the device being completely enclosed

Industry

CPC
H01L23/3107

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3107the device being completely enclosed

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including parallel electrically conductive la...
- Patent number 12,237,246
- Issue date Feb 25, 2025
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,230,548
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Yuri Kunishige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,230,557
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Sangwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dipped coated electronic module assembly with enhanced thermal dist...
- Patent number 12,232,302
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
- Patent number 12,224,224
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 12,218,036
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including adhesive layer and method for manuf...
- Patent number 12,218,065
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,218,090
- Issue date Feb 4, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic packaging for thermalization of low temperature devices
- Patent number 12,219,737
- Issue date Feb 4, 2025
- International Business Machines Corporation
- Oblesh Jinka
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package and methods of forming the same
- Patent number 12,218,009
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protector cap for package with thermal interface material
- Patent number 12,211,761
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Christian Kasztelan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple substrate package systems and related methods
- Patent number 12,211,775
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,211,704
- Issue date Jan 28, 2025
- Siliconix incorporated
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D MIS-FO hybrid for embedded inductor package structure
- Patent number 12,205,750
- Issue date Jan 21, 2025
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and manufacuring method thereof
- Patent number 12,205,934
- Issue date Jan 21, 2025
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,892
- Issue date Jan 21, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Akio Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,199,019
- Issue date Jan 14, 2025
- Infineon Technologies AG
- Mohamad Yazid Bin Wagiman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,236
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fuse with multi-bond wire
- Patent number 12,191,252
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062266
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyunghwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES
- Publication number 20250062167
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062172
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062257
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...
- Publication number 20250062269
- Publication date Feb 20, 2025
- Micron Technology, Inc.
- Kai Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TAB FOR POWER SEMICONDUCTOR MODULE
- Publication number 20250062270
- Publication date Feb 20, 2025
- LITTELFUSE, INC.
- Thomas Lachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...
- Publication number 20250062300
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054828
- Publication date Feb 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20250054845
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CORE MODULE
- Publication number 20250054850
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250054893
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Artan BAFTIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054896
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250054926
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...
- Publication number 20250046683
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- STEVEN KUMMERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Converter Package with Integrated Inductor
- Publication number 20250046684
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
- Publication number 20250046743
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046676
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...
- Publication number 20250046682
- Publication date Feb 6, 2025
- Huawei Digital Power Technologies Co.,Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250046726
- Publication date Feb 6, 2025
- STATS ChipPAC Pte Ltd.
- MingYu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046671
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS

the device being completely enclosed

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of forming the same

Semiconductor devices including parallel electrically conductive la...

Semiconductor device

Semiconductor package

Semiconductor package and related methods

Semiconductor device and method of forming micro interconnect struc...

Dipped coated electronic module assembly with enhanced thermal dist...

Methods for registration of circuit dies and electrical interconnects

Chip interconnecting method, interconnect device and method for for...

Semiconductor packages with increased power handling

Package structure with metallic layer over the surfaces of a plural...

Package substrate having integrated passive device(s) between leads

Semiconductor package including adhesive layer and method for manuf...

Semiconductor packaging method, semiconductor assembly and electron...

Cryogenic packaging for thermalization of low temperature devices

Semiconductor package and methods of forming the same

Package and method of forming the same

Semiconductor device and method of manufacturing the same

Protector cap for package with thermal interface material

Multiple substrate package systems and related methods

Semiconductor package having side wall plating

3D MIS-FO hybrid for embedded inductor package structure

Electronic component package and manufacuring method thereof

Semiconductor device

Semiconductor package

Electronic package and manufacturing method thereof

Package structure and method for fabricating the same

Semiconductor package

Semiconductor fuse with multi-bond wire

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGES INCLUDING DAM STRUCTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...

METAL TAB FOR POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE HAVING A CORE MODULE

POWER MODULE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR DEVICE

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

Component Carrier and Method of Manufacturing the Same

SEMICONDUCTOR PACKAGE

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGE AND METHOD

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

WIREBOND ELECTROPLATING STRUCTURE FOR FULL CUT WETTABLE FLANK STRUC...

Converter Package with Integrated Inductor

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...

METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...