the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industry

CPC
H01L23/053

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/053the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 12,154,840
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seonho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, and manufacturing...
- Patent number 12,142,540
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion device
- Patent number 12,136,582
- Issue date Nov 5, 2024
- Mitsubishi Electric Corporation
- Yoshinori Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed lid and ring designs and lid local peripheral reinforcemen...
- Patent number 12,119,275
- Issue date Oct 15, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,107,024
- Issue date Oct 1, 2024
- Mitsubishi Electric Corporation
- Takayuki Onaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,631
- Issue date Sep 24, 2024
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic molded package
- Patent number 12,087,678
- Issue date Sep 10, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,068,209
- Issue date Aug 20, 2024
- Siemens Aktiengesellschaft
- Stephan Jonas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,068,289
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Kenichi Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,587
- Issue date Aug 13, 2024
- Mitsubishi Electric Corporation
- Masatake Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 12,057,356
- Issue date Aug 6, 2024
- Kyocera Corporation
- Eiji Kukita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,033,906
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,033,904
- Issue date Jul 9, 2024
- Semiconductor Components Industries, L.L.C.
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having protrusions as fixing structures
- Patent number 12,014,963
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,009,333
- Issue date Jun 11, 2024
- Shinko Electric Industries Co., Ltd.
- Satoshi Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid with integrated heat pipe for t...
- Patent number 12,009,276
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, power semiconductor module arrangement compr...
- Patent number 12,002,740
- Issue date Jun 4, 2024
- Infineon Technologies AG
- Sebastian Michalski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus
- Patent number 11,978,683
- Issue date May 7, 2024
- Sumitomo Electric Industries, Ltd.
- Toru Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having protrusions as fixing structures
- Patent number 11,978,684
- Issue date May 7, 2024
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...
- Publication number 20240429144
- Publication date Dec 26, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A LID OF A HOUSING
- Publication number 20240429181
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VEHICLE
- Publication number 20240404939
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...
- Publication number 20240395652
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240363595
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Kenichi ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332139
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240312852
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
- Publication number 20240312880
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Yusuke KUSAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240304567
- Publication date Sep 12, 2024
- Mitsubishi Electric Corporation
- Aya MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
- Publication number 20240290730
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Sathyanarayanan Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MEMBER AND SEMICONDUCTOR DEVICE
- Publication number 20240258249
- Publication date Aug 1, 2024
- Rohm Co., Ltd.
- Shunsuke Akasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240250015
- Publication date Jul 25, 2024
- Fuji Electric Co., Ltd.
- Katsunori SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
- Publication number 20240249998
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN
- Publication number 20240243076
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240234223
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLY AND METHOD OF PRODUCING THE SAME
- Publication number 20240234224
- Publication date Jul 11, 2024
- INFINEON TECHNOLOGIES AG
- Tomas Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240213177
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213107
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Hiroki HIDAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240203803
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manifold designs for embedded liquid cooling in a package

Fluidic flow channel over active surface of a die

Semiconductor device and semiconductor package having the same

Housing, semiconductor module and methods for producing the same

Stiffener ring combined with ASIC power delivery

Semiconductor device, power conversion apparatus, and manufacturing...

Power module and power conversion device

Recessed lid and ring designs and lid local peripheral reinforcemen...

Package structure with protective lid

Semiconductor device and method of manufacturing semiconductor device

Power module

Semiconductor device

Semiconductor device having heat dissipation structure of curved pr...

Panel molded electronic assemblies with multi-surface conductive co...

Electronic molded package

Power module

Power module

Semiconductor device

Electronic element mounting substrate and electronic device

Chip package with redistribution structure having multiple chips

Semiconductor package and manufacturing method thereof

Semiconductor package system and related methods

Power semiconductor module having protrusions as fixing structures

Semiconductor device

Semiconductor package including lid with integrated heat pipe for t...

Printed circuit board, power semiconductor module arrangement compr...

Fingerprint sensor and manufacturing method thereof

Semiconductor apparatus

Power semiconductor module having protrusions as fixing structures

Multiple die assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...

METHOD FOR FORMING A LID OF A HOUSING

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

SEMICONDUCTOR DEVICE AND VEHICLE

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE

CHIP PACKAGE HAVING MULTIPLE CHIPS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

SEMICONDUCTOR PACKAGE MEMBER AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING

SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

POWER ELECTRONIC ASSEMBLY AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...