the devices having passive surfaces facing each other

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H01L2225/06558

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06558the devices having passive surfaces facing each other

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,087,695
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,672
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,996,345
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die memory device
- Patent number 11,990,177
- Issue date May 21, 2024
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 11,984,426
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 11,967,567
- Issue date Apr 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,848,310
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Won Geol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,830,829
- Issue date Nov 28, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 11,817,423
- Issue date Nov 14, 2023
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,804,457
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,784,166
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 11,756,890
- Issue date Sep 12, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package including a first die coupled to a substrate th...
- Patent number 11,705,432
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-die memory device
- Patent number 11,657,868
- Issue date May 23, 2023
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D package structure for isolated power module and the method thereof
- Patent number 11,652,029
- Issue date May 16, 2023
- Monolithic Power Systems, Inc.
- Hunt Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 11,637,073
- Issue date Apr 25, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication apparatus
- Patent number 11,637,091
- Issue date Apr 25, 2023
- Murata Manufacturing Co., Ltd.
- Sho Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages with EMI shielding, methods of fabr...
- Patent number 11,621,245
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hybrid-bonding structure
- Patent number 11,545,443
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-page display screen and mobile phone including the same
- Patent number 11,495,651
- Issue date Nov 8, 2022
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Haijun Qiu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIE MEMORY DEVICE
- Publication number 20240404580
- Publication date Dec 5, 2024
- Rambus Inc.
- Scott C. Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240347506
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With EMI Shield and Fabricating Method Thereof
- Publication number 20240274547
- Publication date Aug 15, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266246
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...
- Publication number 20240257863
- Publication date Aug 1, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234369
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213168
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240194649
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Geol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20240079379
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- HWANWOOK JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCON...
- Publication number 20240038729
- Publication date Feb 1, 2024
- Intel Corporation
- Pooya TADAYON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20240021523
- Publication date Jan 18, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES
- Publication number 20230420418
- Publication date Dec 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20230361044
- Publication date Nov 9, 2023
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...
- Publication number 20230317677
- Publication date Oct 5, 2023
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178515
- Publication date Jun 8, 2023
- LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
- Xiaolei ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230065884
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING INTERPOSER F...
- Publication number 20230059431
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Krishna VEMURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230026633
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Shiu-Fang YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D PACKAGE STRUCTURE FOR ISOLATED POWER MODULE AND THE METHOD THEREOF
- Publication number 20220415759
- Publication date Dec 29, 2022
- Monolithic Power Systems, Inc.
- Hunt Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH RECESSED MEMORY
- Publication number 20220406753
- Publication date Dec 22, 2022
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING WITH MODIFIED VIA-LAST PROCESS
- Publication number 20220399310
- Publication date Dec 15, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220392870
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367417
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongjin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DIE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220352122
- Publication date Nov 3, 2022
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES
- Publication number 20220302051
- Publication date Sep 22, 2022
- Intel Corporation
- Wilfred GOMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20220278080
- Publication date Sep 1, 2022
- Murata Manufacturing Co., Ltd.
- Sho MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20220254721
- Publication date Aug 11, 2022
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220165673
- Publication date May 26, 2022
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS

the devices having passive surfaces facing each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrating passive devices in package structures

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Package structure and method of forming the same

Package structure and manufacturing method thereof

Multi-die memory device

Semiconductor package

Package structure and manufacturing method thereof

Semiconductor package with EMI shield and fabricating method thereof

Memories and memory components with interconnected and redundant da...

Semiconductor package and method of manufacturing the same

Semiconductor package

Semiconductor device and method of manufacturing thereof

Device, system and method for providing inductor structures

Double-sided substrate with cavities for direct die-to-die intercon...

Package structure and manufacturing method thereof

Semiconductor assemblies including thermal circuits and methods of...

Dual sided fan-out package having low warpage across all temperatures

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Package-on-package assembly with wire bond vias

Stacked die package including a first die coupled to a substrate th...

Multi-die memory device

Hybrid bonding with through substrate via (TSV)

3-D package structure for isolated power module and the method thereof

Semiconductor package with EMI shield and fabricating method thereof

Radio-frequency module and communication apparatus

Microelectronic device packages with EMI shielding, methods of fabr...

Method for forming hybrid-bonding structure

Multi-page display screen and mobile phone including the same

Grounding techniques for backside-biased semiconductor dice and rel...

Patents Applicationslast 30 patents

MULTI-DIE MEMORY DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING PACKAGE STRUCTURE

Semiconductor Package With EMI Shield and Fabricating Method Thereof

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCON...

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICES

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLO...

DOUBLE-SIDED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED DIE INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING INTERPOSER F...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

3-D PACKAGE STRUCTURE FOR ISOLATED POWER MODULE AND THE METHOD THEREOF

MULTI-CHIP PACKAGE WITH RECESSED MEMORY

HYBRID MANUFACTURING WITH MODIFIED VIA-LAST PROCESS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

DUAL DIE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DEVICE, SYSTEM AND METHOD FOR PROVIDING INDUCTOR STRUCTURES

RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF