the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industry

CPC
H01L25/18

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Receiving a reset signal during a rest period and a ramp signal dur...
- Patent number 12,200,387
- Issue date Jan 14, 2025
- Guangzhou Tyrafos Semiconductor Technologies Co., LTD
- Ping-Hung Yin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 12,197,089
- Issue date Jan 14, 2025
- Samsung Display Co., Ltd.
- Hyo-Chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 12,199,010
- Issue date Jan 14, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Hayata Onaga
- G01 - MEASURING TESTING
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF circuit module and manufacturing method therefor
- Patent number 12,199,083
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki Aoike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,200,982
- Issue date Jan 14, 2025
- Samsung Display Co., Ltd.
- Sun Hwa Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper connected glass modules on a glass board
- Patent number 12,199,007
- Issue date Jan 14, 2025
- BROADCOM INTERNATIONAL PTE. LTD.
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,016
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and semiconductor device
- Patent number 12,199,053
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,199,063
- Issue date Jan 14, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising trenches formed in a substrate
- Patent number 12,198,973
- Issue date Jan 14, 2025
- STMicroelectronics (Rousset) SAS
- Franck Julien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with cavity substrate
- Patent number 12,199,084
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,197,023
- Issue date Jan 14, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel comprising light shielding member on side of optical...
- Patent number 12,200,967
- Issue date Jan 14, 2025
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Yaodong Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor, level shifter circuit, and operation method thereof
- Patent number 12,192,663
- Issue date Jan 7, 2025
- Guangzhou Tyrafos Semiconductor Technologies Co., LTD
- Ping-Hung Yin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,191,294
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer system, memory device formed on a wafer on wafer stack in...
- Patent number 12,189,954
- Issue date Jan 7, 2025
- WHALECHIP CO., LTD.
- Kun-Hua Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heterogeneous integration of radio frequency transistor chiplets ha...
- Patent number 12,191,295
- Issue date Jan 7, 2025
- PseudolithIC, Inc.
- James F. Buckwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including separation patterns and an electroni...
- Patent number 12,193,232
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- JoongShik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and operation method thereof
- Patent number 12,192,664
- Issue date Jan 7, 2025
- Guangzhou Tyrafos Semiconductor Technologies Co., LTD
- Ping-Hung Yin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,193,234
- Issue date Jan 7, 2025
- SK hynix Inc.
- Byung Wook Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of gate contact formation for vertical transistors
- Patent number 12,191,363
- Issue date Jan 7, 2025
- BESANG, INC.
- Sang-Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies including signal redistribution and m...
- Patent number 12,191,235
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,236
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024676
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250022828
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022834
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022866
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sanghyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Insik HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022721
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...
- Publication number 20250022868
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250022867
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Dooho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES
- Publication number 20250022869
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022799
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250024690
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- JEON IL LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20250016985
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, PHOTO-DETECTION SYSTEM, AND MOV...
- Publication number 20250015070
- Publication date Jan 9, 2025
- Canon Kabushiki Kaisha
- Yasuharu Ota
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY
- Publication number 20250014973
- Publication date Jan 9, 2025
- Wolfspeed, Inc.
- Paul WHEELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...
- Publication number 20250015026
- Publication date Jan 9, 2025
- Samsung Electronics Co., LTD
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELEC...
- Publication number 20250017009
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Siyeong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION
- Publication number 20250017026
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250014968
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS
- Publication number 20250017025
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS
- Publication number 20250008750
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006648
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Receiving a reset signal during a rest period and a ramp signal dur...

Display device

Power conversion apparatus

Multi-die package structures including redistribution layers

RF circuit module and manufacturing method therefor

Display device

Copper connected glass modules on a glass board

Semiconductor device

Electronic device and semiconductor device

Microelectronic assemblies

Method of direct-bonded optoelectronic devices

Integrated circuit comprising trenches formed in a substrate

Methods of forming microelectronic device assemblies and packages

Fan-out package with cavity substrate

Multi-chip packaging

Manufacturing optically accessible co-packaged optics

Display panel comprising light shielding member on side of optical...

Image sensor, level shifter circuit, and operation method thereof

Package structure and method of forming the same

Computer system, memory device formed on a wafer on wafer stack in...

Heterogeneous integration of radio frequency transistor chiplets ha...

Semiconductor device including separation patterns and an electroni...

Image sensor and operation method thereof

Embedded cooling systems and methods of manufacturing embedded cool...

Multi-channel gate driver package with grounded shield metal

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Semiconductor memory device and manufacturing method of semiconduct...

Methods of gate contact formation for vertical transistors

Integrated cooling assemblies including signal redistribution and m...

Semiconductor package

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

METHOD OF MAKING A MULTI-CHIP PACKAGE DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES

STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...

DISPLAY APPARATUS

METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

MEMORY CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

Multi-Die Fine Grain Integrated Voltage Regulation

PHOTOELECTRIC CONVERSION APPARATUS, PHOTO-DETECTION SYSTEM, AND MOV...

POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELEC...

3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION

SEMICONDUCTOR DEVICE

METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS

SEMICONDUCTOR DEVICE WITH A THROUGH VIA BETWEEN REDISTRIBUTION LAYERS

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME