the devices being encapsulated in a common layer

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/96the devices being encapsulated in a common layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,237,262
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 12,224,268
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-cut lead-frame for integrated circuit (IC) packages
- Patent number 12,224,181
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Tiange Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,218,090
- Issue date Feb 4, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
- Patent number 12,218,101
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including forming cav...
- Patent number 12,205,861
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 12,176,294
- Issue date Dec 24, 2024
- Adeia Semiconductor Bonding Technologies, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,165,941
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,159,850
- Issue date Dec 3, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including electrical redistribution layers o...
- Patent number 12,154,886
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged multi-chip semiconductor devices and methods of fabricatin...
- Patent number 12,132,019
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with patterns of die-specific information
- Patent number 12,131,916
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Federico Pio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out LED packaging structure and method
- Patent number 12,132,036
- Issue date Oct 29, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250062173
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062184
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
- Publication number 20250054831
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION
- Publication number 20250054776
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Federico Pio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250046668
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Gail Edselle S. REYES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250022828
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20250015026
- Publication date Jan 9, 2025
- Samsung Electronics Co., LTD
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
- Publication number 20250015036
- Publication date Jan 9, 2025
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Chia CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES
- Publication number 20250006697
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS
- Publication number 20250006607
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C. MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240395756
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...
- Publication number 20240395568
- Publication date Nov 28, 2024
- Resonac Corporation
- Keisuke NISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240393685
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240395786
- Publication date Nov 28, 2024
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS

the devices being encapsulated in a common layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of forming the same

Integrated circuit package having wirebonded multi-die stack

Semiconductor package with improved interposer structure

Package structure with warpage-control element

Chip interconnecting method, interconnect device and method for for...

Fan-out packages providing enhanced mechanical strength and methods...

Laser-cut lead-frame for integrated circuit (IC) packages

Semiconductor packaging method, semiconductor assembly and electron...

Three-dimensional stacking semiconductor assemblies and methods of...

Manufacturing method of semiconductor package including forming cav...

Semiconductor device and method of manufacture

Method of producing a multi-chip assembly

Method and system for manufacturing a semiconductor package structure

Die package and method of forming a die package

Bonded structure with interconnect structure

Fabricating active-bridge-coupled GPU chiplets

Semiconductor device and method of manufacture

Semiconductor package using cavity substrate and manufacturing methods

Semiconductor package and manufacturing method thereof

Semiconductor packaging method, semiconductor assembly and electron...

Semiconductor packages including electrical redistribution layers o...

Semiconductor device

Embedded chip package and manufacturing method thereof

Shift control method in manufacture of semiconductor device

Semiconductor device and method of forming ultra high density embed...

Packaged multi-chip semiconductor devices and methods of fabricatin...

Semiconductor package and method of manufacturing the same

Semiconductor packages with patterns of die-specific information

Fan-out LED packaging structure and method

Heterogeneous fan-out structure and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...

SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION

Heterogeneous Fan-Out Structure and Method of Manufacture

ELECTRONIC DEVICE

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

LIGHT EMITTING DEVICE

DIE ON DIE BONDING STRUCTURE

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...