the connector being supplied to the parts to be connected in the bonding apparatus

Industry

CPC
H01L2224/841

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/841the connector being supplied to the parts to be connected in the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,770,400
- Issue date Sep 8, 2020
- Kabushiki Kaisha Toyota Jidoshokki
- Naoki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip for semiconductor package
- Patent number 10,707,147
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Ariel Sotomayor Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,600,712
- Issue date Mar 24, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yuji Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuit package with conductive clips
- Patent number 10,546,805
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Oscar Paulo Razon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module package and method of manufacturing the same
- Patent number 9,524,929
- Issue date Dec 20, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of semiconductor chips,...
- Patent number 9,460,938
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Hiroyasu Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power converter
- Patent number 9,455,238
- Issue date Sep 27, 2016
- Honda Motor Co., Ltd.
- Asako Yoneguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power unit device
- Patent number 9,129,931
- Issue date Sep 8, 2015
- Mitsubishi Electric Corporation
- Katsuhiko Omae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,076,782
- Issue date Jul 7, 2015
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-spring chip attachment using ribbon bonds
- Patent number 8,614,514
- Issue date Dec 24, 2013
- Palo Alto Research Center Incorporated
- Vernon Powers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked leadframe implementation for DC/DC convertor power module i...
- Patent number 8,450,149
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240105560
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Yasuhiro TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
- Publication number 20230326901
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230049088
- Publication date Feb 16, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265243
- Publication date Aug 26, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS
- Publication number 20210118840
- Publication date Apr 22, 2021
- UTAC Headquarters Pte. Ltd.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS
- Publication number 20190206773
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Oscar Paulo RAZON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140327138
- Publication date Nov 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Hiroyasu Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20140284809
- Publication date Sep 25, 2014
- Honda Motor Co., Ltd.
- Asako YONEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20140084438
- Publication date Mar 27, 2014
- FUJI ELECTRIC CO., LTD.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING APPARATUS
- Publication number 20130284794
- Publication date Oct 31, 2013
- Sanyo Electric Co., Ltd.
- Takashi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Semiconductor Package
- Publication number 20130256852
- Publication date Oct 3, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER UNIT DEVICE
- Publication number 20130241047
- Publication date Sep 19, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Katsuhiko Omae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
- Publication number 20120119343
- Publication date May 17, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS

the connector being supplied to the parts to be connected in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Clip bond semiconductor packages and assembly tools

Semiconductor devices with through silicon vias and package-level c...

Method for electrically contacting a component by galvanic connecti...

Semiconductor device

Semiconductor module

Clip for semiconductor package

Electronic device

Integrated circuit (IC) die attached between an offset lead frame d...

Integrated circuit package with conductive clips

Semiconductor devices with through silicon vias and package-level c...

Semiconductor device having multiple contact clips

Semiconductor module

Semiconductor device and manufacturing method thereof

Semiconductor module package and method of manufacturing the same

Semiconductor device including a plurality of semiconductor chips,...

Power converter

Semiconductor device

Power semiconductor module and power unit device

Semiconductor device and method of manufacturing same

Ultrasonic bonding systems and methods of using the same

Micro-spring chip attachment using ribbon bonds

Stacked leadframe implementation for DC/DC convertor power module i...

Patents Applicationslast 30 patents

APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION

FLEX BONDED INTEGRATED CIRCUITS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

SEMICONDUCTOR DEVICE

CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS

INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS

SEMICONDUCTOR DEVICE

POWER CONVERTER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

SEMICONDUCTOR DEVICE

METAL BONDING APPARATUS

Stacked Semiconductor Package

POWER SEMICONDUCTOR MODULE AND POWER UNIT DEVICE

STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...