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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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the devices being encapsulated in a common layer
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Patents Grants
last 30 patents
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Patent Grant
Fan out package with integrated peripheral devices and methods
Patent number
12,362,251
Issue date
Jul 15, 2025
Intel Corporation
Lizabeth Keser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making double shielding layers o...
Patent number
12,362,287
Issue date
Jul 15, 2025
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Basin-shaped underbump plates and methods of forming the same
Patent number
12,362,299
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package geometries to enable visual inspection of solder fillets
Patent number
12,354,918
Issue date
Jul 8, 2025
Texas Instruments Incorporated
LongTing Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass carrier for die-up fan-out packaging and methods for making t...
Patent number
12,354,996
Issue date
Jul 8, 2025
Corning Incorporated
Jin Su Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microdevice integration into system substrate
Patent number
12,349,527
Issue date
Jul 1, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
Patent number
12,341,096
Issue date
Jun 24, 2025
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
12,341,107
Issue date
Jun 24, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yi Seul Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
12,334,474
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Lthc as charging barrier in info package formation
Patent number
12,334,489
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,327,812
Issue date
Jun 10, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing layered device chip assembly
Patent number
12,322,655
Issue date
Jun 3, 2025
Disco Corporation
Shunsuke Teranishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer reconstitution and die-stitching
Patent number
12,322,730
Issue date
Jun 3, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
12,319,564
Issue date
Jun 3, 2025
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Grant
Semiconductor device and method of forming insulating layers around...
Patent number
12,322,725
Issue date
Jun 3, 2025
Semtech Corporation
Satyamoorthi Chinnusamy
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonded structure with interconnect structure
Patent number
12,322,718
Issue date
Jun 3, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
Patent number
12,315,769
Issue date
May 27, 2025
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with improved interposer structure
Patent number
12,308,313
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded product for semiconductor strip and method of manufacturing...
Patent number
12,308,253
Issue date
May 20, 2025
Samsung Electronics Co., Ltd.
Seunghwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming chip packages and a chip package
Patent number
12,293,986
Issue date
May 6, 2025
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method for manufacturing the same
Patent number
12,272,671
Issue date
Apr 8, 2025
Advanced Semiconductor Engineering, Inc.
Chih-Ming Hung
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Integrated devices in semiconductor packages and methods of forming...
Patent number
12,266,619
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package assembly
Patent number
12,266,631
Issue date
Apr 1, 2025
Texas Instruments Incorporated
Rafael Jose Lizares Guevara
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package process and package structure
Patent number
12,266,632
Issue date
Apr 1, 2025
Advanced Semiconductor Engineering, Inc.
Chi-Chih Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out wafer level packaging of semiconductor devices
Patent number
12,261,084
Issue date
Mar 25, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
George Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip integration into cavities of a host wafer using lateral dielec...
Patent number
12,261,091
Issue date
Mar 25, 2025
PseudolithIC, Inc.
Florian Herrault
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable fully molded semiconductor structure with vertical interc...
Patent number
12,261,140
Issue date
Mar 25, 2025
Deca Technologies USA, Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure comprising via structure and redist...
Patent number
12,255,166
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Neng-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226374
Publication date
Jul 10, 2025
Samsung Electronics Co., Ltd.
Yongbum Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Embedded Power Semiconductor Package with Sidewall Contacts
Publication number
20250226293
Publication date
Jul 10, 2025
INFINEON TECHNOLOGIES AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
Publication number
20250226264
Publication date
Jul 10, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
George CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING APPARATUS FOR SEMICONDUCTOR PACKAGING AND SEMICONDUCTO...
Publication number
20250219012
Publication date
Jul 3, 2025
SILICON BOX PTE. LTD.
Byung Joon HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...
Publication number
20250218882
Publication date
Jul 3, 2025
PseudolithIC, Inc.
Florian Herrault
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
Publication number
20250210420
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Bang Li Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHODS FOR A MODULAR HYBRID BONDING PACKAGE ARCHITECTURE
Publication number
20250201795
Publication date
Jun 19, 2025
Samsung Electronics Co., Ltd.
Jin YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250201739
Publication date
Jun 19, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
Publication number
20250192080
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20250192087
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250183194
Publication date
Jun 5, 2025
Samsung Electronics Co., Ltd.
Jingyu BAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
Publication number
20250174531
Publication date
May 29, 2025
NXP USA, Inc.
Namrata Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
Publication number
20250174604
Publication date
May 29, 2025
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250174572
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
Hyun Ung Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
Publication number
20250167180
Publication date
May 22, 2025
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
Publication number
20250167065
Publication date
May 22, 2025
SK HYNIX INC.
Jun Young KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
Publication number
20250167183
Publication date
May 22, 2025
Intel Corporation
David O'SULLIVAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160096
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
Publication number
20250157991
Publication date
May 15, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
Publication number
20250160095
Publication date
May 15, 2025
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
Publication number
20250157941
Publication date
May 15, 2025
Intel Corporation
Bernd Waidhas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
Publication number
20250157974
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Jan PEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING INTEGRATED DEVICE PACKAGES
Publication number
20250157830
Publication date
May 15, 2025
ASMPT SINGAPORE PTE. LTD
Chun Ho FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
Publication number
20250149527
Publication date
May 8, 2025
DAI NIPPON PRINTING CO., LTD.
Satoru KURAMOCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250149415
Publication date
May 8, 2025
JCET Group Co., LTD.
Yun GAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250149475
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Min Seung JI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
Publication number
20250140730
Publication date
May 1, 2025
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...
Publication number
20250140754
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250132278
Publication date
Apr 24, 2025
Advanced Semiconductor Engineering, Inc.
Chih-Jing HSU
H01 - BASIC ELECTRIC ELEMENTS