the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/043the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package with interposer between integrated circuit dies
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- Issue date Nov 5, 2024
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and measurement method for the package structure
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- Issue date Apr 23, 2024
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- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
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- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices with a cap and molding
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- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
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- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package having security features
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Information Patent Grant
Semiconductor device
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
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- Issue date Feb 21, 2023
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- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a resin case and a wiring member th...
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- Issue date Jan 24, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having control terminal and control substrate
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- Issue date Jan 10, 2023
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- Shin Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unitary housing for electronic device
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Information Patent Grant
Semiconductor package structure
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Information Patent Grant
Semiconductor device package with a cap to selectively exclude cont...
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Information Patent Grant
Customized module lid
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, production method therefor, and automobile
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- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
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- Issue date Jan 4, 2022
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- Kenichi Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and vehicle
- Patent number 11,158,563
- Issue date Oct 26, 2021
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- Hiromichi Gohara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Monolithic, biocompatible feedthrough for hermetically sealed elect...
- Patent number 11,107,703
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- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with inner and outer cavities
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- Issue date Aug 3, 2021
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Information Patent Grant
Method of producing laminated substrate, method of producing semico...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-piece wiring substrate, electronic component housing package,...
- Patent number 10,991,671
- Issue date Apr 27, 2021
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- Yoshitomo Onitsuka
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Information Patent Grant
Wiring board
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Information Patent Grant
Power module and power convertor
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- Issue date Apr 6, 2021
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- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and electronic module
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- Issue date Mar 2, 2021
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- Hiroshi Kawagoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power convertor
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- Issue date Feb 16, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 10,903,134
- Issue date Jan 26, 2021
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,872,851
- Issue date Dec 22, 2020
- Samsung Electronics Co., Ltd.
- Eun Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20240263938
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240194544
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240153887
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- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128136
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- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD
- Publication number 20230411250
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Norihiro DAICHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187290
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Naohiko JOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES
- Publication number 20230170340
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230154808
- Publication date May 18, 2023
- Mitsubishi Electric Corporation
- Masaki KURACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND PACKAGE HO...
- Publication number 20230145380
- Publication date May 11, 2023
- Korea Electronics Technology Institute
- Jong Min YOOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20230060065
- Publication date Feb 23, 2023
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE HAVING SECURITY FEATURES
- Publication number 20220399290
- Publication date Dec 15, 2022
- Raytheon Company
- Jason M. Kehl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220336374
- Publication date Oct 20, 2022
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20220139789
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH METALLIC CAP
- Publication number 20220108930
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20220108931
- Publication date Apr 7, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takashi KITAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220102316
- Publication date Mar 31, 2022
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20220084898
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077022
- Publication date Mar 10, 2022
- Kabushiki Kaisha Toshiba
- Tatsuo TONEDACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220051961
- Publication date Feb 17, 2022
- Fuji Electric Co., Ltd.
- Eri OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE
- Publication number 20210391229
- Publication date Dec 16, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...
- Publication number 20210391226
- Publication date Dec 16, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366795
- Publication date Nov 25, 2021
- Mitsubishi Electric Corporation
- Shin SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210313295
- Publication date Oct 7, 2021
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio Frequency Package Implementing a Window Frame with Edge Plati...
- Publication number 20210280478
- Publication date Sep 9, 2021
- Cree, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210265225
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Heat-Dissipation Package For Compact Electronic Devices
- Publication number 20210225726
- Publication date Jul 22, 2021
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...
- Publication number 20210013051
- Publication date Jan 14, 2021
- Neuralink Corp.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200365526
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package with interposer between integrated circuit dies

Package structure and measurement method for the package structure

Semiconductor device

Semiconductor package structure

Semiconductor devices and methods of manufacturing semiconductor de...

Method of manufacturing electronic devices with a cap and molding

Silicon heat-dissipation package for compact electronic devices

Die package having security features

Semiconductor device

Semiconductor module

Semiconductor device comprising a resin case and a wiring member th...

Semiconductor device having control terminal and control substrate

Semiconductor module

Unitary housing for electronic device

Semiconductor package structure

Semiconductor device package with a cap to selectively exclude cont...

Customized module lid

Semiconductor device, production method therefor, and automobile

Semiconductor module

Power semiconductor module and vehicle

Monolithic, biocompatible feedthrough for hermetically sealed elect...

Semiconductor package with inner and outer cavities

Method of producing laminated substrate, method of producing semico...

Multi-piece wiring substrate, electronic component housing package,...

Wiring board

Power module and power convertor

Wiring substrate, electronic device, and electronic module

Power module and power convertor

Silicon heat-dissipation package for compact electronic devices

Semiconductor package

Patents Applicationslast 30 patents

HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...

A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE STRUCTURE

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

WAVEGUIDE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND PACKAGE HO...

LIDDED SEMICONDUCTOR PACKAGE

DIE PACKAGE HAVING SECURITY FEATURES

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

ELECTRONIC COMPONENT WITH METALLIC CAP

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE

SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Radio Frequency Package Implementing a Window Frame with Edge Plati...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

Silicon Heat-Dissipation Package For Compact Electronic Devices

Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...

SEMICONDUCTOR PACKAGE STRUCTURE