the conductive materials containing superconducting material

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H01L23/49888

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49888the conductive materials containing superconducting material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum device and method of manufacturing the same
- Patent number 11,871,682
- Issue date Jan 9, 2024
- NEC Corporation
- Kenji Nanba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip with bifunctional routing and associated method of manufacturing
- Patent number 11,823,997
- Issue date Nov 21, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Quantum device including shield part and method of manufacturing th...
- Patent number 11,798,895
- Issue date Oct 24, 2023
- NEC Corporation
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting layers and traces
- Patent number 11,114,602
- Issue date Sep 7, 2021
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Cooling technology for cryogenic link
- Patent number 10,757,835
- Issue date Aug 25, 2020
- RAMBUS INC.
- Frederick A. Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a heat sink coupled to separate ground pl...
- Patent number 10,727,162
- Issue date Jul 28, 2020
- Northrop Grumman Systems Corporation
- Patrick Loney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-noise microwave amplifier utilizing superconductor-insulator-su...
- Patent number 10,680,567
- Issue date Jun 9, 2020
- INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION NATIONAL INSTITUTES OE NATURA...
- Yoshinori Uzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming superconducting apparatus including superconducti...
- Patent number 10,651,362
- Issue date May 12, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermally isolated ground planes with a superconducting electrical...
- Patent number 10,629,535
- Issue date Apr 21, 2020
- Northrop Grumman Systems Corporation
- Patrick Alan Loney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic electronic packages and assemblies
- Patent number 10,586,909
- Issue date Mar 10, 2020
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates with top superconductor layers for qubit devices
- Patent number 10,468,578
- Issue date Nov 5, 2019
- Intel Corporation
- Adel A. Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic electronic packages and methods for fabricating cryogenic...
- Patent number 10,381,541
- Issue date Aug 13, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making cuprate superconducting material
- Patent number 7,135,438
- Issue date Nov 14, 2006
- Lucent Technologies Inc.
- Bertram Josef Batlogg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and systems based on novel superconducting material
- Patent number 6,638,894
- Issue date Oct 28, 2003
- Lucent Technologies Inc.
- Bertram Josef Batlogg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and systems based on novel superconducting material
- Patent number 6,635,603
- Issue date Oct 21, 2003
- Lucent Technologies Inc.
- Bertram Josef Batlogg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and systems based on novel superconducting material
- Patent number 6,630,425
- Issue date Oct 7, 2003
- Lucent Technologies Inc.
- Bertram Josef Batlogg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer glass ceramic module with superconductor wiring
- Patent number 6,096,565
- Issue date Aug 1, 2000
- International Business Machines Corporation
- David B. Goland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic substrate having high TC superconductor circuitry
- Patent number 6,002,951
- Issue date Dec 14, 1999
- International Business Machines Corporation
- David B. Goland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic structure and its preparation
- Patent number 5,849,396
- Issue date Dec 15, 1998
- Hughes Electronics Corporation
- Mir Akbar Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting multilayer ceramic substrate
- Patent number 5,834,405
- Issue date Nov 10, 1998
- International Business Machines Corporation
- Byung Tae Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting multilayer interconnection formed of oxide supercon...
- Patent number 5,811,375
- Issue date Sep 22, 1998
- Sumitomo Electric Industries Ltd.
- Takao Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a high performance low thermal loss bi-temperatur...
- Patent number 5,780,314
- Issue date Jul 14, 1998
- TRW Inc.
- Hugo Wai-Kung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance, low thermal loss, bi-temperature superconductive...
- Patent number 5,773,875
- Issue date Jun 30, 1998
- TRW Inc.
- Hugo Wai-Kung Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
QUANTUM DEVICE
- Publication number 20240234293
- Publication date Jul 11, 2024
- NEC Corporation
- Katsumi KIKUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM DEVICE
- Publication number 20240136274
- Publication date Apr 25, 2024
- NEC Corporation
- Katsumi KIKUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS
- Publication number 20230197539
- Publication date Jun 22, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUPERCONDUCTING STRUCTURES FOR CRYOGENIC ELECTRONICS
- Publication number 20220344240
- Publication date Oct 27, 2022
- Microsoft Technology Licensing, LLC
- Cliff LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS
- Publication number 20220199507
- Publication date Jun 23, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE WITH BIFUNCTIONAL ROUTING AND ASSEMBLY COMPRIS...
- Publication number 20220093500
- Publication date Mar 24, 2022
- Commissariat à L'énergie atomique et aux énergies alternatives,
- Candice THOMAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING
- Publication number 20220093501
- Publication date Mar 24, 2022
- Commissariat à L'énergie atomique et aux énergies alternatives,
- Candice THOMAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407928
- Publication date Dec 30, 2021
- NEC Corporation
- Kenji NANBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING APPARATUS INCLUDING SUPERCONDUCTING LAYERS AND TRACES
- Publication number 20200243743
- Publication date Jul 30, 2020
- Microsoft Technology Licensing, LLC
- Richard P. Rouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC...
- Publication number 20180102469
- Publication date Apr 12, 2018
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA WITH INJECTION MOLDED FILL
- Publication number 20180005887
- Publication date Jan 4, 2018
- International Business Machines Corporation
- DAVID W. ABRAHAM
- H01 - BASIC ELECTRIC ELEMENTS

the conductive materials containing superconducting material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer chips and enclosures for quantum circuits

Quantum device and method of manufacturing the same

Chip with bifunctional routing and associated method of manufacturing

Quantum device including shield part and method of manufacturing th...

Superconducting bump bonds

Superconducting bump bonds

Method of forming superconducting layers and traces

Cooling technology for cryogenic link

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Integrated circuit having a heat sink coupled to separate ground pl...

Low-noise microwave amplifier utilizing superconductor-insulator-su...

Method of forming superconducting apparatus including superconducti...

Thermally isolated ground planes with a superconducting electrical...

Cryogenic electronic packages and assemblies

Superconducting bump bonds

Package substrates with top superconductor layers for qubit devices

Superconducting bump bonds

Cryogenic electronic packages and methods for fabricating cryogenic...

Method of making cuprate superconducting material

Devices and systems based on novel superconducting material

Devices and systems based on novel superconducting material

Devices and systems based on novel superconducting material

Multi-layer glass ceramic module with superconductor wiring

Multi-layer ceramic substrate having high TC superconductor circuitry

Multilayer electronic structure and its preparation

Superconducting multilayer ceramic substrate

Superconducting multilayer interconnection formed of oxide supercon...

Method of forming a high performance low thermal loss bi-temperatur...

High performance, low thermal loss, bi-temperature superconductive...

Patents Applicationslast 30 patents

QUANTUM DEVICE

QUANTUM DEVICE

INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS

MULTILAYER SUPERCONDUCTING STRUCTURES FOR CRYOGENIC ELECTRONICS

MULTI-LAYERED PACKAGING FOR SUPERCONDUCTING QUANTUM CIRCUITS

INTEGRATED STRUCTURE WITH BIFUNCTIONAL ROUTING AND ASSEMBLY COMPRIS...

CHIP WITH BIFUNCTIONAL ROUTING AND ASSOCIATED METHOD OF MANUFACTURING

QUANTUM DEVICE AND METHOD OF MANUFACTURING THE SAME

SUPERCONDUCTING APPARATUS INCLUDING SUPERCONDUCTING LAYERS AND TRACES

CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC...

THROUGH-SILICON VIA WITH INJECTION MOLDED FILL