the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industry

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H01L23/053

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/053the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit with wiring board, module, and equipment
- Patent number 11,972,990
- Issue date Apr 30, 2024
- Canon Kabushiki Kaisha
- Satoshi Nozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power unit and semiconductor power module
- Patent number 11,967,536
- Issue date Apr 23, 2024
- SEMIKRON ELEKTRONIK GMBH CO., KG
- Valeriano Cardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lid structure
- Patent number 11,929,293
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including sheilding cover that covers molded...
- Patent number 11,923,319
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,261
- Issue date Mar 5, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Koutarou Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dual stiffener
- Patent number 11,908,758
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with stress reduction design and metho...
- Patent number 11,894,320
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with offset stacked chips and top and...
- Patent number 11,887,908
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method for manufacturing power semicond...
- Patent number 11,887,903
- Issue date Jan 30, 2024
- Mitsubishi Electric Corporation
- Tomonori Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state multi-switch device
- Patent number 11,870,433
- Issue date Jan 9, 2024
- GM Global Technology Operations LLC
- Rashmi Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,862,578
- Issue date Jan 2, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency device comprising semiconductor device and waveguid...
- Patent number 11,854,917
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Ernst Seler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,066
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 11,837,514
- Issue date Dec 5, 2023
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
O-ring seals for fluid sensing
- Patent number 11,837,513
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly and pick-up cap
- Patent number 11,830,780
- Issue date Nov 28, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package unit, package unit, electronic modu...
- Patent number 11,830,722
- Issue date Nov 28, 2023
- Canon Kabushiki Kaisha
- Koichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion device, and method for manuf...
- Patent number 11,830,795
- Issue date Nov 28, 2023
- Mitsubishi Electric Corporation
- Yuji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor devices and methods for manufacturing pressure sens...
- Patent number 11,815,414
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Emanuel Stoicescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluidic flow channel over active surface of a die
- Patent number 11,798,854
- Issue date Oct 24, 2023
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic semiconductor packages
- Patent number 11,784,102
- Issue date Oct 10, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Eakkasit Dumsong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising a lid structure and methods of man...
- Patent number 11,784,101
- Issue date Oct 10, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...
- Publication number 20240145318
- Publication date May 2, 2024
- KYOCERA CORPORATION
- Takuo KISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
O-RING SEALS FOR FLUID SENSING
- Publication number 20240128137
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...
- Publication number 20240120321
- Publication date Apr 11, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112982
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- HIROFUMI MAKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, WIRING STRUCTURE USING WIRING SUBSTRATE, ELECTRON...
- Publication number 20240105600
- Publication date Mar 28, 2024
- Kyocera Corporation
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
- Publication number 20240105528
- Publication date Mar 28, 2024
- KYOCERA CORPORATION
- Takeo SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
- Publication number 20240105639
- Publication date Mar 28, 2024
- Apple Inc.
- Helia Rahmani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE DEVICE
- Publication number 20240105546
- Publication date Mar 28, 2024
- Industrial Technology Research Institute
- Ji-Yuan Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096764
- Publication date Mar 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240087968
- Publication date Mar 14, 2024
- Mitsubishi Electric Corporation
- Yoshitaka KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079349
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DEVICE
- Publication number 20240079281
- Publication date Mar 7, 2024
- NEC Corporation
- Suguru Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071947
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Comprising a First and a Second Compartm...
- Publication number 20240071853
- Publication date Feb 29, 2024
- INFINEON TECHNOLOGIES AG
- Hans Hartung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047318
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047294
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Katsuhiko KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047430
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURI...
- Publication number 20240038610
- Publication date Feb 1, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240038606
- Publication date Feb 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038617
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240006256
- Publication date Jan 4, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Kisho Ashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230420318
- Publication date Dec 28, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE
- Publication number 20230420312
- Publication date Dec 28, 2023
- Illumina, Inc.
- Arvin Emadi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY AND EPOXY SEAL
- Publication number 20230402333
- Publication date Dec 14, 2023
- Qorvo US, Inc.
- MD Hasnine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402334
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...
- Publication number 20230386945
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR T...
- Publication number 20230386960
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS

the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple die assembly

Unit with wiring board, module, and equipment

Electronic power unit and semiconductor power module

Semiconductor assemblies using edge stacking and methods of manufac...

Integrated circuit package lids with polymer features

Semiconductor package with lid structure

Semiconductor package including sheilding cover that covers molded...

Semiconductor device

Semiconductor package including dual stiffener

Semiconductor device package with stress reduction design and metho...

Vented lids for integrated circuit packages

Electronic package structure with offset stacked chips and top and...

Power semiconductor device, method for manufacturing power semicond...

Solid-state multi-switch device

Thermal transfer structures for semiconductor die assemblies

Semiconductor device package and a method of manufacturing the same

Semiconductor package structure

Radio-frequency device comprising semiconductor device and waveguid...

Semiconductor structure and manufacturing method thereof

Semiconductor device and power converter

O-ring seals for fluid sensing

Electrical connector assembly and pick-up cap

Method of manufacturing package unit, package unit, electronic modu...

Semiconductor device, power conversion device, and method for manuf...

Pressure sensor devices and methods for manufacturing pressure sens...

Support structure for MEMS device with particle filter

Fluidic flow channel over active surface of a die

Hermetic semiconductor packages

Semiconductor devices comprising a lid structure and methods of man...

Methods of manufacturing stacked semiconductor die assemblies with...

Patents Applicationslast 30 patents

PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, ELECTRONIC APPARATU...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

O-RING SEALS FOR FLUID SENSING

POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIRING SUBSTRATE, WIRING STRUCTURE USING WIRING SUBSTRATE, ELECTRON...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE

COMPRESSION STRUCTURES FOR IC PACKAGES

MODULE DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE

QUANTUM DEVICE

SEMICONDUCTOR PACKAGE AND METHOD

Power Semiconductor Module Comprising a First and a Second Compartm...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE

SEAL FOR MICROELECTRONIC ASSEMBLY

SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY AND EPOXY SEAL

SEMICONDUCTOR DEVICE

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE A...

SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR T...