the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/053the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,308,297
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned bolster plate and composite back plate for semiconductor...
- Patent number 12,279,395
- Issue date Apr 15, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with annular package lid structure
- Patent number 12,278,150
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device and solid state drive device with structure for impr...
- Patent number 12,277,256
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Insub Kwak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with stiffener
- Patent number 12,272,610
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems with coolant channel for device packaging
- Patent number 12,261,099
- Issue date Mar 25, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including liquid alloy thermal interface material...
- Patent number 12,255,119
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor system, moving body, and method...
- Patent number 12,243,789
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and manufacturing method therefor
- Patent number 12,237,237
- Issue date Feb 25, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 12,165,939
- Issue date Dec 10, 2024
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 12,154,840
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Seonho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, and manufacturing...
- Patent number 12,142,540
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and power conversion device
- Patent number 12,136,582
- Issue date Nov 5, 2024
- Mitsubishi Electric Corporation
- Yoshinori Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed lid and ring designs and lid local peripheral reinforcemen...
- Patent number 12,119,275
- Issue date Oct 15, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,107,024
- Issue date Oct 1, 2024
- Mitsubishi Electric Corporation
- Takayuki Onaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,631
- Issue date Sep 24, 2024
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat dissipation structure of curved pr...
- Patent number 12,094,836
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic molded package
- Patent number 12,087,678
- Issue date Sep 10, 2024
- Ampleon Netherlands B.V.
- Frans Meeuwsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,068,209
- Issue date Aug 20, 2024
- Siemens Aktiengesellschaft
- Stephan Jonas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH RAISED LID ATTACH AREA
- Publication number 20250157864
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Chia-Chun MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS
- Publication number 20250149495
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH MULTIPLE HBM STACKS
- Publication number 20250118719
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Brett P. WILKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Structure with Stress-Release Pattern to Enhance Package Yield
- Publication number 20250118683
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ling CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY
- Publication number 20250118614
- Publication date Apr 10, 2025
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER
- Publication number 20250112206
- Publication date Apr 3, 2025
- Intel Corporation
- Eduardo DE MESA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Integrated Circuit Device Having A Deformable Lid, And Ass...
- Publication number 20250105071
- Publication date Mar 27, 2025
- NXP USA, Inc.
- Jinquan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC PACKAGE HIGH BANDWIDTH RF FEEDTHROUGH
- Publication number 20250096448
- Publication date Mar 20, 2025
- Infinera Corporation
- Jiaming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE
- Publication number 20250096050
- Publication date Mar 20, 2025
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250069962
- Publication date Feb 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Mun Gil Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
- Publication number 20250054819
- Publication date Feb 13, 2025
- Intel Corporation
- Seok Ling LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250022783
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Kousuke KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...
- Publication number 20240429144
- Publication date Dec 26, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A LID OF A HOUSING
- Publication number 20240429181
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VEHICLE
- Publication number 20240404939
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...
- Publication number 20240395652
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371794
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240363595
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Kenichi ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332139
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240312852
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
- Publication number 20240312880
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Yusuke KUSAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240304567
- Publication date Sep 12, 2024
- Mitsubishi Electric Corporation
- Aya MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package system and related methods

Semiconductor package including shielding cover that covers molded...

Semiconductor module and method for manufacturing semiconductor module

Patterned bolster plate and composite back plate for semiconductor...

Hybrid embedded packaging structure and manufacturing method thereof

Semiconductor package with annular package lid structure

Storage device and solid state drive device with structure for impr...

Semiconductor package with stiffener

Embedded cooling systems with coolant channel for device packaging

Semiconductor device package and a method of manufacturing the same

Package assembly including liquid alloy thermal interface material...

Semiconductor device, semiconductor system, moving body, and method...

Semiconductor module and manufacturing method therefor

Semiconductor module

Manifold designs for embedded liquid cooling in a package

Fluidic flow channel over active surface of a die

Semiconductor device and semiconductor package having the same

Housing, semiconductor module and methods for producing the same

Stiffener ring combined with ASIC power delivery

Semiconductor device, power conversion apparatus, and manufacturing...

Power module and power conversion device

Recessed lid and ring designs and lid local peripheral reinforcemen...

Package structure with protective lid

Semiconductor device and method of manufacturing semiconductor device

Power module

Semiconductor device

Semiconductor device having heat dissipation structure of curved pr...

Panel molded electronic assemblies with multi-surface conductive co...

Electronic molded package

Power module

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE WITH RAISED LID ATTACH AREA

SEMICONDUCTOR PACKAGE AND METHODS

CHIP PACKAGE WITH MULTIPLE HBM STACKS

IC Structure with Stress-Release Pattern to Enhance Package Yield

MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY

DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER

Packaged Integrated Circuit Device Having A Deformable Lid, And Ass...

CERAMIC PACKAGE HIGH BANDWIDTH RF FEEDTHROUGH

FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...

METHOD FOR FORMING A LID OF A HOUSING

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

SEMICONDUCTOR DEVICE AND VEHICLE

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MODULE

CHIP PACKAGE HAVING MULTIPLE CHIPS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...