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the connectors connecting two common bonding areas

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49111the connectors connecting two common bonding areas
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE INTERCONNECT AND MANUFACTURING METHOD...
    • Publication number 20240387427
    • Publication date Nov 21, 2024
    • NEXPERIA B.V.
    • Siu Lung Ng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH SPEED, EFFICIENT SIC POWER MODULE
    • Publication number 20240380320
    • Publication date Nov 14, 2024
    • Wolfspeed, Inc.
    • Mrinal K. DAS
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240347426
    • Publication date Oct 17, 2024
    • ROHM CO., LTD.
    • Katsuhiro IWAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGES WITH ELECTRICAL FUSES
    • Publication number 20240332243
    • Publication date Oct 3, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Mahmud Halim CHOWDHURY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240321813
    • Publication date Sep 26, 2024
    • Kabushiki Kaisha Toshiba
    • Syotaro Ono
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240312875
    • Publication date Sep 19, 2024
    • Kabushiki Kaisha Toshiba
    • Rie ARIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power Semiconductor Package
    • Publication number 20240304507
    • Publication date Sep 12, 2024
    • Wolfspeed, Inc.
    • Geza Dezsi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240282660
    • Publication date Aug 22, 2024
    • Fuji Electric Co., Ltd.
    • Kenshi TERASHIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CHIP PACKAGING STRUCTURE
    • Publication number 20240282727
    • Publication date Aug 22, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • Chung-Hsiao Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PASSIVE ELEMENT AND ELECTRONIC DEVICE
    • Publication number 20240282866
    • Publication date Aug 22, 2024
    • SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    • Kento KAWASAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SWITCHING DEVICE AND ELECTRONIC CIRCUIT
    • Publication number 20240275373
    • Publication date Aug 15, 2024
    • ROHM CO., LTD.
    • Masashi HAYASHIGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
    • Publication number 20240274557
    • Publication date Aug 15, 2024
    • Mitsubishi Electric Corporation
    • Yo TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    QUANTUM CHIP, QUANTUM DEVICE, AND QUANTUM COMPUTER
    • Publication number 20240243082
    • Publication date Jul 18, 2024
    • NEC Corporation
    • Tomohiro YAMAJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER APPARATUS
    • Publication number 20240203852
    • Publication date Jun 20, 2024
    • SENTEC E&E CO., LTD.
    • Jason HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240170373
    • Publication date May 23, 2024
    • RENESAS ELECTRONICS CORPORATION
    • Hideaki TAMIMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240145413
    • Publication date May 2, 2024
    • SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
    • Makoto NISHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
    • Publication number 20240112993
    • Publication date Apr 4, 2024
    • Infineon Technologies Austria AG
    • Stefan Schwab
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DOCUMENT STRUCTURE FORMATION
    • Publication number 20240105669
    • Publication date Mar 28, 2024
    • INFINEON TECHNOLOGIES AG
    • Jens Pohl
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240030338
    • Publication date Jan 25, 2024
    • Ancora Semiconductors Inc.
    • Li-Fan LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230420428
    • Publication date Dec 28, 2023
    • ROHM CO., LTD.
    • Yuji ISHIMATSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
    • Publication number 20230387808
    • Publication date Nov 30, 2023
    • Power Integrations, Inc.
    • Balu Balakrishnan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230378018
    • Publication date Nov 23, 2023
    • Rohm Co., Ltd.
    • Hajime OKUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR APPARATUS
    • Publication number 20230378038
    • Publication date Nov 23, 2023
    • Rohm Co., Ltd.
    • Masashi HAYASHIGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230369185
    • Publication date Nov 16, 2023
    • Rohm Co., Ltd.
    • Yuto NISHIYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230343735
    • Publication date Oct 26, 2023
    • ROHM CO., LTD.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE
    • Publication number 20230335472
    • Publication date Oct 19, 2023
    • Hitachi Energy Switzerland AG
    • Juergen SCHUDERER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PAR...
    • Publication number 20230326907
    • Publication date Oct 12, 2023
    • Nexperia Technology (Shanghai) Ltd.
    • Wei Gong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
    • Publication number 20230318207
    • Publication date Oct 5, 2023
    • Heraeus Nexensos GmbH
    • Matthias MUZIOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230307430
    • Publication date Sep 28, 2023
    • Kabushiki Kaisha Toshiba
    • Yuning TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SWITCHING DEVICE AND ELECTRONIC CIRCUIT
    • Publication number 20230268914
    • Publication date Aug 24, 2023
    • ROHM CO., LTD.
    • Masashi HAYASHIGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS