the containers being in a stacked arrangement

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CPC
H01L2225/1011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1011the containers being in a stacked arrangement

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution layer
- Patent number 11,935,856
- Issue date Mar 19, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including composite molding structure
- Patent number 11,908,774
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,756,849
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,658,137
- Issue date May 23, 2023
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 11,404,341
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including composite molding structure
- Patent number 11,373,933
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Heeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 11,282,791
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having upper and lower redistribution layers
- Patent number 11,043,464
- Issue date Jun 22, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 10,957,662
- Issue date Mar 23, 2021
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,541,230
- Issue date Jan 21, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuichi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 10,431,477
- Issue date Oct 1, 2019
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with integrated electronic circuits havi...
- Patent number 10,355,337
- Issue date Jul 16, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 10,290,590
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,032,740
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for stackable packaging
- Patent number 9,508,632
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,484,331
- Issue date Nov 1, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with integrated electronic circuits havi...
- Patent number 9,413,055
- Issue date Aug 9, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 9,252,139
- Issue date Feb 2, 2016
- SK Hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal processing device
- Patent number 9,054,078
- Issue date Jun 9, 2015
- Sony Corporation
- Kenichi Kawasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 8,912,659
- Issue date Dec 16, 2014
- SK Hynix Inc.
- Hyeong Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with flip chip and method of ma...
- Patent number 8,766,428
- Issue date Jul 1, 2014
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 8,749,047
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Shintaro Araki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuit packaging system with vertical interconnection a...
- Patent number 8,502,387
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with dual side connection and m...
- Patent number 8,482,115
- Issue date Jul 9, 2013
- Stats Chippac Ltd.
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with stacked semiconductor chips
- Patent number 8,476,738
- Issue date Jul 2, 2013
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with electrode for ext...
- Patent number 8,017,452
- Issue date Sep 13, 2011
- Kyushu Institute of Technology
- Masamichi Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked pre-packaged integrated circuit chips
- Patent number 8,012,803
- Issue date Sep 6, 2011
- Aprolase Development Co., LLC
- Keith Gann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240304583
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20230106826
- Publication date Apr 6, 2023
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220059490
- Publication date Feb 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20210167027
- Publication date Jun 3, 2021
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200111757
- Publication date Apr 9, 2020
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180366432
- Publication date Dec 20, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGE-ON-PACKAGE DEVICE INCLUDING THE SAME...
- Publication number 20160079206
- Publication date Mar 17, 2016
- Yun-rae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A MICRO-FABRICATED WAFER LEVEL INTEGRATED I...
- Publication number 20150340422
- Publication date Nov 26, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH INTEGRATED ELECTRONIC CIRCUITS HAVI...
- Publication number 20140368394
- Publication date Dec 18, 2014
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130292845
- Publication date Nov 7, 2013
- SK HYNIX INC.
- Hyeong Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROCESSING DEVICE
- Publication number 20130205049
- Publication date Aug 8, 2013
- SONY CORPORATION
- Kenichi Kawasaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER MODULE
- Publication number 20120228741
- Publication date Sep 13, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Shintaro ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120199968
- Publication date Aug 9, 2012
- Samsung Electronics Co., Ltd.
- Sang-wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...
- Publication number 20120146235
- Publication date Jun 14, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110317371
- Publication date Dec 29, 2011
- Chien-Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE CONNECTION AND M...
- Publication number 20110291257
- Publication date Dec 1, 2011
- Reza Argenty Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP AND METHOD OF MA...
- Publication number 20110127661
- Publication date Jun 2, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS
- Publication number 20110045635
- Publication date Feb 24, 2011
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...
- Publication number 20100237482
- Publication date Sep 23, 2010
- JoungIn Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXT...
- Publication number 20090050994
- Publication date Feb 26, 2009
- KYUSHU INSTITUTE OF TECHNOLOGY
- Masamichi ISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAY CIRCUIT AND DELAY TIME ADJUSTMENT METHOD
- Publication number 20080297221
- Publication date Dec 4, 2008
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Chip package module
- Publication number 20080230892
- Publication date Sep 25, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED DIE PACKAGE SYSTEM
- Publication number 20070284718
- Publication date Dec 13, 2007
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGING STRUCTURE AND METHOD FOR PRODUCING T...
- Publication number 20070081314
- Publication date Apr 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Seiichi NAKATANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED DIE PACKAGE SYSTEM
- Publication number 20060180914
- Publication date Aug 17, 2006
- STATS ChipPAC Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically stacked pre-packaged integrated circuit chips
- Publication number 20050077621
- Publication date Apr 14, 2005
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component packaging structure and method for producing t...
- Publication number 20040227258
- Publication date Nov 18, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip module
- Publication number 20040159955
- Publication date Aug 19, 2004
- Ming-Tung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked electronic structures including offset substrates
- Publication number 20040124520
- Publication date Jul 1, 2004
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for connecting vertically stacked integrated c...
- Publication number 20030197253
- Publication date Oct 23, 2003
- Keith D. Gann
- H01 - BASIC ELECTRIC ELEMENTS

the containers being in a stacked arrangement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package and package-on-package structure having elliptical columns...

Semiconductor device having a redistribution layer

Semiconductor package including composite molding structure

Package and package-on-package structure having elliptical columns...

Semiconductor package

Package and package-on-package structure having elliptical columns...

Semiconductor package including composite molding structure

Semiconductor device having a heat dissipation structure connected...

Stacked modules

Semiconductor device having upper and lower redistribution layers

Monolithic silicon bridge stack including a hybrid baseband die sup...

Semiconductor package

Semiconductor device and method for manufacturing same

Method of packaging chip and chip package structure

Packaged electronic device with integrated electronic circuits havi...

Stacked semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Apparatus and methods for stackable packaging

Semiconductor device and manufacturing method thereof

Packaged electronic device with integrated electronic circuits havi...

Stacked semiconductor package and method for manufacturing the same

Signal processing device

Stacked semiconductor package and method for manufacturing the same

Integrated circuit packaging system with flip chip and method of ma...

Power module

Integrated circuit packaging system with vertical interconnection a...

Integrated circuit packaging system with dual side connection and m...

Electronic package with stacked semiconductor chips

Method of manufacturing semiconductor device with electrode for ext...

Vertically stacked pre-packaged integrated circuit chips

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Package

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Package

Semiconductor Package

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, PACKAGE-ON-PACKAGE DEVICE INCLUDING THE SAME...

METHOD OF MANUFACTURING A MICRO-FABRICATED WAFER LEVEL INTEGRATED I...

PACKAGED ELECTRONIC DEVICE WITH INTEGRATED ELECTRONIC CIRCUITS HAVI...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SIGNAL PROCESSING DEVICE

POWER MODULE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...

ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDE CONNECTION AND M...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP AND METHOD OF MA...

VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METH...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH ELECTRODE FOR EXT...

DELAY CIRCUIT AND DELAY TIME ADJUSTMENT METHOD

Chip package module

STACKED DIE PACKAGE SYSTEM

ELECTRONIC COMPONENT PACKAGING STRUCTURE AND METHOD FOR PRODUCING T...

STACKED DIE PACKAGE SYSTEM

Vertically stacked pre-packaged integrated circuit chips

Electronic component packaging structure and method for producing t...

Semiconductor chip module

Stacked electronic structures including offset substrates

Method and apparatus for connecting vertically stacked integrated c...