the connecting portions being stacked

Industry

CPC
H01L2224/4941

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4941the connecting portions being stacked

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,929,120
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealing layer covering a semiconducto...
- Patent number 9,543,271
- Issue date Jan 10, 2017
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 9,496,232
- Issue date Nov 15, 2016
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die sensor package
- Patent number 9,134,193
- Issue date Sep 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 9,054,105
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Keun-Ho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency semiconductor device
- Patent number 8,431,973
- Issue date Apr 30, 2013
- Kabushiki Kaisha Toshiba
- Kazutaka Takagi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electrical interconnection for high-frequency devices
- Patent number 7,408,119
- Issue date Aug 5, 2008
- Agilent Technologies, Inc.
- Xiaohui Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for implementing selected functionality on an integrated...
- Patent number 6,897,569
- Issue date May 24, 2005
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for implementing selected functionality on an integrated cir...
- Patent number 6,858,472
- Issue date Feb 22, 2005
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for implementing selected functionality on an integrated...
- Patent number 6,674,177
- Issue date Jan 6, 2004
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for implementing selected functionality on an integrated cir...
- Patent number 6,635,560
- Issue date Oct 21, 2003
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for implementing selected functionality on an integrated...
- Patent number 6,617,692
- Issue date Sep 9, 2003
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for implementing selected functionality on an...
- Patent number 6,472,764
- Issue date Oct 29, 2002
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for implementing selected functionality on an...
- Patent number 6,351,040
- Issue date Feb 26, 2002
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for implementing selected functionality on an...
- Patent number 6,348,400
- Issue date Feb 19, 2002
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip module configuration to simplify testing process and...
- Patent number 6,002,178
- Issue date Dec 14, 1999
- Paul T. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTO...
- Publication number 20160268229
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Manabu MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
- Publication number 20160064344
- Publication date Mar 3, 2016
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SENSOR PACKAGE
- Publication number 20150160087
- Publication date Jun 11, 2015
- Chee Seng Foong
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140008796
- Publication date Jan 9, 2014
- Keun-Ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130093080
- Publication date Apr 18, 2013
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY SEMICONDUCTOR DEVICE
- Publication number 20100140721
- Publication date Jun 10, 2010
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electrical interconnection for high-frequency devices
- Publication number 20050083153
- Publication date Apr 21, 2005
- Xiaohui Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for implementing selected functionality on an integrated cir...
- Publication number 20040038512
- Publication date Feb 26, 2004
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for implementing selected functionality on an integrated...
- Publication number 20040026772
- Publication date Feb 12, 2004
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for implementing selected functionality on an...
- Publication number 20020140111
- Publication date Oct 3, 2002
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for implementing selected functionality on an...
- Publication number 20020031873
- Publication date Mar 14, 2002
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for implementing selected functionality on an...
- Publication number 20020024128
- Publication date Feb 28, 2002
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for implementing selected functionality on an...
- Publication number 20010026022
- Publication date Oct 4, 2001
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS

the connecting portions being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and its manufacturing method

Semiconductor device having a sealing layer covering a semiconducto...

Semiconductor device and its manufacturing method

Stacked die sensor package

Semiconductor package and method for fabricating the same

High frequency semiconductor device

Electrical interconnection for high-frequency devices

Apparatus for implementing selected functionality on an integrated...

Method for implementing selected functionality on an integrated cir...

Apparatus for implementing selected functionality on an integrated...

Method for implementing selected functionality on an integrated cir...

Apparatus for implementing selected functionality on an integrated...

Method and apparatus for implementing selected functionality on an...

Method and apparatus for implementing selected functionality on an...

Method and apparatus for implementing selected functionality on an...

Multiple chip module configuration to simplify testing process and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

STACKED DIE SENSOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

HIGH FREQUENCY SEMICONDUCTOR DEVICE

Electrical interconnection for high-frequency devices

Method for implementing selected functionality on an integrated cir...

Apparatus for implementing selected functionality on an integrated...

Method and apparatus for implementing selected functionality on an...

Method and apparatus for implementing selected functionality on an...

Method and apparatus for implementing selected functionality on an...

Method and apparatus for implementing selected functionality on an...