the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

Industry

CPC
H01L23/043

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/043the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and measurement method for the package structure
- Patent number 11,965,731
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,948,895
- Issue date Apr 2, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices with a cap and molding
- Patent number 11,776,860
- Issue date Oct 3, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package having security features
- Patent number 11,688,700
- Issue date Jun 27, 2023
- Raytheon Company
- Jason M. Kehl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,658,151
- Issue date May 23, 2023
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,587,841
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a resin case and a wiring member th...
- Patent number 11,562,977
- Issue date Jan 24, 2023
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having control terminal and control substrate
- Patent number 11,551,983
- Issue date Jan 10, 2023
- Mitsubishi Electric Corporation
- Shin Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,538,727
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unitary housing for electronic device
- Patent number 11,505,131
- Issue date Nov 22, 2022
- Apple Inc.
- Christopher D. Prest
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package structure
- Patent number 11,410,936
- Issue date Aug 9, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with a cap to selectively exclude cont...
- Patent number 11,276,615
- Issue date Mar 15, 2022
- Texas Instruments Incorporated
- Laura May Antoinette Dela Paz Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Customized module lid
- Patent number 11,270,919
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, production method therefor, and automobile
- Patent number 11,251,098
- Issue date Feb 15, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,217,512
- Issue date Jan 4, 2022
- Sumitomo Electric Industries, Ltd.
- Kenichi Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and vehicle
- Patent number 11,158,563
- Issue date Oct 26, 2021
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Monolithic, biocompatible feedthrough for hermetically sealed elect...
- Patent number 11,107,703
- Issue date Aug 31, 2021
- NEURALINK CORP.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with inner and outer cavities
- Patent number 11,081,413
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin Lin Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of producing laminated substrate, method of producing semico...
- Patent number 11,004,807
- Issue date May 11, 2021
- Fuji Electric Co., Ltd.
- Keisuke Yamashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-piece wiring substrate, electronic component housing package,...
- Patent number 10,991,671
- Issue date Apr 27, 2021
- Kyocera Corporation
- Yoshitomo Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,985,087
- Issue date Apr 20, 2021
- NGK Spark Plug Co., Ltd.
- Yosuke Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power convertor
- Patent number 10,971,424
- Issue date Apr 6, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 10,937,707
- Issue date Mar 2, 2021
- Kyocera Corporation
- Hiroshi Kawagoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power convertor
- Patent number 10,923,410
- Issue date Feb 16, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 10,903,134
- Issue date Jan 26, 2021
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,872,851
- Issue date Dec 22, 2020
- Samsung Electronics Co., Ltd.
- Eun Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,825,746
- Issue date Nov 3, 2020
- Fuji Electric Co., Ltd.
- Katsumi Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128136
- Publication date Apr 18, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD
- Publication number 20230411250
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Norihiro DAICHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187290
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Naohiko JOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES
- Publication number 20230170340
- Publication date Jun 1, 2023
- Qorvo US, Inc.
- Matthew Essar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230154808
- Publication date May 18, 2023
- Mitsubishi Electric Corporation
- Masaki KURACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND PACKAGE HO...
- Publication number 20230145380
- Publication date May 11, 2023
- Korea Electronics Technology Institute
- Jong Min YOOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20230060065
- Publication date Feb 23, 2023
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE HAVING SECURITY FEATURES
- Publication number 20220399290
- Publication date Dec 15, 2022
- Raytheon Company
- Jason M. Kehl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220336374
- Publication date Oct 20, 2022
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20220139789
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH METALLIC CAP
- Publication number 20220108930
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20220108931
- Publication date Apr 7, 2022
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takashi KITAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220102316
- Publication date Mar 31, 2022
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20220084898
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077022
- Publication date Mar 10, 2022
- Kabushiki Kaisha Toshiba
- Tatsuo TONEDACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220051961
- Publication date Feb 17, 2022
- Fuji Electric Co., Ltd.
- Eri OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE
- Publication number 20210391229
- Publication date Dec 16, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...
- Publication number 20210391226
- Publication date Dec 16, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210366795
- Publication date Nov 25, 2021
- Mitsubishi Electric Corporation
- Shin SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210313295
- Publication date Oct 7, 2021
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radio Frequency Package Implementing a Window Frame with Edge Plati...
- Publication number 20210280478
- Publication date Sep 9, 2021
- Cree, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210265225
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Heat-Dissipation Package For Compact Electronic Devices
- Publication number 20210225726
- Publication date Jul 22, 2021
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...
- Publication number 20210013051
- Publication date Jan 14, 2021
- Neuralink Corp.
- Vanessa M. Tolosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200365526
- Publication date Nov 19, 2020
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20200321271
- Publication date Oct 8, 2020
- Kenichi SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20200294872
- Publication date Sep 17, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takashi KITAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNITARY HOUSING FOR ELECTRONIC DEVICE
- Publication number 20200269765
- Publication date Aug 27, 2020
- Apple Inc.
- Christopher D. Prest
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, PRODUCTION METHOD THEREFOR, AND AUTOMOBILE
- Publication number 20200266117
- Publication date Aug 20, 2020
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200194360
- Publication date Jun 18, 2020
- Samsung Electronics Co., Ltd.
- Eun Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and measurement method for the package structure

Semiconductor device

Semiconductor package structure

Semiconductor devices and methods of manufacturing semiconductor de...

Method of manufacturing electronic devices with a cap and molding

Silicon heat-dissipation package for compact electronic devices

Die package having security features

Semiconductor device

Semiconductor module

Semiconductor device comprising a resin case and a wiring member th...

Semiconductor device having control terminal and control substrate

Semiconductor module

Unitary housing for electronic device

Semiconductor package structure

Semiconductor device package with a cap to selectively exclude cont...

Customized module lid

Semiconductor device, production method therefor, and automobile

Semiconductor module

Power semiconductor module and vehicle

Monolithic, biocompatible feedthrough for hermetically sealed elect...

Semiconductor package with inner and outer cavities

Method of producing laminated substrate, method of producing semico...

Multi-piece wiring substrate, electronic component housing package,...

Wiring board

Power module and power convertor

Wiring substrate, electronic device, and electronic module

Power module and power convertor

Silicon heat-dissipation package for compact electronic devices

Semiconductor package

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE WITH INTERPOSER BETWEEN INTEGRATED CIRCUIT DIES

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

WAVEGUIDE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND PACKAGE HO...

LIDDED SEMICONDUCTOR PACKAGE

DIE PACKAGE HAVING SECURITY FEATURES

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

ELECTRONIC COMPONENT WITH METALLIC CAP

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE

SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Radio Frequency Package Implementing a Window Frame with Edge Plati...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

Silicon Heat-Dissipation Package For Compact Electronic Devices

Monolithic, Biocompatible Feedthrough for Hermetically Sealed Elect...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

UNITARY HOUSING FOR ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, PRODUCTION METHOD THEREFOR, AND AUTOMOBILE

SEMICONDUCTOR PACKAGE