the connecting portion being a wedge bond

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H01L2224/48478

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48478the connecting portion being a wedge bond

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Patents Grantslast 30 patents

Information Patent Grant
Wire loops, methods of forming wire loops, and related processes
- Patent number 9,455,544
- Issue date Sep 27, 2016
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper on organic solderability preservative (OSP) interconnect and...
- Patent number 8,247,272
- Issue date Aug 21, 2012
- United Test & Assembly Center Ltd.
- Yong Chuan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, interposer chip and manufacturing method of s...
- Patent number 7,622,799
- Issue date Nov 24, 2009
- Renesas Technology Corp.
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE LOOPS, METHODS OF FORMING WIRE LOOPS, AND RELATED PROCESSES
- Publication number 20130125390
- Publication date May 23, 2013
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND...
- Publication number 20100025849
- Publication date Feb 4, 2010
- United Test & Assembly Center Ltd.
- Yong Chuan KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20090294158
- Publication date Dec 3, 2009
- Naoki Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, INTERPOSER CHIP AND MANUFACTURING METHOD OF S...
- Publication number 20070170573
- Publication date Jul 26, 2007
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS