Publication date May 30, 2019
- Mitsubishi Electric Corporation
- Yasuo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...
- Publication number 20190131265
- Publication date May 2, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSING STRUCTURE WITH SMALL CURVATURE RADIUS
- Publication number 20190095683
- Publication date Mar 28, 2019
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20180366405
- Publication date Dec 20, 2018
- E Ink Holdings Inc.
- Yu-Chieh HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS
- Publication number 20180269144
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS
- Publication number 20180061750
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PA...
- Publication number 20180047589
- Publication date Feb 15, 2018
- EoPlex Limited
- Philip E ROGREN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CARBON-METAL INTERCONNECT STRUCTURES
- Publication number 20170271594
- Publication date Sep 21, 2017
- Intel Corporation
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device, assembly and methods of manufacturing an electro...
- Publication number 20170170131
- Publication date Jun 15, 2017
- Tessera Advanced Technologies, Inc.
- Freddy ROOZEBOOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buried Hard Mask for Embedded Semiconductor Device Patterning
- Publication number 20160300844
- Publication date Oct 13, 2016
- CYPRESS SEMICONDUCTOR CORPORATION
- Scott A. Bell
- H01 - BASIC ELECTRIC ELEMENTS

the conductive materials containing semiconductor material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with die mounted to an insulating substrate an...

Landing pad apparatus for through-silicon-vias

Leadframe with a metal oxide coating and method of forming the same

Semiconductor device for RF integrated circuit

Electronic package, supporting structure and fabrication method the...

Silicon interposer including through-silicon via structures with en...

Semiconductor package with in-package compartmental shielding and a...

Component carrier with integrated thermally conductive cooling stru...

Component carrier with stabilizing structure for interface adhesion

Chip package structure using silicon interposer as interconnection...

Solid-state imaging device

Semiconductor module, method for manufacturing the same and power c...

Fingerprint sensing structure with small curvature radius

Circuit structure

Wiring structure and method for producing wiring structure

Chip package assembly with enhanced interconnects and method for fa...

Metal silicate spacers for fully aligned vias

Electronic device

Stress relieving through-silicon vias

Metal silicate spacers for fully aligned vias

Hybrid carbon-metal interconnect structures

3-D package having plurality of substrates

Flexible light emitting semiconductor device

Hybrid carbon-metal interconnect structures

Buried hard mask for embedded semiconductor device patterning

Wafers, panels, semiconductor devices, and glass treatment methods

Through substrate vias and device

Method of fabricating semiconductor package having an interposer st...

3-D package having plurality of substrates

Through-silicon vias and interposers formed by metal-catalyzed wet...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

SENSOR FOR MEASURING A GAS PROPERTY

CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE I...

SEMICONDUCTOR DEVICE AND EQUIPMENT

LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME

Multi-Device Power Module Arrangement

SEMICONDUCTOR DEVICE FOR RF INTEGRATED CIRCUIT

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE

THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT WITH METALLIC CAP

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

SILICON INTERPOSER INCLUDING THROUGH-SILICON VIA STRUCTURES WITH EN...

ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THE...

LANDING PAD APPARATUS FOR THROUGH-SILICON-VIAS

CHIP PACKAGE STRUCTURE USING SILICON INTERPOSER AS INTERCONNECTION...

Component Carrier

LEADFRAME WITH A METAL OXIDE COATING AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND A...

Component Carrier With Integrated Thermally Conductive Cooling Stru...

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND POWER C...

CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...

FINGERPRINT SENSING STRUCTURE WITH SMALL CURVATURE RADIUS

CIRCUIT STRUCTURE

METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS

METAL SILICATE SPACERS FOR FULLY ALIGNED VIAS

LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PA...

HYBRID CARBON-METAL INTERCONNECT STRUCTURES

Electronic device, assembly and methods of manufacturing an electro...

Buried Hard Mask for Embedded Semiconductor Device Patterning